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    • 2. 发明专利
    • Hermetic feed-through with hybrid seal structure
    • 具有混合密封结构的HERMETIC FEED-THROUGH
    • JP2013191567A
    • 2013-09-26
    • JP2013089245
    • 2013-04-22
    • Emerson Electric Coエマーソン エレクトリック カンパニー
    • GABE LAKNERJIAN SUNPRASAD S KHADKIKAR
    • H01R9/16F16J15/06F16J15/10
    • H01R13/521A61N1/3754G11B33/123H01R13/03H01R13/5216H02G3/22Y10T29/49155
    • PROBLEM TO BE SOLVED: To resolve a problem of limited selection of metals for conductive pins and housings, occurring because the performance, cost or design flexibility of a glass or polymer, which has been used as a sealing material in a feed-through to provide electric insulation and to prevent gas permeation, may not be preferred for all purposes, environments or operating conditions.SOLUTION: A power terminal feed-through 10 includes a housing body 12, a plurality of conductive pins 14, and a seal structure that hermetically seals the conductive pins to the housing body and electrically insulates the conductive pins from the housing body. The seal structure includes a first material 28 fused to one of the housing body and the conductive pin, and a second material 30 fused to the other of the housing body and the conductive pin. The first and second materials may be properly chosen to match thermal expansion of the housing body and the conductive pins.
    • 要解决的问题:为了解决用于导电销和壳体的金属选择有限的问题,因为已经用作馈通中的密封材料的玻璃或聚合物的性能,成本或设计灵活性,以提供 电绝缘并防止气体渗透,可能不适用于所有目的,环境或工作条件。解决方案:电源端子馈通10包括壳体主体12,多个导电销14和密封结构 导电销到壳体主体并将导电销与壳体主体电绝缘。 密封结构包括熔合到壳体和导电销中的一个的第一材料28和与壳体和导电销的另一个熔合的第二材料30。 可以适当地选择第一和第二材料以匹配壳体和导电销的热膨胀。