基本信息:
- 专利标题: Light emitting device
- 专利标题(中):发光装置
- 申请号:JP2011260789 申请日:2011-11-29
- 公开(公告)号:JP2013115271A 公开(公告)日:2013-06-10
- 发明人: SHIMONISHI SHOTA , TAJIMA HIROYUKI , TSUCHIYA YOSUKE , SENGOKU AKIRA
- 申请人: Toyoda Gosei Co Ltd , 豊田合成株式会社
- 专利权人: Toyoda Gosei Co Ltd,豊田合成株式会社
- 当前专利权人: Toyoda Gosei Co Ltd,豊田合成株式会社
- 优先权: JP2011260789 2011-11-29
- 主分类号: H01L33/48
- IPC分类号: H01L33/48
摘要:
PROBLEM TO BE SOLVED: To provide a light emitting device which prevents the connection failure between an LED chip and wiring and improves optical output with a white resist.SOLUTION: A light emitting device 1 according to one embodiment of this invention includes: a substrate 3; wiring 4a, 4b formed on the substrate 3; an LED chip 2 connected with the wiring 4a and the wiring 4b and mounted on the substrate 3 through a flip chip method; and a white resist 5 formed at a region excluding a region located immediately below the LED chip 2 from among an exposed region on the substrate 3 where the wiring 4a, 4b are not formed.
摘要(中):
要解决的问题:提供一种防止LED芯片和布线之间的连接故障并且改善用白色抗蚀剂的光输出的发光装置。 解决方案:根据本发明的一个实施例的发光器件1包括:衬底3; 形成在基板3上的布线4a,4b; 与配线4a和布线4b连接并通过倒装芯片方法安装在基板3上的LED芯片2; 以及形成在不形成有布线4a,4b的基板3的露出区域之外的位于LED芯片2正下方的区域以外的区域的白色抗蚀剂5。 版权所有(C)2013,JPO&INPIT