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    • 2. 发明专利
    • Polymer compound, photoresist composition including the polymer compound, and resist pattern formation method
    • 聚合物化合物,包括聚合物化合物的光电组合物和耐蚀图案形成方法
    • JP2011162796A
    • 2011-08-25
    • JP2011111661
    • 2011-05-18
    • Tokyo Ohka Kogyo Co Ltd東京応化工業株式会社
    • OGATA HISAYUKIMATSUMARU SHOGOKINOSHITA YOHEIHANEDA HIDEOSHIONO HIROHISASHIMIZU HIROAKIKUBOTA NAOTAKA
    • C08F220/10G03F7/039
    • PROBLEM TO BE SOLVED: To provide a polymer compound which can constitute a photoresist composition having an excellent resolution, forming a fine pattern with a good rectangularity, obtaining favorable resist characteristics even when acid strength of an acid generated from an acid generator is weak, and having favorable sensitivity, the photoresist composition using the polymer compound and a resist pattern formation method using the photoresist composition. SOLUTION: The polymer compound having alkali solubility changeable by the action of acid and contains a structural unit (a1) derived from a compound expressed by general formula (2) (in the formula, R 1 expresses a ≤20C aliphatic cyclic group, (n) expresses integers of 0 or 1-5, R 2 expresses hydrogen atom, fluorine atom or a ≤20C lower alkyl group or a ≤20C fluorinated lower alkyl group) and a structural unit (a3) derived from (meth)acrylic ester containing a lactone-containing single ring or polycyclic group. COPYRIGHT: (C)2011,JPO&INPIT
    • 待解决的问题:为了提供可以构成具有优异分辨率的光致抗蚀剂组合物的高分子化合物,形成具有良好矩形性的精细图案,即使当由酸产生剂产生的酸的酸强度为 弱,并且具有良好的灵敏度,使用高分子化合物的光致抗蚀剂组合物和使用光致抗蚀剂组合物的抗蚀剂图案形成方法。 解决方案:具有碱溶解性的高分子化合物可以通过酸的作用而变化,并含有由通式(2)表示的化合物(式中,R 1 )表示的结构单元(a1) 表示≤20C脂族环状基团,(n)表示0或1-5的整数,R 2表示氢原子,氟原子或≤20C低级烷基或≤20C氟化低级烷基 )和衍生自含有内酯单环或多环基团的(甲基)丙烯酸酯的结构单元(a3)。 版权所有(C)2011,JPO&INPIT
    • 8. 发明专利
    • Adhesive composition and adhesive film
    • 胶粘组合物和粘合膜
    • JP2009149819A
    • 2009-07-09
    • JP2007330853
    • 2007-12-21
    • Tokyo Ohka Kogyo Co Ltd東京応化工業株式会社
    • IMAI HIROFUMIMISUMI KOICHIOGATA HISAYUKIASAI TAKAHIROTAKAHASHI MOTOKI
    • C09J201/00C09J7/02C09J11/08H01L21/304
    • PROBLEM TO BE SOLVED: To provide an adhesive composition from which an adhesive having favorable peeling property (solubility) can be formed even when the adhesive is exposed to a high temperature environment, particularly, to an environment at 200°C or higher. SOLUTION: The adhesive composition comprises at least two kinds of resins having different mass average molecular weights from each other, and includes an adhesive resin having a larger mass average molecular weight and having adhesiveness, and a low molecular weight resin having a smaller mass average molecular weight. The obtained adhesive composition can give an adhesive having favorable peeling property even when the adhesive is exposed to a high temperature environment. COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:提供一种粘合剂组合物,即使当粘合剂暴露于高温环境,特别是在200℃或更高的环境下,也可以形成具有良好剥离性(溶解性)的粘合剂的粘合剂组合物 。 粘合剂组合物包含彼此具有不同质量平均分子量的至少两种树脂,并且包括具有较大质均分子量并具有粘合性的粘合剂树脂和具有较小粘合性的低分子量树脂 质均分子量。 得到的粘合剂组合物即使当粘合剂暴露于高温环境下时,也可以得到具有良好剥离性的粘合剂。 版权所有(C)2009,JPO&INPIT