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    • 1. 发明专利
    • COOLING DEVICE
    • JP2000299585A
    • 2000-10-24
    • JP11715699
    • 1999-04-23
    • TOYOTA MOTOR CORP
    • SUGANUMA TETSUYA
    • H05K7/20F25D9/00H01L23/473
    • PROBLEM TO BE SOLVED: To provide a cooling device, having a wide range of applications by which path for coolant is improved for improving cooling performance and cooling temperature can be set approximately uniform in the whole area of heat receiving surface, which is in contact with a member to be cooled and cools the same by removing heat or can be set differently among parts of the area. SOLUTION: A cooling device 1 is formed by integrating several coolant paths 1a which are substantially U-shaped U and are comprised of outgoing paths 3a and return paths 3b through which coolant R flows in and out. The coolant paths 1a are arranged, in such a way that planes comprised of outgoing paths 3a and return paths 3b are approximately in parallel with each other. Also, at least one of the planes comprised of several going paths 3a and the plane comprised of several returning paths 3b functions as heat receiving surface C (2c, 3c and 4c).
    • 2. 发明专利
    • COOLING DEVICE FOR ELECTRONIC COMPONENTS
    • JP2000299418A
    • 2000-10-24
    • JP10571599
    • 1999-04-13
    • TOYOTA MOTOR CORP
    • SUGANUMA TETSUYA
    • H01L23/38
    • PROBLEM TO BE SOLVED: To cool electronic components which generate a heat and utilize effectively a part of thermal energy emitting during cooling. SOLUTION: A cooling device 1A for electronic components is comprised of a radiating part 2, which is brought into contact with an electronic part 6, a cooling vessel 3 where a refrigerant R is fed and discharged, a thermoelectric element 4 which is inserted between the radiating part 2 and the cooling vessel 3 in a manner such that it is in contact with the surface 21 of the radiating part 2 and the outer surface 34 of the cooling vessel 3, and a heat transporting pipe 5A whose one end 50a is brought into contact with the radiating part 2 and the other end 52a with the cooling vessel 3 respectively. Thus, heat generating in the electronic components is emitted from the radiating part to the refrigerant in the cooling vessel 3 via the pipe 5A, so as to cool the electronic components, and at the same time, the thermoelectric element 4, which is given a high heat transmitted from the electronic components through the radiating part and a low heat transmitted from the refrigerant via the cooling vessel 3, generates an electric power thanks to the difference in temperatures between the high heat and low heat.