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    • 8. 发明专利
    • Semiconductor device
    • 半导体器件
    • JP2014053552A
    • 2014-03-20
    • JP2012198554
    • 2012-09-10
    • Toyota Motor Corpトヨタ自動車株式会社
    • HORIUCHI YUKIKAMEYAMA SATORUONISHI TORUEBINE JUMPEI
    • H01L21/336H01L27/04H01L29/739H01L29/78
    • PROBLEM TO BE SOLVED: To provide a semiconductor device which can ensure a wider element operation region than in the past in a semiconductor device equipped with a dummy trench gate and a distribution wire for screening inspection of the dummy trench gate.SOLUTION: A semiconductor device comprises an element formation region which is arranged on a principal surface side of a semiconductor substrate and includes: a plurality of trench gates 12 which extend in an X direction and are arranged in parallel with each other in a Y direction orthogonal to the X direction; a plurality of dummy trench gates 13 which extend in the X direction and are arranged in parallel with each other in the Y direction, in such a manner as to sandwich each trench gate 12; gate distribution wires 15, 17, 17a formed on the principal surface of the semiconductor substrate, for electrically connecting the plurality of trench gates 12 with each other; and a dummy gate distribution wire 14 for electrically connecting the plurality of dummy trench gates 13 with each other. The dummy gate distribution wire 14 overlaps the gate distribution wires 15, 17, 17a so as to avoid the trench gate 12 in planar view from a thickness direction of the semiconductor substrate.
    • 要解决的问题:提供一种半导体器件,其能够确保与配备有虚设沟槽栅极的半导体器件和用于屏蔽虚拟沟槽栅极检查的配线的过去较宽的元件操作区域。解决方案:半导体器件 包括设置在半导体衬底的主表面侧的元件形成区域,并且包括:在X方向上延伸并且在与X方向正交的Y方向上彼此平行地布置的多个沟槽栅12; 多个虚拟沟槽栅极13,其以X方向延伸并且在Y方向上彼此平行地布置,以夹住每个沟槽栅极12; 形成在半导体衬底的主表面上的用于将多个沟槽栅极12彼此电连接的栅极配线15,17,17,17a; 以及用于将多个虚拟沟槽栅极13彼此电连接的虚拟栅极配线14。 虚拟栅极配线14与栅极配线15,17,17a重叠,以避免沟槽栅极12从半导体衬底的厚度方向看平面。
    • 9. 发明专利
    • Manufacturing method of semiconductor device
    • 半导体器件的制造方法
    • JP2012175003A
    • 2012-09-10
    • JP2011037614
    • 2011-02-23
    • Toyota Motor Corpトヨタ自動車株式会社
    • IWASAKI SHINYAONISHI TORU
    • H01L21/28H01L21/3205H01L21/768
    • PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device capable of easily manufacturing a semiconductor device having an electrode structure where multiple metal layers are laminated.SOLUTION: The method of manufacturing a semiconductor device by using a semiconductor substrate having a semiconductor layer, a first metal layer formed on te surface of the semiconductor layer, and an insulation layer formed at a position contiguous to the first metal layer so as to expose the first metal layer at least partially includes: a step for forming a second metal layer exhibiting higher adhesion to the first metal layer than to the insulation layer on the surface of the first metal layer at an exposed part and on the surface of the insulation layer; and a step for peeling off the second metal layer formed on the surface of the insulation layer from the insulation layer while leaving the second metal layer formed on the surface of the first metal layer.
    • 解决的问题:提供能够容易地制造具有多层金属层的电极结构的半导体装置的半导体装置的制造方法。 解决方案:通过使用具有半导体层的半导体衬底,形成在半导体层的表面上的第一金属层和形成在与第一金属层相邻的位置处的绝缘层来制造半导体器件的方法,因此 为了露出第一金属层至少部分地包括:用于形成对第一金属层具有更高粘附性的第二金属层的步骤,而不是在第一金属层的表面上的暴露部分和表面上的绝缘层 绝缘层; 以及在离开形成在第一金属层的表面上的第二金属层的同时从绝缘层剥离形成在绝缘层的表面上的第二金属层的步骤。 版权所有(C)2012,JPO&INPIT
    • 10. 发明专利
    • Semiconductor wafer
    • SEMICONDUCTOR WAFER
    • JP2010129569A
    • 2010-06-10
    • JP2008299207
    • 2008-11-25
    • Toyota Motor Corpトヨタ自動車株式会社
    • ONISHI TORU
    • H01L21/02
    • PROBLEM TO BE SOLVED: To provide a semiconductor wafer which has sufficient wafer strength, and is easy to position on a stage and to remove from the stage.
      SOLUTION: The semiconductor wafer 100 includes a thick layer part 2 and a thin layer part 4. The thick layer part 2 is formed along an outer circumference of the semiconductor wafer 100. The thin layer part 4 is formed in a range surrounded by the thick layer part 2, and is thinner than the thick layer part 2. Grooves 6a, 6b, 6c, 6d radially intersecting the thick layer part 2 from an outside to an inside of the wafer are formed on the thick layer part 2. In viewing the semiconductor wafer 100 planarly, both side walls of the grooves 6a, 6b, 6c, 6d intersect with straight lines parallel to a cleavage direction of the wafer.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供具有足够的晶片强度并且易于在载物台上定位并从载物台移除的半导体晶片。 解决方案:半导体晶片100包括厚层部分2和薄层部分4.厚层部分2沿着半导体晶片100的外圆周形成。薄层部分4形成在包围的范围内 通过厚层部分2,并且比厚层部分2薄。在厚层部分2上形成有从厚层部分2的从外部到内部径向相交的沟槽6a,6b,6c,6d。 在平面地观察半导体晶片100时,槽6a,6b,6c,6d的两个侧壁与平行于晶片的解理方向的直线交叉。 版权所有(C)2010,JPO&INPIT