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1. 发明专利

JP2011204952A Surface treatment apparatus 有权
标题翻译：表面处理设备
公开(公告)号：JP2011204952A
公开(公告)日：2011-10-13
申请号：JP2010071493
申请日：2010-03-26
申请人： Toyota Central R&D Labs Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社豊田中央研究所
发明人： JIANG YU YAN , INAGAKI MASAHIDE , NAKAJIMA KENJI , MAKINO SOICHIRO , HORINOUCHI SHIGEAKI , ITO TAKAHIRO
IPC分类号： H01L21/205 , C23C16/455 , H01L21/302
CPC分类号： C23C16/45508 , C23C16/45504 , C23C16/45587 , C23C16/45597
摘要： PROBLEM TO BE SOLVED: To reduce flow turbulence caused by a used fluid bumping against the inside wall of an outlet channel when a surface treatment material fluid flows along a substrate surface to be discharged in a surface treatment apparatus.SOLUTION: A surface treatment apparatus 10 is an apparatus in which a disk-like sample-holding plate 14 is provided inside an enclosure 12 constituting a cylindrical circumferential wall. A cylindrical part 22 provided in an upper portion of the enclosure 12 constitutes a material fluid supplying channel, and a channel provided on the lateral side of the sample-holding plate 14 in the enclosure 12 and shaped spreading as it goes farther from the cylindrical part 22 constitutes a fluid discharge channel 24. The fluid discharge channel 24 employs a parabola curve or the like in which the position of the upper end of the outmost circumference of the sample-holding plate 14 is defined as a focus position and the position of the upper end of the outlet that is symmetrically opposite to the focus position is defined as a reference position.
摘要翻译：要解决的问题：当表面处理材料流体沿着要在表面处理设备中排出的基底表面流动时，减少由使用过的液体撞击出口通道的内壁引起的流动湍流。解决方案：表面处理设备10 是在构成圆筒状周壁的外壳12的内部设置盘状的样品保持板14的装置。设置在外壳12的上部的圆柱形部分22构成材料流体供应通道，以及设置在外壳12中的样品保持板14的侧面上的通道，并且当其从圆柱形部分 22构成流体排出通道24.流体排出通道24采用抛物线曲线等，其中样本保持板14的最外周的上端的位置被定义为聚焦位置，并且位置与焦点位置对称地相对的出口的上端被定义为参考位置。

2. 发明专利

JP2011029592A Surface processing simulation device, controller for surface processing apparatus and surface processing system 有权
标题翻译：表面处理模拟装置，表面处理装置和表面处理系统的控制器
公开(公告)号：JP2011029592A
公开(公告)日：2011-02-10
申请号：JP2010071307
申请日：2010-03-26
申请人： Toyota Central R&D Labs Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社豊田中央研究所
发明人： JIANG YU YAN , INAGAKI MASAHIDE , NAKAJIMA KENJI , MAKINO SOICHIRO , ITO TAKAHIRO
IPC分类号： H01L21/205 , C23C16/52 , H01L21/00 , H01L21/3065
摘要： PROBLEM TO BE SOLVED: To calculate optimal conditions of a raw material fluid for surface processing in vertical rotary surface processing that uses pumpability.
SOLUTION: A surface processing simulation device 20 for a vertical rotary surface processing apparatus 10 stores a model calculation program 36 that calculates velocity distribution of the raw material fluid 18 by applying a pumpability model to a storage portion 38. A CPU 30 includes: a parameter acquisition processing portion 42 for inputting and acquiring surface processing parameters; a model calculation portion 44 that calculates the velocity distribution of the raw material fluid 18 to a substrate 16 by applying the acquired surface processing parameters to the model calculation program 36; an optimal flow rate calculation processing portion 46 that calculates the optimal flow rate of the raw material fluid based on the calculated data of the velocity distribution and device parameters; and a flow rate correction processing portion 48 that corrects the optimal flow rate based on the device shape parameters. The productivity flow rate where the optimal flow rate is reduced is determined from the productivity viewpoint.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：计算使用泵送性的垂直旋转表面处理中用于表面处理的原料流体的最佳条件。解决方案：用于垂直旋转表面处理装置10的表面处理模拟装置20存储通过将可泵性模型应用于存储部分38来计算原料流体18的速度分布的模型计算程序36.CPU 30包括：用于输入和获取表面处理参数的参数获取处理部分42; 模型计算部分44，通过将获取的表面处理参数应用于模型计算程序36来计算原料流体18对基板16的速度分布; 最佳流量计算处理部分46，其基于计算出的速度分布数据和装置参数来计算原料流体的最佳流量; 以及基于装置形状参数校正最优流量的流量校正处理部48。从生产率的观点来看，确定最优流量减少的生产率流量。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2011192772A Vapor-phase growth device and vapor phase growth method 有权
标题翻译：蒸汽相生长装置和蒸汽相生长方法
公开(公告)号：JP2011192772A
公开(公告)日：2011-09-29
申请号：JP2010057168
申请日：2010-03-15
申请人： Toyota Central R&D Labs Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社豊田中央研究所
发明人： NAKAJIMA KENJI , OZAWA TAKAHIRO , ZEN KIEI , INAGAKI MASAHIDE , ITO TAKAHIRO
IPC分类号： H01L21/205 , C01B33/12 , C23C16/455
摘要： PROBLEM TO BE SOLVED: To reduce a dispersion in characteristics in a plane of a vapor-phase grown semiconductor film. SOLUTION: A vapor-phase growth device 100 grows the semiconductor film on a surface of a substrate 44. The vapor-phase growth device 100 has a vapor-phase growth chamber 38, a stirring chamber 2, a communication passage 14, and an adjusting device 1. The vapor-phase growth chamber 38 has a placing table 34 on which the substrate 44 is placed. The stirring chamber 2 generates a mixed material gas 10 by stirring a plurality of material gasses. The communication passage 14 provides a communication between the vapor-phase growth chamber 38 and the stirring chamber 2. The adjusting device 1 adjusts an introduced amount of the mixed material gas 10 introduced into the vapor-phase growth chamber 38. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了减少气相生长半导体膜的平面中的特性分散。气相生长装置100将半导体膜生长在基板44的表面上。气相生长装置100具有气相生长室38，搅拌室2，连通路14，和调节装置1.气相生长室38具有载置台34，放置基板44。搅拌室2通过搅拌多个原料气体而产生混合气体10。连通通道14提供气相生长室38和搅拌室2之间的连通。调节装置1调节引入气相生长室38的混合材料气体10的引入量。版权所有：（C）2011，JPO＆INPIT

4. 发明专利

JP2014203863A 表面処理装置有权
标题翻译：表面处理装置
公开(公告)号：JP2014203863A
公开(公告)日：2014-10-27
申请号：JP2013076580
申请日：2013-04-02
申请人：株式会社豊田中央研究所 , Toyota Central R&D Labs Inc , トヨタ自動車株式会社 , Toyota Motor Corp
发明人： INAGAKI MASAHIDE , MAKINO SOICHIRO , NAKAJIMA KENJI , YAMAZAKI TOSHIHIRO , ITO TAKAHIRO
IPC分类号： H01L21/205 , C23C16/44 , C23C16/455
摘要：【課題】基板の表面処理性能の低下を抑制し、且つ表面処理装置の内壁への堆積物の堆積を抑制することが可能な表面処理装置を提供する。【解決手段】原料流体流入部28の下方端から、試料保持台12の側方外周を取り囲むように、原料流体32の下流側に向かって広がる流路である原料流体排出部30と、原料流体排出部30に設けられ、副流体22が原料流体排出部30の内壁に沿って流れるように、原料流体流入部28を流れる原料流体32の流れ方向に対して垂直又は略垂直に配置される副流体導入部26と、を備える表面処理装置1。【選択図】図1
摘要翻译：要解决的问题：提供一种表面处理装置，其能够使基板的表面处理性能的降低最小化，并且能够抑制沉积物沉积在表面处理装置的内壁上。解决方案：表面处理装置1包括原料流体排出部30，其是从原料流体流入部28的下端朝向原料流体32的下游侧扩展的流路，以包围样品保持基体12的外周;以及设置在原料流体排出部30中的副流体导入部26，与流过原料流体流入部28的原料流体32的流动方向垂直或大致垂直地配置，使得副流体22 沿着原料流体排出部30的内壁流动。

5. 发明专利

JP2013201317A Surface treatment device 审中-公开
标题翻译：表面处理装置
公开(公告)号：JP2013201317A
公开(公告)日：2013-10-03
申请号：JP2012069253
申请日：2012-03-26
申请人： Toyota Central R&D Labs Inc , 株式会社豊田中央研究所 , Toyota Motor Corp , トヨタ自動車株式会社
发明人： MAKINO SOICHIRO , INAGAKI MASAHIDE , ITO TAKAHIRO
IPC分类号： H01L21/205 , C23C16/455 , H01L21/302
摘要： PROBLEM TO BE SOLVED: To reduce a usage of a material fluid of a surface treatment device while securing unity of the surface treatment.SOLUTION: A structure 12 of a surface treatment device 10 is provided with a test piece holding stand 20 for holding a test piece 8 in the structure, the structure comprising: an inflow part 34 for introducing surface treatment fluid; and a discharge section 52 for discharging the introduced fluid. A flow regulation plate 40 with partition walls 44 is disposed in an internal space of the structure, the partition walls 44 separating the current of inflow fluid flowing to the test piece 8 into a plurality of areas by separating the inflow part 34 into a plurality of sections. A height shifting part 60 moves the regulation plate 40 with partition walls vertically to variably change an inflow height h. Fluid flowing in a central side space 46 separated by the partition walls 44 contains material gas, but fluid flowing in an outer circumferential side space 48 does not contain the material fluid for a surface treatment.
摘要翻译：要解决的问题：在确保表面处理的一致性的同时，减少表面处理装置的材料流体的使用。解决方案：表面处理装置10的结构12设置有用于保持试验的试验片支架20 该结构包括：用于引入表面处理流体的流入部分34; 以及用于排出导入流体的排出部52。具有分隔壁44的流量调节板40设置在结构的内部空间中，分隔壁44通过将流入部分34分离成多个区域将流入测试件8的流入流体的电流分离成多个区域部分。高度移动部60使调节板40与分隔壁垂直地移动，以可变地改变流入高度h。在由分隔壁44分隔的中央侧空间46中流动的流体包含材料气体，但是在外周侧空间48中流动的流体不包含用于表面处理的材料流体。

6. 发明专利

JP2013062376A Rotary deposition apparatus 审中-公开
标题翻译：旋转沉积装置
公开(公告)号：JP2013062376A
公开(公告)日：2013-04-04
申请号：JP2011199812
申请日：2011-09-13
申请人： Toyota Motor Corp , トヨタ自動車株式会社 , Toyota Central R&D Labs Inc , 株式会社豊田中央研究所
发明人： ITO TAKAHIRO , NAGAI KENICHIRO , NAKAJIMA KENJI , OZAWA TAKAHIRO , INAGAKI MASAHIDE , MAKINO SOICHIRO
IPC分类号： H01L21/205 , C23C16/455 , C23C16/458
摘要： PROBLEM TO BE SOLVED: To provide a rotary deposition apparatus which inhibits turbulent flow from occurring in the flow of a material gas even if a deposition substrate is rotated at a speed higher than the speed of the current deposition apparatus.SOLUTION: A rotary deposition apparatus 1 includes: a reaction container 10 which includes a rotor 20 having a susceptor 21 including a substrate placement part 21W, on which a deposition substrate W is placed, on an upper surface 20T and having a diameter larger than the deposition substrate W; a rotative power supply mechanism 23 supplying rotative power to the rotor 20; and a material gas supply mechanism supplying a material gas G to the deposition substrate W placed on the susceptor 21 from above the susceptor 21. At least a part of an external region of the substrate placement part 21W in the susceptor 21 is covered by a cover member 30.
摘要翻译：要解决的问题：提供一种旋转沉积设备，其即使沉积基板以比当前沉积设备的速度更高的速度旋转，也能抑制材料气体流动中产生的紊流。旋转沉积设备1包括：反应容器10，其包括转子20，转子20具有基座21，基座21包括基板放置部分21W，沉积基板W放置在基板放置部分21W上，上表面20T上具有直径大于沉积基板W; 向转子20供给旋转动力的旋转供电机构23; 以及材料气体供给机构，从基座21的上方向位于基座21上的成膜基板W供给材料气体G.基座21的基板配置部21W的外部区域的至少一部分被盖成员30.版权所有（C）2013，JPO＆INPIT

7. 发明专利

JP2012204725A Surface treatment device 有权
标题翻译：表面处理装置
公开(公告)号：JP2012204725A
公开(公告)日：2012-10-22
申请号：JP2011069491
申请日：2011-03-28
申请人： Toyota Central R&D Labs Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社豊田中央研究所
发明人： INAGAKI MASAHIDE , JIANG YU YAN , HORINOUCHI SHIGEAKI , ITO TAKAHIRO
IPC分类号： H01L21/205 , C23C16/455
摘要： PROBLEM TO BE SOLVED: To provide a surface treatment device which reduces a usage of a raw material fluid supplied to a substrate with maintaining in-plane uniformity of the substrate in surface treatment.SOLUTION: A raw material fluid is supplied toward a substrate 18 as vertical flow at a flow rate calculated based on speed distribution in an axial direction of the raw material fluid with respect to the substrate 18 when a vertical direction to a surface of the rotating substrate 18 is assumed as the axial direction. A ratio (D/d) of a diameter (D) of an inlet of a raw material fluid supply passage part 28 to a diameter (d) of the substrate 18 is within a range of 1-1.125.
摘要翻译：解决的问题：提供一种表面处理装置，其在保持表面处理中保持基板的面内均匀性的同时，减少供给到基板的原料流体的使用。解决方案：将原料流体作为垂直流以垂直流动方式供应，该流量以基于原料流体相对于基板18的轴向方向上的速度分布计算的流量被供给到基板18的垂直方向旋转基板18被假定为轴向。原料流体供给通路部28的入口的直径（D）与基板18的直径（d）的比（D / d）在1-1.125的范围内。版权所有（C）2013，JPO＆INPIT

8. 发明专利

JP2012204685A Surface treatment apparatus 有权
标题翻译：表面处理设备
公开(公告)号：JP2012204685A
公开(公告)日：2012-10-22
申请号：JP2011068903
申请日：2011-03-25
申请人： Toyota Central R&D Labs Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社豊田中央研究所
发明人： MAKINO SOICHIRO , INAGAKI MASAHIDE , ITO TAKAHIRO
IPC分类号： H01L21/205 , C23C16/44 , H01L21/3065 , H01L21/31
摘要： PROBLEM TO BE SOLVED: To provide a surface treatment apparatus which suppresses by-products from depositing at areas other than a workpiece during surface treatment and efficiently eliminates the deposited by-products while cleaning treatment.SOLUTION: When a raw material liquid used for surface treatment is supplied to a substrate 18 on a cylindrical sample holding base 12 provided in a housing part 10, a partition wall 14 provided around the lateral side of the sample holding base 12 moves to a position where the partition wall 14 covers a side surface of the sample holding base 12. When a cleaning liquid used for cleaning treatment in the housing part 10 is supplied to the substrate 18, the partition wall 14 moves to a position where the partition wall 14 exposes the side surface of the sample holding base 12.
摘要翻译：解决的问题：提供一种在表面处理期间抑制副产物沉积在工件以外的区域的表面处理装置，并且在清洁处理时有效地消除了沉积的副产物。解决方案：当用于表面处理的原料液体被提供给设置在壳体部分10中的圆柱形样品保持基座12上的基板18时，设置在样品保持基座12的侧面周围的分隔壁14移动到分隔壁14覆盖样品保持基座12的侧面的位置。当在壳体部10中用于清洁处理的清洗液体被供给到基板18时，分隔壁14移动到分隔壁壁14露出样品保持基座12的侧面。版权所有：（C）2013，JPO＆INPIT

9. 发明专利

JP2010026581A Computational grid forming device, computational grid forming method and program 审中-公开
标题翻译：计算网格形成装置，计算网格形成方法和程序
公开(公告)号：JP2010026581A
公开(公告)日：2010-02-04
申请号：JP2008183803
申请日：2008-07-15
申请人： Toyota Central R&D Labs Inc , 株式会社豊田中央研究所
发明人： SATO NORIKAZU , INAGAKI MASAHIDE
IPC分类号： G06F17/50 , G06F19/00
摘要： PROBLEM TO BE SOLVED: To provide a computational grid forming device, a computational grid forming method and a program, for forming a high-quality computational grid by suppressing crush or deformation occurring when moving the computational grid. SOLUTION: A computation space is divided into an object fixing area 51 that is an area closest to an object 60, a deformation area 55 that is an area distant from the object fixing area by just a prescribed number of grid points, and a buffer area 53 provided between the object fixing area 51 and the deformation area 55, and a movement vector of the grid is calculated by a different computation method in each area. A grid movement operation part 200 determines the movement vector such that a grid point moves together with the object in the object fixing area 51, calculates the movement vector by optional technique in the deformation area 55, and computes the movement vector such that the grid vectors of the above respective areas smoothly continue in the buffer area 53. In particular, in the buffer area 53, the movement vector may be computed by computation methods different in an edge part 531 and in a corner part 533. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种计算网格形成装置，计算网格形成方法和程序，用于通过抑制在移动计算网格时发生的挤压或变形来形成高质量的计算网格。解决方案：计算空间被划分为最接近对象60的区域的对象固定区域51，仅仅是规定数目的网格点的距离对象固定区域的区域的变形区域55，以及设置在物体固定区域51和变形区域55之间的缓冲区域53以及网格的移动矢量通过各区域中的不同的计算方法来计算。网格移动操作部分200确定移动矢量，使得网格点与对象一起在物体固定区域51中移动，并通过可变技术在变形区域55中计算移动矢量，并且计算运动矢量，使得网格矢量上述各个区域在缓冲区域53中顺利地继续。特别地，在缓冲区域53中，可以通过在边缘部分531和拐角部分533中不同的计算方法来计算运动矢量。 C）2010，JPO＆INPIT

10. 发明专利

JP2010026579A Computational grid forming device, computational grid forming method and program 有权
标题翻译：计算网格形成装置，计算网格形成方法和程序
公开(公告)号：JP2010026579A
公开(公告)日：2010-02-04
申请号：JP2008183799
申请日：2008-07-15
申请人： Toyota Central R&D Labs Inc , 株式会社豊田中央研究所
发明人： SATO NORIKAZU , INAGAKI MASAHIDE
IPC分类号： G06F17/50 , G06F19/00
摘要： PROBLEM TO BE SOLVED: To provide a computational grid forming device, a computational grid forming method and a program, for forming a high-quality computational grid by suppressing crush or deformation occurring when moving the computational grid. SOLUTION: When moving a grid, a movement vector computing part 210 determines a movement vector ΔPc wherein a grid point as a movement target satisfies the following request. That is, the movement vector ΔPc is computed such that grid lines are orthogonalized as thoroughly as possible (orthogonalization), that grid points are smoothly distributed on the grid line based on a prescribed rule (smoothing), that a shape of the computational grid in an initial state is maintained (reproducibility of the initial grid), that a grid point interval becomes a prescribed minimum interval or above (to secure minimum interval), and that the grid point interval becomes a maximum interval or below (to secure maximum interval), and the grid is moved according to the computed movement vector ΔPc. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种计算网格形成装置，计算网格形成方法和程序，用于通过抑制在移动计算网格时发生的挤压或变形来形成高质量的计算网格。解决方案：当移动网格时，运动矢量计算部件210确定作为移动目标的网格点满足以下请求的运动矢量ΔPc。也就是说，计算运动矢量ΔPc使得网格线尽可能彻底地正交（正交化），网格点基于规定的规则（平滑）在网格线上平滑地分布，计算网格的形状维持初始状态（初始网格的再现性），网格点间隔变为规定的最小间隔或以上（以确保最小间隔），并且网格点间隔变为最大间隔或最小间隔（以确保最大间隔），并且根据计算的运动矢量ΔPc移动网格。版权所有（C）2010，JPO＆INPIT

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