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    • 3. 发明专利
    • METHOD FOR INJECTION MOLDING
    • JP2000108155A
    • 2000-04-18
    • JP28511998
    • 1998-10-07
    • UBE INDUSTRIES
    • OKAHARA ETSUO
    • B29C45/00B29C45/70
    • PROBLEM TO BE SOLVED: To reduce a mold clamping force without lowering quality of a molding by setting an initial injection filling amount at a specific ratio of the overall injection filling amount, and completing the injection filling in a secondary injection. SOLUTION: Molten polypropylene is primarily injected by preset amount in a mold cavity clamped at a predetermined clamping force, and a timer t1 is started. At the time of elapsing ta sec after the completion of the injection filling, a movable die is retracted by a mold clamping unit so that a gap between a surface of the molding and a surface of the mold cavity becomes about 0.1 to 0.5 mm. After the primary injection is completed, a dwell state is started, and secondary injection is continuously conducted in this state. At an elapsed time tb sec of the timer t1, the secondary injection is finished. Here, the molten resin amount injected in the cavity by the primary injection is set to 70 to 97% of the overall injection resin amount. Thus, a mold clamping force can be reduced without lowering quality of the molding.
    • 5. 发明专利
    • LAMINATION MOLDING METHOD
    • JPH11221837A
    • 1999-08-17
    • JP2567998
    • 1998-02-06
    • UBE INDUSTRIES
    • OKAHARA ETSUO
    • B29C33/38B29C45/14B29C45/37B29C45/56B29C45/57B29C45/78B29L9/00
    • PROBLEM TO BE SOLVED: To re-form the surface of a skin material to improve appearance by making the temperature of a core material resin to be injected/packed higher than the glass transition temperature of a resin forming the surface of the skin material and making a mold of insulating structure which retards the heat transmission from the surface of the skin material to the mold. SOLUTION: When the mold cavity 5 of a mold device 10 of insulating structure is filled with the resin of a core material Q and the device 10 is opened slightly, a space is formed between the surface of a skin material and the surface of the cavity 5. When a mold is opened, a skin sheet S is stretched by a roll 6 with the surface turned to a movable mold 4, supplied between a fixed mold 3 and the movable mold 4, and made to have a shape similar to that of the cavity 5 by mold clamping. The temperature of a core material resin to be injected/packed is made higher than the glass transition temperature of a resin forming the surface layer of the sheet S, and the mold is made of insulating structure which retards the heat transmission from the surface of the sheet S to the mold by using the space.
    • 6. 发明专利
    • MONOLITHIC MOLDING METHOD WITH SKIN
    • JPH10156884A
    • 1998-06-16
    • JP32247796
    • 1996-12-03
    • UBE INDUSTRIES
    • OKAMOTO AKIOOKAHARA ETSUO
    • B29C45/26B29C45/14B29C45/16B29C45/70B29C45/78B29K105/20B29L9/00
    • PROBLEM TO BE SOLVED: To provide a method for making a monolithic molding with a skin by which it is possible to stably manufacture a monolithic molding with a skin of uniform and high quality and without a flaw such as the flattened nap of a skin material, at a low manufacturing cost. SOLUTION: A skin material S with a nap raised layer formed on the surface is interposed between a pair of opposed right/left molds or a pair of opposed upper/lower molds and these molds are clamped. Further, a molten resin serving as a core material Q is injected fully into a cavity space 5 formed with the skin material S and both molds 3, 4 and the skin material S and the core material Q are monolithically formed. In this method for manufacturing a molded product with a skin, the raised nap layer of the skin material S is of such a selected material that a melting point is higher than that of the core material Q and a glass transition point is lower than the melting point of the core material Q. After the core material resin Q is cooled and hardened following the injection and filling of the core material resin, a loading force to be brought to bear upon the raised layer of the skin material is removed at a point of time when the temperature of the core material resin Q in the mold cavity 5 reaches the temperature level set previously in a rubber-like elastic temperature area between the glass transition point and the melting point of the raised layer of the skin material. At the same time, a gap is provided between the skin material S and the mold cavity 5 in accordance with the thickness of the raised layer of the skin material, and is retained for a specified set time.
    • 10. 发明专利
    • INJECTION MOLDING METHOD
    • JP2003231164A
    • 2003-08-19
    • JP2002029629
    • 2002-02-06
    • UBE INDUSTRIES
    • OKAHARA ETSUO
    • B29C45/80B29C45/70B29C45/76
    • PROBLEM TO BE SOLVED: To save the energy consumption during clamping a mold, in an injection molding method for filling the mold with a resin by injection and molding the resin. SOLUTION: This injection-molding device 100 is equipped with a position sensor L for measuring the mold opening level of the mold 10 and a mold clamping control device 61 having a mold clamping conditions setting machine with a capability of setting the mold 10 opening level of a mold assembly 10 during injecting a resin and filling the mold with it. First, the mold 10 with a cavity formed so as to obtain a finished product of a desired shape when the mold 10 is opened only to the predetermined mold opening level, is clamped by a first mold clamping force and filled with a resin. Next, the mold opening level is measured using the position sensor L, and when the measured mold opening level is lower than the mold opening level set in the mold clamping conditions setting machine, the first clamping force is decreased. On the contrary, when the measured mold opening level is higher than the mold opening level set in the mold clamping conditions setting machine, the first mold clamping force is increased. Thus the mold opening level after the filling of the mold 10 with a resin is controlled as described. COPYRIGHT: (C)2003,JPO