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1. 发明专利

JPS55164157A POLYPROPYLENE BIAXIAL ELONGATING COMPOSITE FILM 失效
公开(公告)号：JPS55164157A
公开(公告)日：1980-12-20
申请号：JP7117679
申请日：1979-06-08
申请人： TOKUYAMA SODA KK
发明人： IWASAKI MASATOSHI , FUJIYAMA MITSUYOSHI , HARADA KAZUFUMI
IPC分类号： B65D65/40 , B32B27/32

2. 发明专利

JPH0331137B2 失效
公开(公告)号：JPH0331137B2
公开(公告)日：1991-05-02
申请号：JP1766584
申请日：1984-02-04
申请人： TOKUYAMA SODA KK
发明人： IWASAKI MASATOSHI , SUZUKI JUNKICHI , AIMOTO YUKINOBU
IPC分类号： C08K3/26 , B32B15/08 , B32B15/085 , B32B27/32 , C08L7/00 , C08L21/00 , C08L23/00 , C08L23/14 , C08L23/16 , C08L23/26 , C08L51/00 , C08L51/02 , C08L101/00

3. 发明专利

JPS6234257B2 失效
公开(公告)号：JPS6234257B2
公开(公告)日：1987-07-25
申请号：JP11270680
申请日：1980-08-18
申请人： TOKUYAMA SODA KK
发明人： IWASAKI MASATOSHI , HARADA KAZUFUMI
IPC分类号： C08L23/10 , C08K3/26 , C08K3/34 , C08K5/09 , C08K5/10 , C08K5/11 , C08K5/17 , C08K5/20 , C08K13/02 , C08L7/00 , C08L21/00 , C08L23/00 , C08L51/00 , C08L51/02 , C08L77/00 , C08L101/00

4. 发明专利

JPS599564B2 JPS599564B2 - 失效
公开(公告)号：JPS599564B2
公开(公告)日：1984-03-03
申请号：JP3296375
申请日：1975-03-20
申请人： Tokuyama Soda Kk
发明人： IWASAKI MASATOSHI , KOYA YOSHA
IPC分类号： C08L23/00 , C08F255/00 , C08F255/02 , C08F291/00 , C08K5/10 , C08K5/14 , C08L23/12 , C08L23/18 , C08L101/00

5. 发明专利

JPH04156309A MANUFACTURE OF ALUMINUM NITRIDE GREEN SHEET 失效
公开(公告)号：JPH04156309A
公开(公告)日：1992-05-28
申请号：JP27927290
申请日：1990-10-19
申请人： TOKUYAMA SODA KK
发明人： IWASAKI MASATOSHI , TANIGUCHI HITOFUMI
IPC分类号： C04B35/622 , B28B1/30 , B28B17/02 , B28C1/04 , B28C1/10 , C04B35/00 , C04B35/581 , C04B35/632
摘要： PURPOSE:To reduce the scattering of the apparent density of sheets in respective lots by a method wherein the green sheet is manufactured again by mixing some part of once manufactured aluminum nitride green sheet with green sheet stock. CONSTITUTION:The aluminum nitride green sheet concerned is prepared by selecting their components from the following ranges or from 0.01-10 pts.wt. of surface-active agent, 0.1-30 pts.wt. of binder and 20-200 pts.wt. of organic solvent to 100 pts.wt. of aluminum nitride powder. Slurry obtained by mixing the above-mentioned components is formed into sheet and, after the solvent is evaporated, dried so as to obtain the green sheet concerned. Some part of said green sheet is again mixed with the raw material of said green sheet. As the green sheet to be mixed, waste sheet, which is developed at the cutting of the sheet in accordance with the dimensions of sintered body, can be used. The preferable mixing range of the waste sheet to 100 pts.wt. of the sum of the aluminum nitride powder, surface-active agent, binder and organic solvent is 1-50 pts.wt. or preferably 10-40 pts.wt.

6. 发明专利

JPS63299295A MANUFACTURE OF WIRING SUBSTRATE 失效
公开(公告)号：JPS63299295A
公开(公告)日：1988-12-06
申请号：JP13159687
申请日：1987-05-29
申请人： TOKUYAMA SODA KK
发明人： IWASAKI MASATOSHI
IPC分类号： B29C39/12 , B29C45/02 , B29C45/16 , B29L31/34 , H05K3/20
摘要： PURPOSE:To form a wiring pattern on the bottom of a recessed part in a board by a method wherein a resin is molded by using a molding frame for resin molding use where the wring pattern is plated on a molding face and the wiring pattern is transcribed onto the surface of a resin molded body. CONSTITUTION:A resist 3 is printed on a molding face to form a wiring pattern. The face is plated and a plated wiring pattern 2 is formed. The resist 3 is removed by using an exfoliation agent or the like; the plated wiring pattern is formed on a face of a core 1. It is preferable to previously form a continuous layer 7 whose adhesive performance is small against the molding face and is strong against a plated film before the plated wiring pattern is formed on the molding face. Then, a resin is molded by using a molding frame having the molding face where the plated wiring pattern 2 is formed; the plated wiring pattern is transcribed onto the surface of a resin molded body. That is to say, a cavity 4 is mated with the core 1; the resin is injected from a spool 5; the resin molded body 6 is obtained. When the continuous layer 7 has been formed, the continuous layer 7 is removed while it is brought into contact with an etching solution within an extent that the plated wiring pattern 2 is not dis solved.

7. 发明专利

JPS61101911A Manufacture of conductive film 失效
标题翻译：导电膜的制造
公开(公告)号：JPS61101911A
公开(公告)日：1986-05-20
申请号：JP22224084
申请日：1984-10-24
申请人： Tokuyama Soda Kk
发明人： IWASAKI MASATOSHI , FUJII KAZUO
IPC分类号： H01B5/14 , B32B9/00 , C23C14/08 , C23C14/34 , G02F1/133 , G02F1/1343 , H01B13/00

8. 发明专利

JPS60162645A COMPOSITE FILM 失效
公开(公告)号：JPS60162645A
公开(公告)日：1985-08-24
申请号：JP1766584
申请日：1984-02-04
申请人： TOKUYAMA SODA KK
发明人： IWASAKI MASATOSHI , SUZUKI JIYUNKICHI , AIMOTO YUKINOBU
IPC分类号： C08K3/26 , B32B15/08 , B32B15/085 , B32B27/32 , C08L7/00 , C08L21/00 , C08L23/00 , C08L23/14 , C08L23/16 , C08L23/26 , C08L51/00 , C08L51/02 , C08L101/00

9. 发明专利

JPS5855978B2 JPS5855978B2 - 失效
公开(公告)号：JPS5855978B2
公开(公告)日：1983-12-13
申请号：JP15491175
申请日：1975-12-26
申请人： Tokuyama Soda Kk
发明人： KOYA YOSHA , IWASAKI MASATOSHI , UTAMURA HOSAKU
IPC分类号： C08J9/06 , C08J9/04

10. 发明专利

JPS5846140B2 失效
公开(公告)号：JPS5846140B2
公开(公告)日：1983-10-14
申请号：JP5654278
申请日：1978-05-15
申请人： TOKUYAMA SODA KK
发明人： IWASAKI MASATOSHI , SUDO ICHIRO , FUJAMA MITSUYOSHI , HARADA KAZUFUMI , FUJII TSUNEO
IPC分类号： C08L23/00 , B32B27/32 , C08L7/00 , C08L21/00 , C08L23/12 , C08L51/00 , C08L51/02 , C08L77/00 , C08L101/00

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