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    • 4. 发明专利
    • PRINTED WIRING CIRCUIT BOARD
    • JPH11289030A
    • 1999-10-19
    • JP8990398
    • 1998-04-02
    • FURUKAWA ELECTRIC CO LTD
    • NINOMIYA JUNJI
    • C22C49/00C22C21/00C22C47/00C22C49/06H01L23/12H01L23/14H05K1/05C22C1/09
    • PROBLEM TO BE SOLVED: To provide a printed wiring circuit board which can be made light in weight and high in mounting density. SOLUTION: The printed wiring circuit board includes a substrate 1 made of a carbon fiber reinforced aluminum alloy containing carbon fibers dispersed into an aluminum alloy matrix, an insulating film 2 provided on one side of the substrate 1, and a conductive film pattern 3 formed on the insulating film 2. Semiconductor elements 4 are mounted on the board. In this case, parts 5 of the substrate 1 on which the semiconductor elements 4 are mounted have a carbon fiber dispersion percentage higher than the other part thereof so that a thermal expansion coefficient of the semiconductor element mounted parts 5 is as low as that of the semiconductor element. Since the substrate 1 is made of a carbon fiber reinforced aluminum alloy, the substrate is light in weight. Further, since the parts of the substrate 1 corresponding to the mounted positions of the semiconductor element 4 have a high carbon fiber dispersion percentage and have a thermal expansion coefficient as low as that of the semiconductor element destruction of the element 4 caused by a thermal expansion difference therebetween can be prevented and high density mounting thereof can be realized.
    • 8. 发明专利
    • PARTICLE LAMINATED BODY AND ITS PRODUCTION
    • JPH11209833A
    • 1999-08-03
    • JP1596498
    • 1998-01-28
    • AISIN SEIKI
    • NAKANO TAKAAKIKANEYASU YOUICHI
    • B32B5/16C22C47/16C23C4/04C22C1/09
    • PROBLEM TO BE SOLVED: To produce a laminated body composed of particles rigidly bonded each other and having an excellent quality at a low cost by mixing fibers with the particles at the time of thermal spraying to bond the particles to each other through fiber chips. SOLUTION: The fiber chips are preferably contained by 2-70 vol.% and preferably of 2-50 μm diameter, 50 μm length and aspect ratio of >=10. Flame 7 as a heat source is generated in an inner hole 3a of a gun main body 3 by sending a thermal spraying gas from a nozzle 5. A thermal spraying material 9 composed of the particles of a metal, a resin or the mixture and the fibers 11 of a metallic material, a carbon material or the mixture are previously mixed, charged into the nozzle 5, jetted and passed through the flame 7 to be melted. The fiber 11 is selected from a material having a higher m.p. than that of the thermal spraying material 9. By controlling the flame 7 to melt only the thermal spraying material 9, the thermal spraying material is bonded to each other and cooled to generate strong bonding force when the thermal sprayed mixture collides with the pedestal 13. The particle laminated body 15 is formed by lamination on the pedestal 13.