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1. 发明专利

JPH11119007A BLANK AND BLACK MATRIX 失效
公开(公告)号：JPH11119007A
公开(公告)日：1999-04-30
申请号：JP27922497
申请日：1997-10-13
申请人： TOPPAN PRINTING CO LTD , ULVAC SEIMAKU KK
发明人： TANAKA KEIJI , TSUKAMOTO TAKETO , HONDA SATOSHI , SASAKI TAKAHIDE
IPC分类号： G02B5/00 , G02B1/11 , G02B1/115 , G02B5/20 , G02F1/1335
摘要： PROBLEM TO BE SOLVED: To obtain a blank having excellent productivity, high light shieldability and excellent low reflectivity by providing this blank with light shielding layers 2 contg. molybdenum and titanium. SOLUTION: The black matrix is constituted by forming light shielding layers 2 on a transparent substrate 1. At this time, the blank and black matrix have the light shielding layers 2 contg. at least the molybdenum(Mo) and the titanium(Ti). The light shielding layers 2 are composed of an alloy contg. the Mo alone or its compd. and the Ti alone or its compd. If the layers contain the Mo alone without the Ti, chemical resistances, such as water resistance and alkali resistance, are inferior but these resistances are improved by adding the Ti to the layers. The Ti is preferably incorporated into the layers at >=10 atm.% in order for the layers to sufficiently exhibit the resistance effects. If the layers contain the Ti alone without the Mo, a wet etching property degrades and patterning is difficult and, therefore, such compsn. is undesirable. The compsn. ratio of the Ti is preferably set at

2. 发明专利

JPH11119676A BLANK AND BLACK MATRIX 失效
公开(公告)号：JPH11119676A
公开(公告)日：1999-04-30
申请号：JP27585197
申请日：1997-10-08
申请人： ULVAC SEIMAKU KK , TOPPAN PRINTING CO LTD
发明人： HONDA SATOSHI , SASAKI TAKAHIDE , TANAKA KEIJI , TSUKAMOTO TAKETO
IPC分类号： G09F9/00
摘要： PROBLEM TO BE SOLVED: To obtain a black matrix containing no Cr which gives little influences on the environment and which has excellent corrosion resistance, excellent productivity, high light-shielding property and excellent low reflection and in which a pattern can be easily formed, by forming a thin film having a metal component essentially comprising Mo, Ni and Al for a light-shielding film or antireflection film. SOLUTION: This black matrix consists of a light-shielding film 2 which is directly formed as a single layer thin film essentially comprising a metal component of Mo, Ni and Al or Mo, Al and Ti and patterned on the surface of a transparent substrate 1, or the black matrix consists of a two-layer film comprising an antireflection film 3 and the light-shielding film 2. In order to obtain excellent corrosion resistance of the black matrix, especially excellent characteristics of acid resistance, alkali resistance and water resistance, the light-shielding film 2 or antireflection film 3 contains 40 to 85 atm.% Ni, 5 to 30 atm.% Mo and 10 to 30 atm.% Al, or 48 to 83 atm.% Ni, 10 to 37 atm.% Mo and 7 to 15 atm.% Ti.

3. 发明专利

JP2011238849A Solar cell module circuit sheet, solar cell module, and method of manufacturing solar cell module circuit sheet 有权
标题翻译：太阳能电池模块电路板，太阳能电池模块和制造太阳能电池模块电路的方法
公开(公告)号：JP2011238849A
公开(公告)日：2011-11-24
申请号：JP2010110433
申请日：2010-05-12
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： KUBOTA KENTARO , KUMAI KOICHI , YAMAGUCHI HIROTAKA , TSUKAMOTO TAKETO
IPC分类号： H01L31/042
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide a solar cell module circuit sheet capable of avoiding a problem such as a short circuit of a circuit pattern and the filling failure of sealing material in a clearance of the circuit pattern, and stably mounting a solar battery cell of a back contact system.SOLUTION: The solar cell module circuit sheet 10 is composed of an insulation layer 11 made from insulating resin; a barrier layer 13 arranged on a rear surface side of the insulation layer 11, and having a steam barrier property, an oxygen barrier property, and an insulating property; and a metal conductive layer 12 arranged on a front surface side of the insulation layer 11, and having the circuit pattern electrically connected to the solar battery cell. The metal conductive layer 12 is buried in a surface of the insulation layer 11, and the surfaces of the metal conductive layer 12 and the insulation layer 11 are positioned on the same plane.
摘要翻译：要解决的问题：提供一种太阳能电池模块电路板，其能够避免诸如电路图案的短路和电路图案的间隙中的密封材料的填充故障等问题，并且稳定地安装太阳能后接触系统的电池。解决方案：太阳能电池模块电路板10由绝缘树脂制成的绝缘层11构成; 布置在绝缘层11的背面侧的阻隔层13，具有隔热性，隔氧性和绝缘性; 以及布置在绝缘层11的前表面侧上的金属导电层12，并且电路图形与太阳能电池单元电连接。金属导电层12埋设在绝缘层11的表面，金属导电层12和绝缘层11的表面位于同一平面上。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2011181619A Solar cell module 审中-公开
标题翻译：太阳能电池模块
公开(公告)号：JP2011181619A
公开(公告)日：2011-09-15
申请号：JP2010043010
申请日：2010-02-26
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： KUMAI KOICHI , YAMAGUCHI HIROTAKA , KUBOTA KENTARO , TSUKAMOTO TAKETO , TOMONO TAKAO , YOSHIZAWA KENICHI
IPC分类号： H01L31/042
CPC分类号： H01L31/0516 , Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide a solar cell module provided with an insulating substrate controlling the generation of warpage in the solar cell module. SOLUTION: The solar cell module 1 has: a translucent substrate 2; a plurality of solar cells 5; and the insulating substrate 3 containing an electric wiring, wherein the plurality of cells 5 are sealed by a sealing layer 6 between the translucent substrate 2 and the insulating substrate 3. The translucent substrate 3 is a glass panel with a thickness of 2-4 mm, and the solar cells 5 are crystalline solar cells with a thickness of not more than 100-300 μm which are arranged staggered via gaps. This solar cell module 1 satisfies following formulas when the warpage (unit: μm) of the solar module 1 is Y, and the product of the elastic modulus E (unit: GPa) and the thermal expansion coefficient α (unit: ppm) of the insulating substrate 3 is X. A formula (1): Y≤12.88X+521.7. A formula (2): Y≥0.0324X+83.69. A formula (3): Y≤1,000, X≤700. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种设置有控制太阳能电池组件翘曲产生的绝缘基板的太阳能电池模块。太阳能电池模块1具有透光性基板2，多个太阳能电池5; 以及包含电布线的绝缘基板3，其中多个单元5由透光性基板2和绝缘基板3之间的密封层6密封。透光性基板3为厚度为2-4mm的玻璃面板太阳能电池5是通过间隙配置的厚度不大于100〜300μm的结晶太阳能电池。当太阳能电池模块1的翘曲（单位：μm）为Y时，该太阳能电池模块1满足下列公式，弹性模量E（单位：GPa）与热膨胀系数α（单位：ppm）的乘积绝缘基板3为X.式（1）：Y≤12.88X+ 521.7。公式（2）：Y≥0.0324X+ 83.69。公式（3）：Y≤1,000，X≤700。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2011159749A Solar cell module 有权
标题翻译：太阳能电池模块
公开(公告)号：JP2011159749A
公开(公告)日：2011-08-18
申请号：JP2010019454
申请日：2010-01-29
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： KUMAI KOICHI , YAMAGUCHI HIROTAKA , KUBOTA KENTARO , TSUKAMOTO TAKETO , TOMONO TAKAO , YOSHIZAWA KENICHI
IPC分类号： H01L31/042
CPC分类号： Y02A30/17 , Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide a solar cell module 1 constituted so that solar cell modules themselves, or a solar cell module and an electronic apparatus are easily connected to each other, and maintainability can be improved. SOLUTION: The solar cell module 1 including a wiring board 10 having wiring 12 formed on a top surface of an insulating base 11 so as to electrically connect solar cells 30 to one another, and a plurality of solar cells 30 arranged on the top surface of the wiring board 10 and electrically connected to the wiring 12, is provided with a junction box 60 having a frame 61 provided integrally with the wiring board 10 and fixed to at least the wiring board 10, power lines 62, 63 laid while enclosed by the frame 61, and electrically connected to the wiring 12, and a connection terminal electrically connected to the power lines 62, 63 and enabled to be electrically connected from outside the frame 61. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决问题：为了提供太阳能电池模块本身或者太阳能电池模块和电子设备彼此容易连接而构成的太阳能电池模块1，可以提高维护性。解决方案：太阳能电池模块1包括具有布线12的布线板10，布线板10形成在绝缘基底11的顶表面上，以将太阳能电池30彼此电连接，并且多个太阳能电池30布置在布线基板10的上表面与布线12电连接，设有接线盒60，接线盒60具有与布线板10一体设置并固定在至少布线板10上的框架61，电力线62,63被放置由框架61包围并电连接到布线12，以及电连接到电源线62,63并能够从框架61的外部电连接的连接端子。（C）2011，JPO＆INPIT

6. 发明专利

JP2011159748A Insulating substrate for solar cell, solar cell module, and method of manufacturing insulating substrate for solar cell 审中-公开
标题翻译：用于太阳能电池的绝缘衬底，太阳能电池模块以及太阳能电池制造绝缘衬底的方法
公开(公告)号：JP2011159748A
公开(公告)日：2011-08-18
申请号：JP2010019453
申请日：2010-01-29
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： KUMAI KOICHI , YAMAGUCHI HIROTAKA , KUBOTA KENTARO , TSUKAMOTO TAKETO , TOMONO TAKAO , YOSHIZAWA KENICHI
IPC分类号： H01L31/042
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide an insulating substrate for solar cell that prevents warpage making a reverse surface side convex from occurring in a back-contact type solar cell module, to provide a solar cell module using the insulating substrate for solar cell, and to provide a method of manufacturing the insulating substrate for solar cell. SOLUTION: The insulating substrate 10 for solar cell is composed of: an insulating material 11 made of a composite material containing fiber and resin and having solar cells arranged on a top surface thereof; and a circuit layer 12 laminated on the reverse surface of the insulating material 11 and electrically connected to the solar cell through-holes 11a bored in the insulating material 11 along a thickness. Here, uneven structures A are formed on the reverse surface of the insulating material 11. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种防止在背接触型太阳能电池模块中发生反面侧凸起的翘曲的太阳能电池用绝缘基板，提供使用太阳能电池用绝缘基板的太阳能电池模块并且提供一种制造太阳能电池用绝缘基板的方法。太阳能电池用绝缘基板10由以下部分构成：绝缘材料11由包含纤维和树脂的复合材料制成并且具有布置在其顶表面上的太阳能电池; 以及层叠在绝缘材料11的背面上的电路层12，并沿着厚度与绝缘材料11中钻出的太阳能电池通孔11a电连接。这里，在绝缘材料11的相反表面上形成不均匀结构A.版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2011159725A Base for solar cell module, method of manufacturing the same, and solar cell module 审中-公开
标题翻译：太阳能电池模块的基座，其制造方法和太阳能电池模块
公开(公告)号：JP2011159725A
公开(公告)日：2011-08-18
申请号：JP2010018974
申请日：2010-01-29
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： KUBOTA KENTARO , KUMAI KOICHI , YAMAGUCHI HIROTAKA , TSUKAMOTO TAKETO , TOMONO TAKAO , YOSHIZAWA KENICHI
IPC分类号： H01L31/042
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To prevent cracking of a solar cell during heating.
SOLUTION: A flexible insulating resin 27, which includes no meshed fiber, is bonded onto one surface of a PET film 26. The insulating resin 27 forming an insulating layer 2 is one of an epoxy resin, an epoxy acrylate resin, a polyimide resin, and a urethane resin. A conductive layer 28 composed of copper is provided on the surface of the insulating layer 2 on the opposite side from the PET film 26. The PET film 26 is peeled thereafter and a barrier layer 4 is provided on the surface of the insulating layer 2 where the PET film 26 is peeled to obtain a base for a solar cell module.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了防止在加热期间太阳能电池的破裂。解决方案：将不含啮合纤维的柔性绝缘树脂27粘接在PET膜26的一个表面上。形成绝缘层2的绝缘树脂27是环氧树脂，环氧丙烯酸酯树脂，聚酰亚胺树脂和聚氨酯树脂。在绝缘层2的与PET膜26相反的一侧的表面上设置由铜构成的导电层28.此后，剥离PET膜26，在绝缘层2的表面上设置阻挡层4，剥离PET膜26，得到太阳能电池模块用基材。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2011077367A Lead frame for led light emitting element 有权
标题翻译： LED发光元件引线框架
公开(公告)号：JP2011077367A
公开(公告)日：2011-04-14
申请号：JP2009228364
申请日：2009-09-30
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： MANIWA SUSUMU , TODA JUNKO , SAWADAISHI MASASHI , TSUKAMOTO TAKETO
IPC分类号： H01L33/54 , H01L23/48
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a lead frame for an LED light emitting element that has high adhesion between a sealing resin laminated on a filling resin and the lead frame. SOLUTION: The lead frame 80 for the LED light emitting element includes: a pad 2 having a mounting surface A on which an LED chip 10 is mounted, an electrode 3 having a connection surface C electrically connected to the LED chip 10; and the filling resin 4 for resin-molding the pad 2 and the electrode 3, and further includes a transparent sealing resin 5 laminated on a surface of the filling resin 4 where the mounting surface A and connection surface C are exposed where a part of at least one of the pad 2 and the electrode 3 is protruded from the surface of the filling resin 4. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种在层压在填充树脂上的密封树脂与引线框架之间具有高粘合性的LED发光元件的引线框架。解决方案：用于LED发光元件的引线框架80包括：安装有LED芯片10的安装面A的焊盘2，具有与LED芯片10电连接的连接面C的电极3; 以及用于树脂模制垫2和电极3的填充树脂4，并且还包括层叠在填充树脂4的表面上的透明密封树脂5，其中安装表面A和连接表面C暴露在一部分垫片2和电极3中的至少一个从填充树脂4的表面突出。版权所有：（C）2011，JPO＆INPIT

9. 发明专利

JP2011077366A Lead frame for led light emitting element, led package and manufacturing method of them 有权
标题翻译： LED发光元件引线框架，LED封装及其制造方法
公开(公告)号：JP2011077366A
公开(公告)日：2011-04-14
申请号：JP2009228363
申请日：2009-09-30
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： TODA JUNKO , MANIWA SUSUMU , SAWADAISHI MASASHI , TSUKAMOTO TAKETO
IPC分类号： H01L33/60 , H01L33/62
CPC分类号： H01L2224/48091 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide an LED light emitting element lead frame which has high reflectivity and high durability and can inexpensively and easily be manufactured, and to provide an LED package and a manufacturing method of them.
SOLUTION: The lead frame 80 is provided with a pad part 2 having a loading face A on which an LED chip is loaded, a lead part 3 having a connection face C which is arranged in almost parallel to the loading face A and is electrically connected to the LED chip, and filling resin 4 which resin-molds the pad part 2 and the lead part 3 in a state where the loading face A and the connection face C are exposed upward. In the frame, a reflector part 70 which circularly surrounds the loading face A and the connection face C and inclines so that it may expand a diameter toward an upper part is formed on a surface of the filling resin 4.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有高反射率和高耐久性并且可以廉价且容易地制造的LED发光元件引线框架，并且提供一种LED封装及其制造方法。引线框架80设置有具有加载面A的焊盘部分2，其上装载有LED芯片;引线部分3，其具有大致平行于装载面A布置的连接面C;以及电连接到LED芯片，以及填充树脂4，其在装载面A和连接面C向上暴露的状态下树脂模制焊盘部分2和引线部3。在框架中，在填充树脂4的表面上形成有环形地包围装载面A和连接面C并且倾斜使得其可以向上部扩大直径的反射器部分70。 C）2011，JPO＆INPIT

10. 发明专利

JP2011077275A Led package and manufacturing method of the same 审中-公开
标题翻译： LED封装及其制造方法
公开(公告)号：JP2011077275A
公开(公告)日：2011-04-14
申请号：JP2009226866
申请日：2009-09-30
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： TODA JUNKO , MANIWA SUSUMU , SAWADAISHI MASASHI , TSUKAMOTO TAKETO
IPC分类号： H01L33/60
CPC分类号： H01L2224/48091 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide an LED package with a reflector, in which light can be efficiently taken out from an LED light emitting element, and to provide a manufacturing method to easily and inexpensively manufacture the LED package. SOLUTION: One or more pad parts 1 loading LED chips 10 and the reflector 3 are formed by applying photoresist (photosensitive resin) to a metal plate, forming a resist pattern by pattern exposure and development processing on the photoresist, and performing etching work using ferric chloride. Silver plating is applied on a recess by etching. The chips 10 are loaded on the pad parts, the lead part and the reflector part. They are wire-bonded and the recess is filled with transparent sealing resin. A transparent resin face is protected after curing and a metal face at the opposite side is etched again so as to form an external connection terminal. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有可以从LED发光元件有效地取出光的反射器的LED封装，并且提供一种容易且廉价地制造LED封装的制造方法。解决方案：通过将光致抗蚀剂（感光树脂）施加到金属板上，形成一个或多个装载LED芯片10和反射器3的焊盘部分1，通过图案曝光和显影处理在光致抗蚀剂上形成抗蚀剂图案，并进行蚀刻工作使用氯化铁。通过蚀刻将镀银施加在凹部上。芯片10装载在焊盘部分，引线部分和反射器部分上。它们被引线接合，并且凹部填充有透明密封树脂。固化后保护透明树脂表面，再次蚀刻相对侧的金属面，形成外部连接端子。版权所有（C）2011，JPO＆INPIT

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