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1. 发明专利

JP2004268988A Packaging method for adhesive hot melt 审中-公开
公开(公告)号：JP2004268988A
公开(公告)日：2004-09-30
申请号：JP2003063111
申请日：2003-03-10
申请人： Yasuhara Chemical Co Ltd , ヤスハラケミカル株式会社
发明人： SAKAKIBARA RYOHEI
IPC分类号： B65B29/00
摘要： PROBLEM TO BE SOLVED: To provide a method for packaging an adhesive hot melt, which raises little blocking, minimizes an amount of impurities, and increases packaging unit weigh, in a relatively simple apparatus. SOLUTION: The method comprises steps of extruding the heat-fused hot melt into a belt shape from a nozzle into water for cooling, taking out a hot melt solid obtained by the cooling from the water for dehydration, forming the belt-like solid in a dried state into a block with its surfaces overlapped with each other by a method of winding the solid into a roll shape or folding the solid to be overlapped or the like, and covering the block with the heat-fused film of a fluxing point measured by DSC preferably of 70 to 130°C to cover the solid. COPYRIGHT: (C)2004,JPO&NCIPI

2. 发明专利

JP2008143975A Heat-conductive hot melt adhesive composition 审中-公开
标题翻译：导热热熔胶组合物
公开(公告)号：JP2008143975A
公开(公告)日：2008-06-26
申请号：JP2006330595
申请日：2006-12-07
申请人： Yasuhara Chemical Co Ltd , ヤスハラケミカル株式会社
发明人： TAKEUCHI SHOJI , SAKAKIBARA RYOHEI , TOCHIGI SHIGETAKE , KONDO HIDEKI , GOTO HIDEO
IPC分类号： C09J201/08 , C09J11/04 , C09J11/08 , C09J153/02
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition excellent in an adhesion property to a glass substrate and an aluminum substrate with high thermal conductivity and high heat-resistance and capable of further attaining enhancement of productivity by direct coating on a heat generation body or a heat release body with it.
SOLUTION: If the thermal conductive hot melt adhesive composition with heat-resistance containing an acid anhydride-modified thermoplastic resin and a thermal conductivity giving agent, and having a melt viscosity of 10,000-3,000,000 mPa s at 200°C, a thermal conductivity of 0.4 W/mK or higher, and a peeling off strength relative to the glass substrate or the aluminum substrate of 200 N/m or higher is utilized, enhancement of productivity is attained by direct coating on the heat generation body or the heat release body.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种粘合性优异的粘合性组合物，其具有高导热性和高耐热性的玻璃基板和铝基板，并且能够通过直接涂覆在发热上进一步提高生产率身体或放热体。解决方案：如果含有酸酐改性的热塑性树脂和导热性赋予剂，并且在200℃下具有10,000-3,000,000mPa·s的熔体粘度的具有耐热性的导热热熔性粘合剂组合物，导电率为0.4W / mK以上，相对于玻璃基板或铝基板的剥离强度为200N / m以上，通过在发热体上直接涂布或散热来提高生产率身体。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2007051195A Rubber-based curable type hot melt adhesive composition 有权
标题翻译：基于橡胶的可固化型热熔胶组合物
公开(公告)号：JP2007051195A
公开(公告)日：2007-03-01
申请号：JP2005236465
申请日：2005-08-17
申请人： Yasuhara Chemical Co Ltd , ヤスハラケミカル株式会社
发明人： GOTO HIDEO , SAKAKIBARA RYOHEI , TOCHIGI SHIGETAKE , KAWAGUCHI MASANORI
IPC分类号： C09J121/00 , C09J11/06 , C09J153/00 , C09J153/02 , C09J163/00
摘要： PROBLEM TO BE SOLVED: To provide a one pot type curable hotmelt adhesive without having an environmental problem of a solvent-based curable type adhesive, without having an inconvenience on handling and economical irrationality of disposing the adhesive before and after the processing of a moisture curable type polyurethane-based hotmelt adhesive or conventional two-pot type curable hotmelt adhesive.
SOLUTION: This rubber-based curable type hot melt adhesive is provided by adding a curing accelerator (F) on the surface of applied material of the hotmelt composition containing an epoxy resin, for reacting from the surface to impart heat resistance to the same.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种罐式可固化热熔粘合剂，而不会引起溶剂型可固化型粘合剂的环境问题，而不会在操作上造成不便，并且在处理之前和之后处理粘合剂的经济不合理性可湿固化型聚氨酯系热熔粘合剂或常规的双罐型可固化热熔粘合剂。解决方案：该橡胶类固化型热熔性粘合剂是通过在含有环氧树脂的热熔组合物的涂布材料的表面上添加固化促进剂（F），从表面反应而赋予耐热性相同。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2007112888A Polymer micro-particle of spherical to spheroidal shape with smooth surface 审中-公开
标题翻译：球形微球与具有平滑表面的SPHEROIDAL形状
公开(公告)号：JP2007112888A
公开(公告)日：2007-05-10
申请号：JP2005305117
申请日：2005-10-20
申请人： Sansaara Corporation:Kk , Yasuhara Chemical Co Ltd , ヤスハラケミカル株式会社 , 有限会社サンサーラコーポレーション
发明人： KONDO HIDEKI , SAKAKIBARA RYOHEI , MIZUKAMI YOSHIKATSU
IPC分类号： C08J3/14 , A61K8/18 , A61K8/72 , A61Q1/02 , C08L23/00
摘要： PROBLEM TO BE SOLVED: To provide a simple method for producing a thermoplastic polymer for inexpensively feeding polymer micro-particles having a narrow particle size distribution breadth and ≤50 μm average particle diameter using a general-purpose polymer as a raw material without relying on the degree of polymerization.
SOLUTION: The micro-particles are composed of a thermoplastic addition polymer containing a raw material of an unsaturated compound which is a gas at normal temperature and having ≥10,000 molecular weight or are composed of a thermoplastic polycondensate and have ≤50 μm average particle diameter, a narrow particle size breadth and a spherical to a spheroidal shape with a smooth surface. In the micro-particles, the raw material of the unsaturated compound which is the gas at normal temperature is preferably at least one kind of ethylene, propylene, isopropylene and butylene. The micro-particles are used for light scattering for diffusion films, a slippery effective agent for cosmetics and an anti-blocking agent. The method for producing the polymer micro-particles comprises cooling and solidifying a system in which a molten polymer and a dispersion medium form a metastable emulsion under shear stress in a state maintaining the emulsion.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：待解决的问题：为了提供一种制造热塑性聚合物的简单方法，该方法是以通用聚合物作为原料廉价地供给具有窄的粒度分布宽度和≤50μm平均粒径的聚合物微粒，而没有依靠聚合度。解决方案：微粒由含有不饱和化合物的原料的热塑性加成聚合物构成，该原料为常温下的气体，分子量≥10,000，或由热塑性缩聚物构成，平均粒径≤50μm 颗粒直径，窄粒径宽度和球形至球状，具有光滑表面。在微粒中，作为常温下的气体的不饱和化合物的原料优选为乙烯，丙烯，异亚丙基和亚丁基中的至少一种。微粒用于扩散膜的光散射，用于化妆品的光滑有效剂和防粘连剂。制备聚合物微粒的方法包括冷却和固化其中熔融聚合物和分散介质在保持乳液的状态下在剪切应力下形成亚稳态乳液的体系。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2007051449A Tile carpet 审中-公开
标题翻译：地毯
公开(公告)号：JP2007051449A
公开(公告)日：2007-03-01
申请号：JP2005236463
申请日：2005-08-17
申请人： Yasuhara Chemical Co Ltd , ヤスハラケミカル株式会社
发明人： TOCHIGI SHIGETAKE , KAWAGUCHI MASANORI , SAKAKIBARA RYOHEI
IPC分类号： E04F15/16 , D06N7/00
摘要： PROBLEM TO BE SOLVED: To cut off the loss of reseparation performance, staining resistance and slipping-out preventive performance with the lapse of time to a floor material originally ought to be possessed as a tile carpet slipping-out preventive pressure sensitive adhesive since a nonslipping pressure sensitive adhesive softens when a plasticizer such as DOP included in a tile carpet backing layer transfers to the nonslipping pressure sensitive adhesive. SOLUTION: Reseparation performance and slipping-out preventive performance of a tile carpet are maintained by inserting a plasticizer cutoff barrier layer between the tile carpet backing layer such as plasticized vinyl chloride and the nonslipping pressure sensitive adhesive. A cellulose-based film, a polylactic acid-base film, an ethylene fluoride-based film, a nylon-based film, a polyester-based film, a polyvinyl alcohol-based film, a nonplastic polyvinylidene chloride-based film, a nonplastic vinyl chloride-based film, a polyimide-based film and a polyurethane-based film are desirable as a film being the barrier layer. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了切断原来应该具有的瓦片地毯防滑压敏粘合剂对地板材料的经过时间的分离性能，耐污染性和防脱落性能的损失因为包含在瓷砖地毯背衬层中的诸如DOP的增塑剂转移到非剥离压敏粘合剂时，非剥离压敏粘合剂会软化。解决方案：通过在瓦片地毯背衬层（例如塑化氯乙烯）和非剥离压敏粘合剂之间插入增塑剂阻隔层来维持瓷砖地毯的分离性能和防滑性能。纤维素类膜，聚乳酸类膜，氟化乙烯系膜，尼龙系膜，聚酯系膜，聚乙烯醇系膜，非塑性聚偏二氯乙烯系膜，非塑性乙烯基系作为阻挡层的膜，优选氯化物系膜，聚酰亚胺系膜和聚氨酯系膜。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2004106169A Cutting method for adhesive hot melting adhesive agent 审中-公开
公开(公告)号：JP2004106169A
公开(公告)日：2004-04-08
申请号：JP2003208337
申请日：2003-08-22
申请人： Yasuhara Chemical Co Ltd , ヤスハラケミカル株式会社
发明人： SAKAKIBARA RYOHEI
IPC分类号： B26D11/00 , B26D1/08 , B26D7/10
摘要： PROBLEM TO BE SOLVED: To provide a cutting method by which adhesion to a cutting blade of an adhesive hot melting adhesive agent is prevented by packaging it with a non-adhesive film, and by cutting it to a convenient sized block for use, but by reducing adhesion property at a hot melting cut portion at the same time of this cutting, since the adhesive hot melting adhesive agent is prone to adhere to an other object and to pick up dust and foreign material with which it is brought into contact while transported or stored.
SOLUTION: A groove-like cut for cutting is formed while covering the surface of a cut portion with an extended film by adhering a thermally molten film to a thermally molten hot melting adhesive agent by covering, by pressing with a heated obtuse angle blade below the melting temperature of the film. The thermally molten film preferably has a 70-130°C melting point by a differential scanning calorimeter and has a 10-50 micron meter thickness.
COPYRIGHT: (C)2004,JPO

7. 发明专利

JP2008266387A Thermoconductive hotmelt adhesive composition 审中-公开
标题翻译：热固性胶粘剂组合物
公开(公告)号：JP2008266387A
公开(公告)日：2008-11-06
申请号：JP2007108161
申请日：2007-04-17
申请人： Yasuhara Chemical Co Ltd , ヤスハラケミカル株式会社
发明人： TAKEUCHI SHOJI , SAKAKIBARA RYOHEI , TOCHIGI SHIGETAKE , KONDO HIDEKI , GOTO HIDEO
IPC分类号： C09J153/00 , C09J11/04 , C09J11/06 , C09J171/12
摘要： PROBLEM TO BE SOLVED: To provide a composition having excellent thermal conductivity and heat resistance, achieving the improvement of productivity because of being directly coated on a heating element or a radiator, and adjustable as a sealing material of different kinds of materials having different coefficients of linear expansion.
SOLUTION: The thermoconductive hotmelt adhesive composition having the heat resistance comprises (A) a styrene-based thermoplastic elastomer and (B) a thermal conductivity-imparting agent as essential components, and has -15 to -35°C peak temperature of tanδ in a low temperature region, measured by a dynamic viscoelasticity test method and corresponding to the transition to a glass state from a rubber state, ≤10 N/10 mm×25 mm stress when the strain reaches 0.05 mm in a tensile shearing test of a sheet having 1 mm thickness in -25°C environment, and ≥0.5 W/mK thermal conductivity.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供具有优异的导热性和耐热性的组合物，由于直接涂覆在加热元件或散热器上而实现生产率的提高，并且可调节为具有不同种类的材料的密封材料，不同的线膨胀系数。解决方案：具有耐热性的导热热熔粘合剂组合物包含（A）苯乙烯类热塑性弹性体和（B）导热性赋予剂作为必要成分，并且具有-15〜-35℃的峰值温度 tanδ在低温区域，通过动态粘弹性试验方法测定，对应于从橡胶状态向玻璃状态的转变，当拉伸剪切试验中应变达到0.05mm时，应力为≤10N/ 10mm×25mm 在-25℃环境下具有1mm厚度的片材，以及≥0.5W/ mK的热导率。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2007284610A Hot-melt adhesive 有权
标题翻译：热熔胶
公开(公告)号：JP2007284610A
公开(公告)日：2007-11-01
申请号：JP2006115551
申请日：2006-04-19
申请人： Yasuhara Chemical Co Ltd , ヤスハラケミカル株式会社
发明人： OGATA TOSHIKAZU , SAKAKIBARA RYOHEI , TOCHIGI SHIGETAKE , KAWAGUCHI MASANORI , KITAMURA SHOZO
IPC分类号： C09J123/08 , C09J11/08
摘要： PROBLEM TO BE SOLVED: To provide an ethylene-methyl (meth)acrylate copolymer hot-melt adhesive composition preventing stringiness caused when carrying out coating by a nozzle and excellent in heat-resistant/cold-resistant adhesiveness.
SOLUTION: The hot-melt adhesive composition is obtained by mixing an ethylene-alkyl (meth)acrylate copolymer with 0.05-3 pts.wt. ethylene-unsaturated ester copolymer (D) in which the difference ΔX of unsaturated ester unit amount calculated by formula (1) is ≥19.5 wt.%.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种防止由喷嘴进行涂布而产生的弯曲性的乙烯 - （甲基）丙烯酸甲酯共聚物热熔粘合剂组合物，并且耐热/耐寒粘合性优异。解决方案：热熔粘合剂组合物通过将乙烯 - （甲基）丙烯酸烷基酯共聚物与0.05-3重量份的混合而获得。乙烯 - 不饱和酯共聚物（D），其中由式（1）计算的不饱和酯单元量的差ΔX为≥19.5重量％。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2007262392A Hot melt adhesive composition with thermal conductivity 有权
标题翻译：热熔胶组合物具有热导率
公开(公告)号：JP2007262392A
公开(公告)日：2007-10-11
申请号：JP2007046406
申请日：2007-02-27
申请人： Yasuhara Chemical Co Ltd , ヤスハラケミカル株式会社
发明人： TAKEUCHI SHOJI , SAKAKIBARA RYOHEI , TOCHIGI SHIGETAKE , KONDO HIDEKI , GOTO HIDEO
IPC分类号： C09J201/00 , C09J9/00 , C09J11/00 , C09J153/00 , C09J163/00 , C09J171/10 , C09J201/06 , H01L23/36 , H01L23/373
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a hot melt adhesive composition having high thermal conductivity and excellent heat resistance, which enhances productivity since the composition can be applies directly to a heat generator or a radiator. SOLUTION: The hot melt adhesive composition is characterized by including a thermal conductivity-imparting agent and having melt viscosity of 10,000-3,000,000 mPa s at 200°C and a thermal conductivity of at least 0.4 W/mK. COPYRIGHT: (C)2008,JPO&INPIT

10. 发明专利

JP2007224100A Hot melt composition and mat and carpet 审中-公开
标题翻译：热熔胶组合物和地毯
公开(公告)号：JP2007224100A
公开(公告)日：2007-09-06
申请号：JP2006044674
申请日：2006-02-22
申请人： Yasuhara Chemical Co Ltd , ヤスハラケミカル株式会社
发明人： KAWAGUCHI MASANORI , SAKAKIBARA RYOHEI , TOCHIGI SHIGETAKE
IPC分类号： C08L23/00 , C08L23/10 , C08L101/00 , C09J11/08 , C09J123/00 , C09J123/12 , C09J123/14 , C09J123/16
摘要： PROBLEM TO BE SOLVED: To provide a hot melt composition which has a high softening point and excellent heat resistance, has a long open time, can correspond to various coating methods, and has sufficient adhesiveness especially also on fibrillation sprays, and to provide a mat and a carpet each using the composition.
SOLUTION: The hot melt composition comprises (A) 30 to 70 pts.wt. of an amorphous olefin polymer, (B) 5 to 30 pts.wt. of amorphous polypropylene except (A), and (C) 10 to 40 pts.wt. of a tackifying resin. The mat and the carpet each using the composition are provided.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：待解决的问题：为了提供具有高软化点和优异的耐热性的热熔组合物，具有长的开放时间，可以对应于各种涂布方法，并且具有足够的粘合性，特别是在原纤维喷雾剂上，以及提供垫子和地毯，每个使用该组合物。解决方案：热熔组合物包含（A）30至70重量份的无定形烯烃聚合物，（B）5-30重量份（A）和（C）10〜40重量份的无定形聚丙烯的增粘树脂。提供了使用该组合物的垫和地毯。版权所有（C）2007，JPO＆INPIT

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