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1. 发明专利

JP2014187305A Luminescent device 有权
标题翻译：发光装置
公开(公告)号：JP2014187305A
公开(公告)日：2014-10-02
申请号：JP2013062488
申请日：2013-03-25
申请人： Toyoda Gosei Co Ltd , 豊田合成株式会社
发明人： TSUCHIYA YOSUKE , TAJIMA HIROYUKI , SHIMONISHI SHOTA , SENGOKU AKIRA
IPC分类号： H01L33/64 , C25D11/04
CPC分类号： H01L33/641 , H01L25/0753 , H01L33/50 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting device capable of effectively dissipating heat from both front and rear surfaces of a substrate.SOLUTION: A light-emitting device 10 according to one embodiment of the present invention includes: a thermally conductive substrate 11; a wiring electrode 14 formed on the thermally conductive substrate 11; a resist 15 covering the wiring electrode 14 except for terminals 14a and 14b; and a light-emitting element 16 installed in an element mounting region R of the thermally conductive substrate 11 and electrically connected to the terminal 14a of the wiring electrode 14. A heat dissipation hole 18 for exposing a surface of the thermally conductive substrate 11 is provided in that region of the resist 15 which is outside the element mounting region R.
摘要翻译：要解决的问题：提供一种能够有效地从基板的前表面和后表面散发热的发光装置。解决方案：根据本发明的一个实施例的发光装置10包括：导热基板11 ; 形成在导热基板11上的布线电极14; 除了端子14a和14b之外的覆盖布线电极14的抗蚀剂15; 以及安装在导热基板11的元件安装区域R中并电连接到布线电极14的端子14a的发光元件16.设置用于使导热基板11的表面露出的散热孔18 在元件安装区域R外的抗蚀剂15的区域中。

2. 发明专利

JP2014067782A Led chip mounting method 有权
标题翻译： LED芯片安装方法
公开(公告)号：JP2014067782A
公开(公告)日：2014-04-17
申请号：JP2012210570
申请日：2012-09-25
申请人： Toyoda Gosei Co Ltd , 豊田合成株式会社
发明人： TSUCHIYA YOSUKE , SHIMONISHI SHOTA , TAJIMA HIROYUKI , SENGOKU AKIRA
IPC分类号： H01L33/48
摘要： PROBLEM TO BE SOLVED: To provide an LED chip mounting method which can manufacture an LED device excellent in reliability without requiring cleaning after mounting.SOLUTION: A mounting method of an LED chip 30 according to one embodiment comprises the steps of: coating only a volatile solvent 20 on one surface of at least one of an electrode (adhesion layer) 33 of an LED chip 30 including a surface layer 33a consisting primarily of Au and a solder layer 33b in a lower layer, and a conducting pattern 12 of a wiring board 10 including a surface layer 12a consisting primarily of Au; loading the LED chip 30 on the wiring board 10 so as to position the electrode 33 on the conductive pattern 12 to temporarily fix the LED chip 30 by the volatile solvent 20; and bonding the conductive pattern 12 and the electrode 33 while vaporizing the volatile solvent 20 by heat treatment at a temperature at which the solder layer 33b melts.
摘要翻译：要解决的问题：提供一种可以制造可靠性优异的LED装置的LED芯片安装方法，而不需要在安装之后进行清洁。解决方案：根据一个实施例的LED芯片30的安装方法包括以下步骤：仅涂覆挥发性包括主要由Au构成的表面层33a和下层中的焊料层33b的LED芯片30的电极（粘合层）33的至少一个的一个表面的一个表面上的溶剂20以及布线板的导电图案12 包括主要由Au构成的表面层12a; 将LED芯片30装载在布线板10上，以将电极33定位在导电图案12上，以通过挥发性溶剂20临时固定LED芯片30; 并且在焊料层33b熔化的温度下通过热处理使挥发性溶剂20汽化，同时结合导电图案12和电极33。

3. 发明专利

JP2013026590A Light-emitting device manufacturing method 审中-公开
标题翻译：发光装置制造方法
公开(公告)号：JP2013026590A
公开(公告)日：2013-02-04
申请号：JP2011162847
申请日：2011-07-26
申请人： Toyoda Gosei Co Ltd , 豊田合成株式会社
发明人： SHIMONISHI SHOTA , TAJIMA HIROYUKI , TSUCHIYA YOSUKE , SENGOKU AKIRA
IPC分类号： H01L33/50
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting device manufacturing method which makes it possible to restrict color irregularities depending on view angles and also to reduce material and manufacturing costs.SOLUTION: A light-emitting element is mounted at the bottom of a recessed part of a case. Next, a mask having an opening corresponding to the light-emitting element mounted part is disposed on the top face of the case, and a mixed liquid consisting of phosphor particles dispersed in a volatile solvent is screen-printed to supply the mixed liquid to the periphery of the light-emitting element. After that, the mixed liquid is heated to evaporate the volatile solvent. Since screen printing is used to apply a coating of the mixed liquid to the light-emitting element mounted part, collective application of the mixed liquid is made possible and manufacturing cost is thereby reduced. Furthermore, since the phosphor is closely contacted with the light-emitting element by evaporating the volatile solvent into which phosphor particles have been mixed, a sufficient wavelength conversion rate can be obtained even when the amount of phosphor particles supplied is reduced, which results in reduced material costs.
摘要翻译：要解决的问题：提供一种可以根据视角来限制颜色不规则性以及降低材料和制造成本的发光装置制造方法。
解决方案：发光元件安装在壳体的凹部的底部。接下来，将具有与发光元件安装部相对应的开口的掩模设置在壳体的顶面上，并将由分散在挥发性溶剂中的荧光体粒子构成的混合液丝网印刷，将混合液供给到发光元件的周边。之后，加热混合液体以蒸发挥发性溶剂。由于使用丝网印刷来将混合液体的涂层施加到发光元件安装部分，所以可以集中应用混合液体，从而降低制造成本。此外，由于荧光体通过蒸发混入荧光体颗粒的挥发性溶剂而与发光元件紧密接触，所以即使当提供的荧光体颗粒的量减少时，也可以获得足够的波长转换率，这导致减少材料成本。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2014175416A Manufacturing method of light emitting device 有权
标题翻译：发光装置的制造方法
公开(公告)号：JP2014175416A
公开(公告)日：2014-09-22
申请号：JP2013045750
申请日：2013-03-07
申请人： Toyoda Gosei Co Ltd , 豊田合成株式会社
发明人： TSUCHIYA YOSUKE , TAJIMA HIROYUKI , SHIMONISHI SHOTA , SENGOKU AKIRA
IPC分类号： H01L33/54
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a light emitting device which forms irregularities having desired shapes on a surface of a sealing material and effectively improves the light extraction efficiency.SOLUTION: The manufacturing method of a light emitting device 1 according to one embodiment of the invention includes the steps of: sealing an LED chip 2 by a sealing material 5; and pressing a sheet 10 having multiple through holes 11 to the surface of the sealing material 5 while releasing air in the through holes 11 to the upper side and forming protrusions 6 which correspond to the through holes 11 on the surface of the sealing material 5.
摘要翻译：要解决的问题：提供一种在密封材料的表面上形成具有所需形状的凹凸的发光器件的制造方法，并有效地提高光提取效率。解决方案：根据一个方面的发光器件1的制造方法本发明的实施例包括以下步骤：用密封材料5密封LED芯片2; 并将具有多个通孔11的片材10压在密封材料5的表面上，同时将通孔11中的空气释放到上侧，并形成与密封材料5的表面上的通孔11相对应的突起6。

5. 发明专利

JP2013115271A Light emitting device 审中-公开
标题翻译：发光装置
公开(公告)号：JP2013115271A
公开(公告)日：2013-06-10
申请号：JP2011260789
申请日：2011-11-29
申请人： Toyoda Gosei Co Ltd , 豊田合成株式会社
发明人： SHIMONISHI SHOTA , TAJIMA HIROYUKI , TSUCHIYA YOSUKE , SENGOKU AKIRA
IPC分类号： H01L33/48
摘要： PROBLEM TO BE SOLVED: To provide a light emitting device which prevents the connection failure between an LED chip and wiring and improves optical output with a white resist.SOLUTION: A light emitting device 1 according to one embodiment of this invention includes: a substrate 3; wiring 4a, 4b formed on the substrate 3; an LED chip 2 connected with the wiring 4a and the wiring 4b and mounted on the substrate 3 through a flip chip method; and a white resist 5 formed at a region excluding a region located immediately below the LED chip 2 from among an exposed region on the substrate 3 where the wiring 4a, 4b are not formed.
摘要翻译：要解决的问题：提供一种防止LED芯片和布线之间的连接故障并且改善用白色抗蚀剂的光输出的发光装置。解决方案：根据本发明的一个实施例的发光器件1包括：衬底3; 形成在基板3上的布线4a，4b; 与配线4a和布线4b连接并通过倒装芯片方法安装在基板3上的LED芯片2; 以及形成在不形成有布线4a，4b的基板3的露出区域之外的位于LED芯片2正下方的区域以外的区域的白色抗蚀剂5。版权所有（C）2013，JPO＆INPIT

6. 发明专利

JP2013012557A Light-emitting device 有权
标题翻译：发光装置
公开(公告)号：JP2013012557A
公开(公告)日：2013-01-17
申请号：JP2011143606
申请日：2011-06-28
申请人： Toyoda Gosei Co Ltd , 豊田合成株式会社
发明人： SHIMONISHI SHOTA , TAJIMA HIROYUKI , TSUCHIYA YOSUKE , SENGOKU AKIRA
IPC分类号： H01L33/48
CPC分类号： H01L25/0753 , H01L33/60 , H01L33/62 , H01L2224/16 , H01L2924/07811 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting device featuring high luminance, high luminous quality and a compact size.SOLUTION: A light-emitting device 10 comprises: a wiring pattern 30 consisting of a wiring layer 15 formed on a substrate 11; an LED chip 24 connected to the wiring pattern 30; an encapsulation frame 19 formed so as to enclose the LED chip 24 on the substrate 11; a transparent encapsulation body 27 filled in the inside of the encapsulation frame 19, which encapsulates the LED chip 24; a light-emitting part 29 formed in an encapsulation region 28 which is filled with the encapsulation body 27 in an inside portion of the encapsulation frame 19; external electrodes 22a and 22b consisting of the wiring layer 15 which is formed on the outside of the encapsulation frame 19 on the substrate 11; a wall part 21 formed between the encapsulation frame 19 and the external electrodes 22a and 22b on the substrate 11; a slit 20 formed between the wall part 21 and the encapsulation frame 19; and a reflection layer 17 formed on the wiring layer 15 in the light-emitting part 29 via an insulation layer 14, which covers substantially the entire surface except a portion in the light-emitting part 29 where the LED chip 24 is disposed.
摘要翻译：要解决的问题：提供具有高亮度，高发光质量和紧凑尺寸的发光装置。解决方案：发光装置10包括：由形成在基板11上的布线层15组成的布线图案30; 连接到布线图案30的LED芯片24; 形成为将LED芯片24封装在基板11上的封装框架19; 填充在封装框架19的内部的透明封装体27，其封装LED芯片24; 形成在封装区域28中的发光部分29，其在封装框架19的内部填充有封装体27; 由形成在基板11上的封装框架19的外侧的布线层15构成的外部电极22a，22b; 在基板11上形成在封装框架19与外部电极22a，22b之间的壁部21; 形成在壁部21和封装框19之间的狭缝20; 以及反射层17，其经由绝缘层14形成在发光部29中的布线层15上，绝缘层14覆盖基本上覆盖发光部分29中布置有LED芯片24的部分的整个表面。版权所有（C）2013，JPO＆INPIT

7. 发明专利

JP2014022435A Light-emitting device and method for manufacturing the same 审中-公开
标题翻译：发光装置及其制造方法
公开(公告)号：JP2014022435A
公开(公告)日：2014-02-03
申请号：JP2012157412
申请日：2012-07-13
申请人： Toyoda Gosei Co Ltd , 豊田合成株式会社
发明人： TSUCHIYA YOSUKE , SHIMONISHI SHOTA , TAJIMA HIROYUKI , SENGOKU AKIRA
IPC分类号： H01L33/54
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting device having a dam material and capable of being downsized, and a method for manufacturing the same.SOLUTION: A method for manufacturing a light-emitting device 10 according to an embodiment of this invention includes the steps of: mounting LED chips 12 on a substrate 11; forming a translucent dam material which surrounds the LED chip 12 on the substrate 11 so as to come into contact with a part of the LED chip 12; and forming a sealing resin 14 which seals the LED chip 12 inside the dam material 13 on the substrate 11.
摘要翻译：要解决的问题：提供一种具有阻塞材料并能够小型化的发光装置及其制造方法。解决方案：根据本发明实施例的发光装置10的制造方法包括：步骤：将LED芯片12安装在基板11上; 形成围绕基板11上的LED芯片12以与LED芯片12的一部分接触的半透明的堤坝材料; 并且形成密封树脂14，其将LED芯片12密封在基板11上的阻挡材料13的内部。

8. 发明专利

JP2014041993A Light-emitting device and method of manufacturing the same 审中-公开
标题翻译：发光装置及其制造方法
公开(公告)号：JP2014041993A
公开(公告)日：2014-03-06
申请号：JP2013031811
申请日：2013-02-21
申请人： Toyoda Gosei Co Ltd , 豊田合成株式会社
发明人： TSUCHIYA YOSUKE , TAJIMA HIROYUKI , SHIMONISHI SHOTA , SENGOKU AKIRA
IPC分类号： H01L33/64 , H01L33/50 , H01L33/52
CPC分类号： H01L33/644 , H01L33/502 , H01L2224/48091 , H01L2224/48247 , H01L2924/1301 , H05B33/04 , H05B33/10 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To improve heat generation from phosphor particles in a light-emitting device.SOLUTION: A light-emitting device, in which a light-emitting element mounted on a substrate having on its surface a conductor layer connected to the outside is sealed, includes: a phosphor layer arranged above the light-emitting element; and a resin layer which is in contact with both the phosphor layer and the conductor layer and in which thermally conductive particles having a thermal conductivity of 100 W/m K or more and insulator or semiconductor characteristics are dispersed. Since the thermally conductive particles are dispersedly arranged between the phosphor layer as a heating element and the conductor layer as a heat dissipation path, thermal resistance between phosphor particles and the conductor layer is reduced to promote heat dissipation from the phosphor particles. Thus, deterioration due to heat of a member constituting the light-emitting device can be suppressed.
摘要翻译：要解决的问题：为了改善发光装置中的荧光体颗粒的发热。解决方案：一种发光装置，其中安装在其表面上具有连接到外部的导体层的表面的基板上的发光元件是包括：配置在发光元件上方的荧光体层; 以及与荧光体层和导体层接触的树脂层，其中分散有导热率为100W / m·K以上的导热性粒子和绝缘体或半导体特性。由于导热粒子分散配置在作为加热元件的荧光体层和作为散热路径的导体层之间，因此降低了荧光体粒子与导体层之间的热阻，促进了荧光体粒子的散热。因此，可以抑制由构成发光装置的构件的热引起的劣化。

9. 发明专利

JP2014017415A Led mounting substrate and manufacturing method of the same 有权
标题翻译： LED安装基板及其制造方法
公开(公告)号：JP2014017415A
公开(公告)日：2014-01-30
申请号：JP2012154827
申请日：2012-07-10
申请人： Toyoda Gosei Co Ltd , 豊田合成株式会社
发明人： TSUCHIYA YOSUKE , SHIMONISHI SHOTA , TAJIMA HIROYUKI , SENGOKU AKIRA
IPC分类号： H01L33/60
CPC分类号： H01L33/60 , H01L2224/13 , H05K1/0274 , H05K2201/09745 , H05K2201/2054
摘要： PROBLEM TO BE SOLVED: To provide an LED mounting substrate which forms a light emitting device achieving excellent light extraction efficiency, and to provide a manufacturing method of the LED mounting substrate.SOLUTION: An LED mounting substrate 10 according to one embodiment of this invention includes: a base substrate 11; a conductive pattern 12 which is located on the base substrate 11 and has recessed parts 12b on an upper surface; and a light reflection film 13 located in an inter-pattern gap 12a of the conductive pattern 12 on the base substrate 11 and the recessed parts 12b of the conductive pattern 12.
摘要翻译：要解决的问题：提供一种形成发光器件的LED安装基板，其获得优异的光提取效率，并提供LED安装基板的制造方法。解决方案：根据本发明的一个实施例的LED安装基板10包括基底基板11; 导电图案12，其位于基底基板11上并且在上表面上具有凹部12b; 以及位于基底基板11上的导电图案12的图案间间隙12a和导电图案12的凹部12b之间的光反射膜13。

10. 发明专利

JP2013157423A Semiconductor device manufacturing method and semiconductor device 有权
标题翻译：半导体器件制造方法和半导体器件
公开(公告)号：JP2013157423A
公开(公告)日：2013-08-15
申请号：JP2012016268
申请日：2012-01-30
申请人： Toyoda Gosei Co Ltd , 豊田合成株式会社
发明人： SHIMONISHI SHOTA , TAJIMA HIROYUKI , TSUCHIYA YOSUKE , SENGOKU AKIRA
IPC分类号： H01L21/52
CPC分类号： H01L24/80 , H01L24/08 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/2908 , H01L2224/29144 , H01L2224/29294 , H01L2224/29339 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49107 , H01L2224/73265 , H01L2224/81193 , H01L2224/83192 , H01L2224/83193 , H01L2224/83801 , H01L2224/83805 , H01L2224/92247 , H01L2924/00014 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/1033 , H01L2924/12041 , H01L2924/12042 , H01L2924/1301 , H01L2933/0066 , H01L2924/0105 , H01L2924/01079 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method and a semiconductor device, which can bond a semiconductor element and a substrate at a low heating temperature and which have good reliability.SOLUTION: A semiconductor device manufacturing method comprises a mounting step of mounting a semiconductor element having an Au-Sn layer on a substrate. The mounting step includes: a paste supply step of supplying an Ag paste having Ag nanoparticles on the substrate; an element placement step of placing the Au-Sn layer side of the semiconductor element on the Ag paste; and a bonding step of bonding the semiconductor element and the substrate by alloying the Au-Sn layer and the Ag paste. With this bonding mechanism, bonding reliability can be improved and low-temperature bonding is enabled.
摘要翻译：要解决的问题：提供半导体器件制造方法和半导体器件，其可以在低加热温度下结合半导体元件和衬底，并且具有良好的可靠性。解决方案：半导体器件制造方法包括安装步骤在衬底上具有Au-Sn层的半导体元件。安装步骤包括：膏体供应步骤，在基底上提供具有Ag纳米颗粒的Ag浆料; 将所述半导体元件的Au-Sn层侧放置在所述Ag糊料上的元件配置工序; 以及通过使Au-Sn层和Ag浆料合金化来接合半导体元件和基板的接合工序。通过该接合机构，可以提高接合可靠性，能够实现低温接合。

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