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1. 发明专利

JPH05178416A PLATE LIKE BODY TREATING DEVICE AND CONVEYING DEVICE 失效
公开(公告)号：JPH05178416A
公开(公告)日：1993-07-20
申请号：JP10876992
申请日：1992-04-01
申请人： TOKYO ELECTRON LTD , TEL KYUSHU KK
发明人： TATEYAMA KIYOHISA , AKUMOTO MASAMI , TAJIRI NAOYUKI , KIYOTA MAKOTO
IPC分类号： B65G1/07 , B65G49/07 , G03F7/20 , H01L21/027 , H01L21/30 , H01L21/677
摘要： PURPOSE:To realize compacting, and also carry out receipt/delivery of a plate like body at high speed in a treating device provided with a treating station and a receipt/delivery station of the plate like body. CONSTITUTION:A intermediate receipt/delivery stand 4 to serve also as a cooling mechanism is arranged so as to face a receiving and delivery port of an applying/developing station S1 for a semiconductor wafer, on the one hand, a receipt/delivery use conveying mechanism 5 provided with a freely advancing/ retreating pincette 6 is constituted so as to be rotatable freely as well as to pass through a lower position of the intermediate receipt/delivery stand 4, and a wafer centering positioning mechanism 65 is combined with the conveying mechanism 5. A receiving/loading stand 71 and a delivery/loading stand 72 are also arranged in a delivery station S2 so as to fix the positions, and buffer carriers C are arranged on both sides of a conveying passage. In the case where a main conveying passage is divided in the treating station S1, a receipt/delivery standby section is arranged on the uppermost stage of a treating section between main conveying arms 3.

2. 发明专利

JPH05178407A CONVEYING DEVICE 失效
公开(公告)号：JPH05178407A
公开(公告)日：1993-07-20
申请号：JP10876892
申请日：1992-04-01
申请人： TOKYO ELECTRON LTD , TEL KYUSHU KK
发明人： KIYOTA MAKOTO , ARAKI SHINICHIRO
IPC分类号： B65G1/00 , B65G49/07 , B65H7/14 , H01L21/67 , H01L21/677 , H01L21/68
摘要： PURPOSE:To avoid trouble when a material is conveyed by detecting whether or not delivery of the material being conveyed is normal between a conveyance use holding member and a housing section. CONSTITUTION:In a freely advancing/retreating conveyance use pincette 3 to take out or house a wafer W from or in a carrier C, a transmitting hole 33 to transmit light is formed in a limit position of a wafer loading allowable area, for example, several millimeters off this side step parts 32. On the other hand, a light emitting section 51 and a light receiving section 52 are arranged so that a light passage P can cross a place where the transmitting hole 33 is situated, for example, right in front of the carrier C when the pincette 3 is pulled out slightly from the maximum stroke position, and the confirmation is carried out on whether or not the wafer is loaded on a normal position when the pincette 3 is pulled out.

3. 发明专利

JPH01103903A OZONIZER 失效
公开(公告)号：JPH01103903A
公开(公告)日：1989-04-21
申请号：JP26103487
申请日：1987-10-16
申请人： TEL KYUSHU KK
发明人： MATSUMURA KIMIHARU , SATO TAKAZO , SERIKAWA SEIICHI , KIYOTA MAKOTO
IPC分类号： C01B13/11
摘要： PURPOSE:To obtain the title ozonizer capable of stably generating ozone with high efficiency by providing an air-permeable dielectric between two electrodes opposing to each other and impressing a voltage on them to generate ozone. CONSTITUTION:A high-frequency high voltage is firstly generated by a high- voltage high frequency power source 33, and supplied respectively to a high- voltage electrode 27 and a grounding electrode 22a through a radiating fin 32 and a cooling water outlet 25. A silent discharge is generated in the cell of the porous dielectric 23. At this time, the oxygen supplied from an oxygen source 31 is controlled by a gas flow controller 30, introduced into the cells of the dielectric 23, and sent in the direction as shown by the arrows. The electron generated by the discharge and accelerated by the high voltage is allowed to collide with an oxygen molecule, and an oxygen atom. radical is formed. The oxygen atom. radical combines with the adjacent oxygen molecule, and an ozone molecule is generated. The gas contg. the ozone molecule is discharged to the outside from a gaseous ozone outlet 29.

4. 发明专利

JP2003178956A SUBSTRATE PROCESSING SYSTEM 审中-公开
公开(公告)号：JP2003178956A
公开(公告)日：2003-06-27
申请号：JP2001378813
申请日：2001-12-12
申请人： TOKYO ELECTRON LTD
发明人： OGATA KUNIE , KIYOTA MAKOTO , AIUCHI TAKASHI , KAMIMURA RYOICHI
IPC分类号： H01L21/677 , H01L21/027 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To restrain substrates from stagnating at a check station so as to improve a substrate processing system in throughput, where the check station is connected to a processing station through the intermediary of a carrier station in the substrate processing system. SOLUTION: The throughput of the carrier station 2, the processing station 3, the interface station 4, and the check station 5 of an applying/developing device 100, and an exposure system 200 is obtained. When it is found that the check station 5 is the lowest of all the stations in throughput, wafers to be delivered to the check station 5 are reduced in number so as to reduce the check station 5 in frequency of measurement. As mentioned above, a processing time at the check station 5 is shortened to improve the check station 5 in throughput, by which the check station 5 is restrained from becoming the lowest in throughput. By this setup, wafers are restrained from stagnating between the check station 5 and the carrier station 2, and the substrate processing system can be improved in throughput as a whole. COPYRIGHT: (C)2003,JPO

5. 发明专利

JP2003142374A APPARATUS AND METHOD FOR FORMING RESIST PATTERN 审中-公开
公开(公告)号：JP2003142374A
公开(公告)日：2003-05-16
申请号：JP2001338229
申请日：2001-11-02
申请人： TOKYO ELECTRON LTD
发明人： KIYOTA MAKOTO , TANAKA MICHIO , AIUCHI TAKASHI , KAMIMURA RYOICHI
IPC分类号： G03F7/30 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide a resist-pattern forming apparatus which eases compensation work for compensation parameters that respond to measurement data on measurement items, such as resist film thickness and developed linewidth. SOLUTION: This resist-pattern forming apparatus comprises a coating/ developing apparatus 100, which comprises a coating unit 3A and a developing unit 3B and to which an exposure apparatus 200 is connected, and a parameter control unit 8 that controls these processes, where inspection units respectively inspect reflectance of the underlying film, resist-film thickness, developed linewidth, and the like. These measured data are inputted to a data-collection controller 7 from respective inspection units. The data-collection controller 7 transmits the data to the parameter control unit 8. In the control unit 8, compensation parameters are selected, based on the measured data on the measurement items, such as the resist-film thickness, and the compensation for the compensation parameters are conducted. The compensated parameters are transmitted to respective process units via the data-collection controller 7.

6. 发明专利

JP2003158056A PATTERN FORMING SYSTEM 审中-公开
公开(公告)号：JP2003158056A
公开(公告)日：2003-05-30
申请号：JP2001356139
申请日：2001-11-21
申请人： TOKYO ELECTRON LTD
发明人： KIYOTA MAKOTO , TANAKA MICHIO , AIUCHI TAKASHI , KAMIMURA RYOICHI
IPC分类号： G03F7/16 , B05C11/08 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To shorten a time necessary for correction by reducing inspecting process of the whole system, when correction parameters corresponding to measured data of measurement items like resist film thickness are corrected, in a pattern forming system provided with (n+1) pieces of pattern forming apparatus wherein an aligner is connected with coating developer. SOLUTION: One of the pattern forming apparatus is made a master apparatus A, and the residual (n) pieces apparatus are made slave apparatuses B1-Bn. In the master apparatus A, the measurement items like the resist film thickness are inspected with an inspection unit. On the basis of the measurement data, a main parameter control unit 8 obtains correction amount of the correction parameter like the number of revolutions of a spin chuck 31 of a coating unit 3A. In the slave apparatus B, a parameter control unit 9 corrects the correction amount obtained by the master apparatus A by using difference data between the master apparatus A and the slave apparatus B, thereby obtaining a correction amount of the apparatus B and correcting the correction parameter.

7. 发明专利

JP2003007605A Management system, host computer, information collecting/transmitting device, and management method 有权
标题翻译：管理系统，主机计算机，信息收集/发送设备和管理方法
公开(公告)号：JP2003007605A
公开(公告)日：2003-01-10
申请号：JP2001194325
申请日：2001-06-27
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： AIUCHI TAKASHI , KIYOTA MAKOTO , KAMIMURA RYOICHI , TANAKA MICHIO
IPC分类号： H01L21/027
摘要： PROBLEM TO BE SOLVED: To quickly and appropriately cope with the inspected results of a substrate.
SOLUTION: The coaters/developers M1-Mn of a factory 2 are respectively provided inspection devices K1-Kn. The factory 2 is provided with an AGC5 which is connected to the coaters/developers M1-Mn via a LAN 10 and can collectively control the coaters/developers M1-Mn. A host computer 8 on a vender 7 side is connected to the AGC 5 of the factory 2 via the Internet 9. The coaters/developers M1-Mn are respectively provided with data boxes for storing the information on the inspections of wafers W. The information stored in the data boxes are periodically collected to the AGC 5 and transmitted to the host computer 8 on the vender 7 side. A manager on the vender 7 side evaluates the treated states of the wafers W, based on the information on the inspections and, in case a failure exists, presents countermeasures, etc., to a manager on the plant 2 side, based on the information.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：快速适当地处理基板的检查结果。解决方案：工厂2的涂布机/显影剂M1-Mn分别设有检查装置K1-Kn。工厂2设置有AGC5，其通过LAN 10连接到涂布机/显影剂M1-Mn，并且可以共同控制涂布机/显影剂M1-Mn。供应商7侧的主计算机8通过因特网9连接到工厂2的AGC 5。涂布器/显影剂M1-Mn分别设置有用于存储关于晶片W检查的信息的数据盒。信息存储在数据盒中的数据盒被定期地收集到AGC 5并被发送到供应商7侧的主计算机8。供应商7方的经理根据检查信息对晶圆W的处理状态进行评估，并且如果存在故障，则根据该信息向工厂2侧的管理员提出对策等。

8. 发明专利

JP2003005826A System and method for management 审中-公开
标题翻译：系统和管理方法
公开(公告)号：JP2003005826A
公开(公告)日：2003-01-08
申请号：JP2001191926
申请日：2001-06-25
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： AIUCHI TAKASHI , KIYOTA MAKOTO , KAMIMURA RYOICHI , TANAKA MICHIO
IPC分类号： G06Q50/10 , G05B23/02 , G06Q50/00 , H01L21/027 , G06F17/60
摘要： PROBLEM TO BE SOLVED: To enable a vendor side manager to appropriately and quickly perform maintenance management of a remote coating and developing processor. SOLUTION: A plant 2 is provided with an AGC(Advanced Group Computer) 4 for collecting the information on a plurality of coating and developing processors M1 to Mn . The AGC 4 is connected to the coating and developing processors M1 to Mn through a LAN 9. A vendor 6 is provided with a host computer 7, and the host computer 7 is connected to the AGC 4 of the plant 2 through the Internet 8. A coating and developing processor 3-1 is provided with a data box for storing the information of each unit, etc., and can communicate with the AGC 4. The manager of the vendor 6 obtains detailed information and performs maintenance management of the coating and developing processors on the information in such a manner that the AGC 4 periodically collects the stored information of the coating and developing processors M1 to Mn and transmits the stored information to the host computer 7 in response to an instruction from the host computer 7.
摘要翻译：要解决的问题：使供应商侧管理者能够适当和快速地执行远程涂层和开发处理器的维护管理。解决方案：设备2设置有AGC（高级组计算机）4，用于收集关于多个涂覆和显影处理器M1至Mn的信息。 AGC 4通过LAN9连接到涂覆和显影处理器M1至Mn。供应商6设置有主计算机7，并且主计算机7通过因特网8连接到设备2的AGC 4。涂布显影处理器3-1具有用于存储每个单元的信息等的数据盒，并且可以与AGC4进行通信。供应商6的管理者获得详细信息并执行涂层的维护管理，以这样的方式开发处理器，使得AGC 4周期性地收集涂层和显影处理器M1至Mn的存储信息，并且响应于来自主计算机7的指令将存储的信息发送到主计算机7。

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