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1. 发明专利

JP2007112888A Polymer micro-particle of spherical to spheroidal shape with smooth surface 审中-公开
标题翻译：球形微球与具有平滑表面的SPHEROIDAL形状
公开(公告)号：JP2007112888A
公开(公告)日：2007-05-10
申请号：JP2005305117
申请日：2005-10-20
申请人： Sansaara Corporation:Kk , Yasuhara Chemical Co Ltd , ヤスハラケミカル株式会社 , 有限会社サンサーラコーポレーション
发明人： KONDO HIDEKI , SAKAKIBARA RYOHEI , MIZUKAMI YOSHIKATSU
IPC分类号： C08J3/14 , A61K8/18 , A61K8/72 , A61Q1/02 , C08L23/00
摘要： PROBLEM TO BE SOLVED: To provide a simple method for producing a thermoplastic polymer for inexpensively feeding polymer micro-particles having a narrow particle size distribution breadth and ≤50 μm average particle diameter using a general-purpose polymer as a raw material without relying on the degree of polymerization.
SOLUTION: The micro-particles are composed of a thermoplastic addition polymer containing a raw material of an unsaturated compound which is a gas at normal temperature and having ≥10,000 molecular weight or are composed of a thermoplastic polycondensate and have ≤50 μm average particle diameter, a narrow particle size breadth and a spherical to a spheroidal shape with a smooth surface. In the micro-particles, the raw material of the unsaturated compound which is the gas at normal temperature is preferably at least one kind of ethylene, propylene, isopropylene and butylene. The micro-particles are used for light scattering for diffusion films, a slippery effective agent for cosmetics and an anti-blocking agent. The method for producing the polymer micro-particles comprises cooling and solidifying a system in which a molten polymer and a dispersion medium form a metastable emulsion under shear stress in a state maintaining the emulsion.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：待解决的问题：为了提供一种制造热塑性聚合物的简单方法，该方法是以通用聚合物作为原料廉价地供给具有窄的粒度分布宽度和≤50μm平均粒径的聚合物微粒，而没有依靠聚合度。解决方案：微粒由含有不饱和化合物的原料的热塑性加成聚合物构成，该原料为常温下的气体，分子量≥10,000，或由热塑性缩聚物构成，平均粒径≤50μm 颗粒直径，窄粒径宽度和球形至球状，具有光滑表面。在微粒中，作为常温下的气体的不饱和化合物的原料优选为乙烯，丙烯，异亚丙基和亚丁基中的至少一种。微粒用于扩散膜的光散射，用于化妆品的光滑有效剂和防粘连剂。制备聚合物微粒的方法包括冷却和固化其中熔融聚合物和分散介质在保持乳液的状态下在剪切应力下形成亚稳态乳液的体系。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2012116963A Hot-melt type sealant composition 审中-公开
标题翻译：热熔型密封剂组合物
公开(公告)号：JP2012116963A
公开(公告)日：2012-06-21
申请号：JP2010268251
申请日：2010-12-01
申请人： Yasuhara Chemical Co Ltd , ヤスハラケミカル株式会社
发明人： GOTO HIDEO , KONDO HIDEKI , MATSUMOTO MUTSUO
IPC分类号： C09K3/10
摘要： PROBLEM TO BE SOLVED: To provide a hot-melt type sealant composition which can closely adhere at normal temperatures, has sufficient heat resistance after adhesion, and maintains sufficient adhesivity even if receiving shock or vibration.SOLUTION: This hot-melt type sealant composition contains 1-30 mass% butyl-based rubber and 5-30 mass% wax. The time required until the stress in a state subjected to external force causing 5% dislocation becomes one fourth of initial stress is within 10 minutes; and type A hardness measured according to JIS K 6301 is 13 or below.
摘要翻译：要解决的问题：为了提供在常温下能够紧密粘附的热熔型密封剂组合物，在粘合后具有足够的耐热性，并且即使接受冲击或振动也能保持足够的粘合性。解决方案：该热熔型密封剂组合物含有1-30质量％的丁基橡胶和5-30质量％的蜡。在受到造成5％位错的外力的状态下的应力为初始应力的四分之一所需的时间为10分钟以内; 根据JIS K 6301测定的A型硬度为13以下。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2008143975A Heat-conductive hot melt adhesive composition 审中-公开
标题翻译：导热热熔胶组合物
公开(公告)号：JP2008143975A
公开(公告)日：2008-06-26
申请号：JP2006330595
申请日：2006-12-07
申请人： Yasuhara Chemical Co Ltd , ヤスハラケミカル株式会社
发明人： TAKEUCHI SHOJI , SAKAKIBARA RYOHEI , TOCHIGI SHIGETAKE , KONDO HIDEKI , GOTO HIDEO
IPC分类号： C09J201/08 , C09J11/04 , C09J11/08 , C09J153/02
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition excellent in an adhesion property to a glass substrate and an aluminum substrate with high thermal conductivity and high heat-resistance and capable of further attaining enhancement of productivity by direct coating on a heat generation body or a heat release body with it.
SOLUTION: If the thermal conductive hot melt adhesive composition with heat-resistance containing an acid anhydride-modified thermoplastic resin and a thermal conductivity giving agent, and having a melt viscosity of 10,000-3,000,000 mPa s at 200°C, a thermal conductivity of 0.4 W/mK or higher, and a peeling off strength relative to the glass substrate or the aluminum substrate of 200 N/m or higher is utilized, enhancement of productivity is attained by direct coating on the heat generation body or the heat release body.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种粘合性优异的粘合性组合物，其具有高导热性和高耐热性的玻璃基板和铝基板，并且能够通过直接涂覆在发热上进一步提高生产率身体或放热体。解决方案：如果含有酸酐改性的热塑性树脂和导热性赋予剂，并且在200℃下具有10,000-3,000,000mPa·s的熔体粘度的具有耐热性的导热热熔性粘合剂组合物，导电率为0.4W / mK以上，相对于玻璃基板或铝基板的剥离强度为200N / m以上，通过在发热体上直接涂布或散热来提高生产率身体。版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2012233090A Reaction-type hot melt sealant composition 审中-公开
标题翻译：反应型热熔密封组合物
公开(公告)号：JP2012233090A
公开(公告)日：2012-11-29
申请号：JP2011102771
申请日：2011-05-02
申请人： Yasuhara Chemical Co Ltd , ヤスハラケミカル株式会社
发明人： GOTO HIDEO , KONDO HIDEKI , MATSUMOTO MUTSUO
IPC分类号： C09K3/10 , H01L31/042
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide a reaction-type hot melt sealant composition which can form a sealant having a low moisture permeability and sufficient heat resistance.SOLUTION: The reaction-type hot melt sealant composition includes at least a first liquid and a second liquid which are allowed to react with each other when the composition is used. In this case, the composition contains 4-30 wt.% of maleic anhydride-modified styrene-based thermoplastic elastomer, 0.1-3.0 wt.% of epoxy resin, 7-25 wt.% of wax, and a curing-promoting agent. The first liquid contains the maleic anhydride-modified styrene-based thermoplastic elastomer, and the second liquid contains the epoxy resin. In addition, the moisture permeability of a sealant of 300 μm in thickness, which is formed by hardening the reaction-type hot melt sealant composition, is at most 10 (g/m×day) when measured at 40°C at a relative humidity of 90% according to the JIS Z 0208.
摘要翻译：要解决的问题：提供可形成具有低透湿性和足够耐热性的密封剂的反应型热熔密封剂组合物。解决方案：反应型热熔密封剂组合物至少包含第一液体和第二液体，当使用该组合物时，它们彼此反应。在这种情况下，组合物含有4-30重量％的马来酸酐改性的苯乙烯基热塑性弹性体，0.1-3.0重量％的环氧树脂，7-25重量％的蜡和固化促进剂。第一液体含有马来酸酐改性的苯乙烯类热塑性弹性体，第二液体含有环氧树脂。此外，通过使反应型热熔性密封剂组合物硬化形成的厚度为300μm的密封剂的透湿度为10（g / m 2以下） ×天），根据JIS Z 0208在相对湿度90％的相对湿度下在40℃下测定。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2010116530A Two-component reaction type hot melt resin composition and method of application thereof 审中-公开
标题翻译：两组分反应型热熔树脂组合物及其应用方法
公开(公告)号：JP2010116530A
公开(公告)日：2010-05-27
申请号：JP2009014357
申请日：2009-01-26
申请人： Yasuhara Chemical Co Ltd , ヤスハラケミカル株式会社
发明人： GOTO HIDEO , KONDO HIDEKI , TAKEUCHI SHOJI
IPC分类号： C09J163/00 , B05B7/08 , B05C5/04 , B05D7/24 , C09J201/08
摘要： PROBLEM TO BE SOLVED: To provide a two-component reaction type resin composition which is heat resistant and environment-friendly; and to provide an apparatus and a method of application thereof with uniform and stable application workability and ease of maintenance, causing no gelation due to contact or mixing of liquids in the application apparatus and in the vicinity of nozzle unit tip end in the stoppage of spouting.
SOLUTION: This two-component reaction type hot melt resin composition is such that a first liquid is brought into contact with a second liquid, whereby a curing agent or curing promotor in the second liquid penetrates into the first liquid and reaction proceeds. The apparatus and method of application are such that the two-component reaction type hot melt resin composition is spouted from different spout ports in proximity without mixing in the apparatus, and comes into contact or mix in the air to proceed reaction; and the nozzle units in the apparatus comprises intermediate shims, comb-like shims having comb-like grooves at both ends thereof, an independent hot-melt feeding platform having channels for feeding the material to the comb-like shims, air-slit shims and an air unit.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供耐热且环保的双组分反应型树脂组合物; 并且提供其均匀且稳定的应用可加工性和易于维护的装置和方法，其在施加装置中的液体的接触或混合以及在喷射停止中的喷嘴单元末端附近不引起凝胶化。解决方案：这种双组分反应型热熔树脂组合物是使第一液体与第二液体接触，由此第二液体中的固化剂或固化促进剂渗透到第一液体中并进行反应。该装置和应用方法使得双组分反应型热熔树脂组合物在不受混合的情况下从不同的喷口口喷出，并在空气中接触或混合进行反应; 装置中的喷嘴单元包括中间垫片，其两端具有梳状槽的梳状垫片，具有用于将材料馈送到梳状垫片的通道的独立的热熔供给平台，气流狭缝垫片和一个空气单元。版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP2008266387A Thermoconductive hotmelt adhesive composition 审中-公开
标题翻译：热固性胶粘剂组合物
公开(公告)号：JP2008266387A
公开(公告)日：2008-11-06
申请号：JP2007108161
申请日：2007-04-17
申请人： Yasuhara Chemical Co Ltd , ヤスハラケミカル株式会社
发明人： TAKEUCHI SHOJI , SAKAKIBARA RYOHEI , TOCHIGI SHIGETAKE , KONDO HIDEKI , GOTO HIDEO
IPC分类号： C09J153/00 , C09J11/04 , C09J11/06 , C09J171/12
摘要： PROBLEM TO BE SOLVED: To provide a composition having excellent thermal conductivity and heat resistance, achieving the improvement of productivity because of being directly coated on a heating element or a radiator, and adjustable as a sealing material of different kinds of materials having different coefficients of linear expansion.
SOLUTION: The thermoconductive hotmelt adhesive composition having the heat resistance comprises (A) a styrene-based thermoplastic elastomer and (B) a thermal conductivity-imparting agent as essential components, and has -15 to -35°C peak temperature of tanδ in a low temperature region, measured by a dynamic viscoelasticity test method and corresponding to the transition to a glass state from a rubber state, ≤10 N/10 mm×25 mm stress when the strain reaches 0.05 mm in a tensile shearing test of a sheet having 1 mm thickness in -25°C environment, and ≥0.5 W/mK thermal conductivity.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供具有优异的导热性和耐热性的组合物，由于直接涂覆在加热元件或散热器上而实现生产率的提高，并且可调节为具有不同种类的材料的密封材料，不同的线膨胀系数。解决方案：具有耐热性的导热热熔粘合剂组合物包含（A）苯乙烯类热塑性弹性体和（B）导热性赋予剂作为必要成分，并且具有-15〜-35℃的峰值温度 tanδ在低温区域，通过动态粘弹性试验方法测定，对应于从橡胶状态向玻璃状态的转变，当拉伸剪切试验中应变达到0.05mm时，应力为≤10N/ 10mm×25mm 在-25℃环境下具有1mm厚度的片材，以及≥0.5W/ mK的热导率。版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2007262392A Hot melt adhesive composition with thermal conductivity 有权
标题翻译：热熔胶组合物具有热导率
公开(公告)号：JP2007262392A
公开(公告)日：2007-10-11
申请号：JP2007046406
申请日：2007-02-27
申请人： Yasuhara Chemical Co Ltd , ヤスハラケミカル株式会社
发明人： TAKEUCHI SHOJI , SAKAKIBARA RYOHEI , TOCHIGI SHIGETAKE , KONDO HIDEKI , GOTO HIDEO
IPC分类号： C09J201/00 , C09J9/00 , C09J11/00 , C09J153/00 , C09J163/00 , C09J171/10 , C09J201/06 , H01L23/36 , H01L23/373
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a hot melt adhesive composition having high thermal conductivity and excellent heat resistance, which enhances productivity since the composition can be applies directly to a heat generator or a radiator. SOLUTION: The hot melt adhesive composition is characterized by including a thermal conductivity-imparting agent and having melt viscosity of 10,000-3,000,000 mPa s at 200°C and a thermal conductivity of at least 0.4 W/mK. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有高导热性和优异耐热性的热熔粘合剂组合物，其可以将组合物直接施加到发热体或散热器上，从而提高生产率。解决方案：热熔粘合剂组合物的特征在于包括导热性赋予剂，并且在200℃下具有10,000-3,000,000mPa·s的熔体粘度和至少0.4W / mK的热导率。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2009144144A Heat-conductive hot-melt adhesive composition 有权
标题翻译：导热热熔胶组合物
公开(公告)号：JP2009144144A
公开(公告)日：2009-07-02
申请号：JP2008293451
申请日：2008-11-17
申请人： Yasuhara Chemical Co Ltd , ヤスハラケミカル株式会社
发明人： TAKEUCHI SHOJI , KONDO HIDEKI , GOTO HIDEO
IPC分类号： C09J201/00 , C09J7/00 , C09J11/00
摘要： PROBLEM TO BE SOLVED: To provide a heat-conductive hot-melt adhesive composition excellent in thermal conductivity, fluidity and heat resistance and achieving improvement of productivity since the composition can be melted and applied directly to a heat generator or a radiator.
SOLUTION: The heat-conductive hot-melt adhesive composition having fluidity is characterized in that the composition contains a thermal conductivity-imparting agent having an average particle diameter of 5-80 μm and has a thermal conductivity of ≥0.4 W/mK.
COPYRIGHT: (C)2009,JPO&INPIT

9. 发明专利

JP2006089521A Heat sealing hot-melt adhesive composition showing easy releasability 审中-公开
标题翻译：热密封热熔胶组合物显示易于释放
公开(公告)号：JP2006089521A
公开(公告)日：2006-04-06
申请号：JP2004273334
申请日：2004-09-21
申请人： Yasuhara Chemical Co Ltd , ヤスハラケミカル株式会社
发明人： AONO MEGUMI , SAKAKIBARA RYOHEI , TOCHIGI SHIGETAKE , KONDO HIDEKI , OGATA TOSHIKAZU
IPC分类号： C09J201/00 , C09J11/06 , C09J123/04 , C09J131/04 , C09J133/08 , C09J191/06
摘要： PROBLEM TO BE SOLVED: To provide a cover material which not only solves easy openability and stringiness on opening but also does not break the flange of a paper cup. SOLUTION: The heat sealing hot-melt adhesive composition comprises a base resin as such and a component noncompatible with the base resin and has physical properties of a breaking strength of the film of ≤5 MPa and an elongation at break of ≤100%. COPYRIGHT: (C)2006,JPO&NCIPI

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