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    • 8. 发明专利
    • Apparatus and method for removing broaching cutting chip
    • 移除切割切片的装置和方法
    • JP2011156624A
    • 2011-08-18
    • JP2010020831
    • 2010-02-02
    • Mitsubishi Heavy Ind Ltd三菱重工業株式会社
    • FUJITA YOSHIHITOTAKEHANA ISAMU
    • B23Q11/00B23D39/00
    • B23D39/00A46B9/02A46B2200/3073B08B1/04
    • PROBLEM TO BE SOLVED: To provide an apparatus and method for efficiently removing broaching cutting chips attached in a blade groove, by advancing a brush to the innermost part of the blade groove of the broach.
      SOLUTION: Provided is the broaching cutting chip removing apparatus for removing cutting chips from a broach 11 in which cutting blades 12 are provided in multiple steps in its axial direction at even intervals. The apparatus is equipped with: a motor 22 for moving the broach 11 in the axial direction; a brush 33 threadedly planted in the same leads as the pitches of the cutting blades 12, and engaged with blade grooves 13 formed between the cutting blades 12; a motor 41 for rotating the brush 33 about its axial center; and an NC device 51 for controlling the broach moving motor 22 and the brush rotating motor 41 so that the blade grooves 13 and the brush 33 are engaged with each other.
      COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:提供一种用于有效地去除附着在叶片槽中的拉削切屑的装置和方法,通过将刷子推进到拉刀的刀槽的最内部。 解决方案:提供了用于从切割刀11去除切屑的拉削切屑切除装置,其中切割刀片12以均匀间隔在其轴向上以多个步进设置。 该装置配备有用于沿拉杆移动拉刀11的马达22。 刷子33,其以与切割刀片12的间距相同的引线螺纹地植入,并与形成在切割刀片12之间的刀槽13接合; 用于使刷子33绕其轴向中心旋转的马达41; 以及用于控制拉刀移动马达22和刷旋转马达41的NC装置51,使得叶片槽13和刷33彼此接合。 版权所有(C)2011,JPO&INPIT
    • 9. 发明专利
    • Substrate cleaning apparatus
    • 基板清洁装置
    • JP2010003739A
    • 2010-01-07
    • JP2008159034
    • 2008-06-18
    • Tokyo Electron Ltd東京エレクトロン株式会社
    • MORI NOBUHIKOTANAKA AKIRA
    • H01L21/304
    • B08B1/00A46B9/06A46B13/008A46B15/0002A46B15/0006A46B2200/3073H01L21/67046H01L21/67051
    • PROBLEM TO BE SOLVED: To provide a substrate cleaning apparatus capable of effectively removing deposits adhering to a circumferential edge including the end surface of a substrate while using a sponge-like brush.
      SOLUTION: The substrate cleaning apparatus 1 includes: a spin chuck 3 for rotatably holding a substrate W; a motor 4 for rotating the substrate W held in the spin chuck 3; a cleaning liquid supply mechanism 10 for supplying a cleaning liquid to the substrate W held in the spin chuck 3; and a cleaning mechanism 20 having a brush 21 having a circumferential edge cleaning portion 21c contacting the circumferential edge of the substrate W during cleaning, rotating mechanisms 33, 34 for rotating the brush 21 and a pressing mechanism 27 for pressing the brush 21 onto the wafer W. The circumferential edge cleaning portion 21c has a state changing portion 52 whose state changes along a diameter direction so that a cleaning force distribution can be formed in the diameter direction.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供一种使用海绵状刷子能够有效地除去附着在包括基板端面的周缘的沉积物的基板清洗装置。 解决方案:基板清洗装置1包括:用于可旋转地保持基板W的旋转卡盘3; 用于旋转保持在旋转卡盘3中的基板W的马达4; 用于向保持在旋转卡盘3中的基板W供给清洗液的清洗液供给机构10; 以及清洁机构20,其具有在清洁期间具有与基板W的周缘接触的周缘清洁部21c的刷21,用于使刷21旋转的旋转机构33,34和用于将刷21按压到晶片上的按压机构27 周缘清洁部21c具有状态改变部52,其状态沿着直径方向变化,从而能够在直径方向上形成清洁力分布。 版权所有(C)2010,JPO&INPIT