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1. 发明专利

JP2013067844A Film deposition apparatus 审中-公开
标题翻译：胶片沉积装置
公开(公告)号：JP2013067844A
公开(公告)日：2013-04-18
申请号：JP2011208635
申请日：2011-09-26
申请人： Toshiba Corp , 株式会社東芝
发明人： TAJI HIROKI , MATSUYAMA HIDETO
IPC分类号： C23C16/455
摘要： PROBLEM TO BE SOLVED: To provide a film deposition apparatus that can improve in-plane uniformity of a film thickness of a deposited film, for instance.SOLUTION: The film deposition apparatus for depositing a film on a substrate includes a stage, a shower head and a conductance adjustment wall. The stage is disposed inside a deposition chamber, has a substrate placed thereon and is operable to move upward and downward. The shower head has a planar width wider than that of the substrate, includes a plurality of holes in the surface thereof facing the stage and feeds a film deposition gas to a surface of the substrate through the plurality of holes. The conductance adjustment wall extends on a side of the stage from an outer edge of the shower head so as to adjust a gas conductance of the film deposition gas by the upward and downward movements of the stage on an outer side of the substrate. The shower head and the conductance adjustment wall are mutually integrated into one body.
摘要翻译：要解决的问题：提供例如可以提高沉积膜的膜厚度的面内均匀性的成膜装置。解决方案：用于在基板上沉积膜的成膜装置包括台，淋浴头和电导调节壁。该台设置在沉积室内，具有放置在其上的基板，并可操作以向上和向下移动。淋浴头具有比基板宽的平面宽度，其表面中的多个孔面向台面，并且通过多个孔将成膜气体供给到基板的表面。电导调节壁从淋浴头的外缘在舞台的一侧延伸，以便通过底座的外侧上的舞台的向上和向下运动来调节成膜气体的气体传导。淋浴头和电导调节壁相互整合成一体。版权所有（C）2013，JPO＆INPIT

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