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1. 发明专利

JP2010160756A Ic card 审中-公开
标题翻译： IC卡
公开(公告)号：JP2010160756A
公开(公告)日：2010-07-22
申请号：JP2009003856
申请日：2009-01-09
申请人： Toshiba Corp , 株式会社東芝
发明人： KAGA HIDEKAZU
IPC分类号： G06K19/077 , B42D15/10 , G06K19/07
摘要： PROBLEM TO BE SOLVED: To obtain an IC card in which breakage of an IC chip due to mechanical stress from the outside hardly occurs. SOLUTION: A reinforcing plate is provided on the IC chip, wherein the reinforcing plate has a reinforcing plate made of resin, and a reinforcing plate made of metal from the side of the IC chip. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了获得IC卡，其中由于来自外部的机械应力导致的IC芯片的破损几乎不发生。解决方案：在IC芯片上设置加强板，其中加强板具有由树脂制成的加强板和从IC芯片侧面的金属加强板。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2003080873A Printed matter and printing method therefor 有权
标题翻译：印刷物及其印刷方法
公开(公告)号：JP2003080873A
公开(公告)日：2003-03-19
申请号：JP2001280782
申请日：2001-09-14
申请人： Toshiba Corp , 株式会社東芝
发明人： KAGA HIDEKAZU
IPC分类号： B42D15/10 , B41M5/26 , B41M5/382 , B41M5/40 , B41M5/50 , B41M5/52 , C09D11/02
摘要： PROBLEM TO BE SOLVED: To provide printed matter showing high antiscuff strength and excellent image quality by improving an adhesive force between a UV-curable offset ink layer and an adjacent layer.
SOLUTION: A bisphenol A-type epoxy resin is added to the UV-curable offset ink.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：通过改善可UV固化的胶印油墨层和相邻层之间的粘合力来提供显示出高抗皱强度和优异图像质量的印刷品。解决方案：将双酚A型环氧树脂加入UV固化胶印油墨中。

3. 发明专利

JP2013067053A Transfer mold protective layer, method of manufacturing the transfer mold protective layer, personal authentication medium, and method of manufacturing the personal authentication medium 有权
标题翻译：转印保护层，制造转印保护层的方法，个人认证介质以及制造个人认证介质的方法
公开(公告)号：JP2013067053A
公开(公告)日：2013-04-18
申请号：JP2011206167
申请日：2011-09-21
申请人： Toshiba Corp , 株式会社東芝
发明人： KAGA HIDEKAZU
IPC分类号： B42D15/10
摘要： PROBLEM TO BE SOLVED: To provide sufficient adhesion between an image layer comprising UV curing ink and a protective layer in a personal authentication medium.SOLUTION: A transfer mold protective layer includes: a support, a protective layer formed on the support, and an adhesive layer formed on the protective layer. The protective layer includes a photo-curable resin, and is photo-cured in advance. The adhesive layer includes at least a polyacrylic acid or a copolymer of the polyacrylic acid and a polyacrylate. The transfer mold protective layer in accordance with an embodiment may be applied on a base material having an image layer formed of a UV ink including monofunctional polyacrylic acid ester monomer having at least an OH group, of a personal authentication medium.
摘要翻译：要解决的问题：在个人认证介质中提供包含UV固化油墨的图像层和保护层之间的充分粘附性。解决方案：转移模具保护层包括：支撑体，形成在支撑体上的保护层，以及形成在保护层上的粘合剂层。保护层包括光固化树脂，并且预先被光固化。粘合剂层至少包含聚丙烯酸或聚丙烯酸与聚丙烯酸酯的共聚物。根据一个实施方案的转移模具保护层可以应用于具有由包括个人认证介质的至少具有OH基团的单官能聚丙烯酸酯单体的UV油墨形成的图像层的基材。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2005115458A Ic card and method for manufacturing ic card 审中-公开
标题翻译： IC卡和制造IC卡的方法
公开(公告)号：JP2005115458A
公开(公告)日：2005-04-28
申请号：JP2003345815
申请日：2003-10-03
申请人： Toshiba Corp , 株式会社東芝
发明人： KAGA HIDEKAZU
IPC分类号： B42D15/10 , G06K19/07 , G06K19/077
摘要： PROBLEM TO BE SOLVED: To provide an IC card which can resist shock from the upper part of an LSI chip. SOLUTION: The IC card whose external form is formed by first base materials (11, 12) and second base materials (17, 18) is provided with an integrated circuit (13) having signal I/O terminals on one surface, pattern members (15) to be electrically connected to the signal I/O terminals of the integrated circuit (13), a plurality of bumps (14) for relaying electric connection between the signal I/O terminals of the integrated circuit (13) and the pattern members (15) and supporting the integrated circuit (13) on the pattern members (15) and a plurality of spacer members (103) arranged opposite to the bumps (14) through the integrated circuit (13) on the other surface of the integrated circuit (13) to support the integrated circuit (13) on the first base materials (11, 12) leaving partial space between the first base materials (11, 12) and the integrated circuit (13). COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供可以抵抗来自LSI芯片的上部的冲击的IC卡。解决方案：其外形由第一基材（11,12）和第二基材（17,18）形成的IC卡在一个表面上设置有具有信号I / O端子的集成电路（13）电连接到集成电路（13）的信号I / O端子的多个图形构件（15），用于中继集成电路（13）的信号I / O端子之间的电连接的多个凸点（14）和所述图案部件（15）并且在所述图案部件（15）上支撑所述集成电路（13），并且在所述图案部件（15）的另一表面上通过所述集成电路（13）与所述凸块（14）相对布置的多个间隔部件所述集成电路（13）支撑所述第一基底材料（11,12）上的所述集成电路（13），从而在所述第一基底材料（11,12）和所述集成电路（13）之间留下部分空间。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2011054032A Ic card and method for manufacturing the same 审中-公开
标题翻译： IC卡及其制造方法
公开(公告)号：JP2011054032A
公开(公告)日：2011-03-17
申请号：JP2009203855
申请日：2009-09-03
申请人： Toshiba Corp , 株式会社東芝
发明人： KAGA HIDEKAZU
IPC分类号： G06K19/077 , B42D15/10 , G06K19/07
摘要： PROBLEM TO BE SOLVED: To prevent an IC card from being broken by external stress by reducing internal stress held by an IC chip. SOLUTION: A multilayer reinforcing member 122 including a metal plate and a ceramic plate 125 is provided on the IC chip 121 of the IC card 10. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：通过减少由IC芯片保持的内部应力来防止IC卡被外部应力破坏。解决方案：在IC卡10的IC芯片121上设置包括金属板和陶瓷板125的多层加强构件122.版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2010238154A Ic card 审中-公开
标题翻译： IC卡
公开(公告)号：JP2010238154A
公开(公告)日：2010-10-21
申请号：JP2009088008
申请日：2009-03-31
申请人： Toshiba Corp , 株式会社東芝
发明人： KAGA HIDEKAZU
IPC分类号： G06K19/077 , B42D15/10 , G06K19/07
摘要： PROBLEM TO BE SOLVED: To provide an IC card having high resistance to impact stress. SOLUTION: The IC card includes: a first substrate; an IC chip provided on the first substrate; and a reinforcing plate provided facing the IC chip. The reinforcing plate has a curved shape, and the recessed side of the curved shape of the reinforcing plate faces an IC chip side. The recessed-side surface of the reinforcing plate is formed of an insulator. The reinforcing plate is constituted by laminating a rigid plate and a plates made of the insulator, and the recessed surface side of the curved shape of the reinforcing plate is made of the insulator. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供具有高抗冲击应力的IC卡。解决方案：IC卡包括：第一基板; 设置在所述第一基板上的IC芯片; 以及与IC芯片相对设置的加强板。加强板具有弯曲形状，并且加强板的弯曲形状的凹入侧面向IC芯片侧。加强板的凹入侧表面由绝缘体形成。加强板由层叠刚性板和由绝缘体构成的板构成，加强板的弯曲形状的凹面侧由绝缘体构成。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2007233431A Portable electronic device 审中-公开
标题翻译：便携式电子设备
公开(公告)号：JP2007233431A
公开(公告)日：2007-09-13
申请号：JP2006050533
申请日：2006-02-27
申请人： Toshiba Corp , 株式会社東芝
发明人： KAGA HIDEKAZU
IPC分类号： G06K19/077 , B42D15/10 , G06K19/07
摘要： PROBLEM TO BE SOLVED: To provide a portable electronic device improved in reliability with high resistance to mechanical stress. SOLUTION: The portable electronic device comprises an antenna wiring board, an LSI mounted on the antenna wiring board and performing exchange of data by communication with an external device, a surface substrate disposed in opposition to the antenna wiring board across the LSI, and a first release layer disposed at least between the LSI and the surface substrate in a non-fixed state to the surface substrate. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供具有高抗机械应力的可靠性提高的便携式电子设备。解决方案：便携式电子设备包括天线布线板，安装在天线布线板上的LSI，并通过与外部设备进行通信来执行数据交换，与横跨LSI的天线布线板相对配置的表面基板，以及至少在LSI和表面基板之间以非固定状态设置在表面基板上的第一释放层。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2006127254A Portable electronic device 审中-公开
标题翻译：便携式电子设备
公开(公告)号：JP2006127254A
公开(公告)日：2006-05-18
申请号：JP2004316328
申请日：2004-10-29
申请人： Toshiba Corp , 株式会社東芝
发明人： KAGA HIDEKAZU
IPC分类号： G06K19/077 , B42D15/10 , G06K19/07
摘要： PROBLEM TO BE SOLVED: To provide a portable electronic device that can increase durability to mechanical stress than before by maintaining electrical connection between an antenna and an electronic circuit device even under mechanical stress. SOLUTION: A contactless IC card comprises a patterned antenna 112 formed on an antenna wiring board 111, and an IC chip 101 mounted on the antenna wiring board 111 as electrically connected to the antenna 112. Both ends of the antenna 112 are lead parts for electrical connection to the IC chip 101 at bumps 102 and 103. Two lead parts are provided for each bump; lead parts 113a and 113b are provided for the bump 102 and lead parts 114a and 114b are provided for the bump 103. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：即使在机械应力下，通过保持天线和电子电路装置之间的电连接，提供一种能够比以前增加对机械应力的耐久性的便携式电子装置。解决方案：非接触式IC卡包括形成在天线布线板111上的图案化天线112和安装在天线布线板111上并与天线112电连接的IC芯片101.天线112的两端是引线用于在凸块102和103处与IC芯片101电连接的部件。为每个凸块提供两个引线部分; 为凸块102提供引线部分113a和113b，并为凸块103提供引线部分114a和114b。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2004155002A Method for uv offset printing and printed matter 审中-公开
标题翻译： UV偏移打印和打印的方法
公开(公告)号：JP2004155002A
公开(公告)日：2004-06-03
申请号：JP2002321759
申请日：2002-11-05
申请人： Toshiba Corp , 株式会社東芝
发明人： KAGA HIDEKAZU
IPC分类号： B41M1/06 , B41N10/04
摘要： PROBLEM TO BE SOLVED: To obtain a method for UV offset printing capable of obtaining a printing which is smooth and has no blurring or the like without decreasing curing properties of an ink, and obtaining an enough pearl gloss when a pearl pigment is used.
SOLUTION: In this UV offset printing, a UV ink is applied on an offset printing plate, and it is transferred on a blanket with a surface roughness Ra of ≤0.3 μm to form a transfer image, and the transfer image obtained is transferred again on a base material to form a UV ink image.
COPYRIGHT: (C)2004,JPO

10. 发明专利

JP2000263977A INDIVIDUAL CERTIFICATION MEDIUM, METHOD AND APPARATUS FOR PRODUCING THE SAME 失效
公开(公告)号：JP2000263977A
公开(公告)日：2000-09-26
申请号：JP7161499
申请日：1999-03-17
申请人： TOSHIBA CORP
发明人： KAGA HIDEKAZU
IPC分类号： B42D15/10 , B41M5/382 , B41M5/38
摘要： PROBLEM TO BE SOLVED: To easily obtain an individual certification medium having a genuineness judgment means which cannot be easily, visually identified and cannot be easily forged. SOLUTION: An ultraviolet curing control layer or a wetting control layer is provided on an image receiving layer 202 in addition to a visible pattern and an ultraviolet-curing resin coating liquid is applied onto layer 202 to form a coated film. The coated film is irradiated with ultraviolet rays to cure it, while the curing rate of the curing resin or wetting properties are being controlled, whereby a protecting layer 207 made of an ultraviolet curing resin is formed.

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