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1. 发明专利

JP2002252152A ELECTRONIC COMPONENT 失效
公开(公告)号：JP2002252152A
公开(公告)日：2002-09-06
申请号：JP2001049231
申请日：2001-02-23
申请人： NEC TOKIN CERAMICS CORP
发明人： OGAWA KEIICHI
IPC分类号： H01G4/228 , H01G11/10 , H01G11/12 , H01G11/22 , H01G11/74 , H01G11/78 , H01G11/82 , H01G11/84 , H01G9/155
摘要： PROBLEM TO BE SOLVED: To provide a small short-height electronic component having a mold resin outer covering which will not break, even at a high temperature, such as in soldering re-flow condition, by reducing the number of parts in a chip-type electronic component having the structure of the mold resin outer covering. SOLUTION: The electronic component has at least a pair of electrode lead terminals 1 and 2 which make no contact with each other via an element layered product 3. The pair of terminals 1 and 2 consist of the same shape and the electrode lead terminals, and the mold resin outer coverings 4 are molded to be flush with each other. The terminals 1 and 2 have confronting parts 11, which are arranged so as to superpose and catch each other. The mold resin of the outer covering 4 flows into between the parts 1, and a pair of the terminals 1 and 2 are insulated from each other by this mold resin.

2. 发明专利

JP2004165537A Coin type electric double layer capacitor with terminal, and battery 审中-公开
公开(公告)号：JP2004165537A
公开(公告)日：2004-06-10
申请号：JP2002331769
申请日：2002-11-15
申请人： Nec Tokin Ceramics Corp , Nec Tokin Corp , Necトーキンセラミクス株式会社 , Necトーキン株式会社
发明人： OGAWA KEIICHI
IPC分类号： H01G11/78 , H01G11/74 , H01G11/82 , H01G11/84 , H01M2/10 , H01M2/30 , H01G9/016
CPC分类号： Y02E60/13
摘要： PROBLEM TO BE SOLVED: To provide a product that has been made more low-profile in a surface mountable coin type (button type) electric double layer capacitor and in a surface mountable coin type (button type) electric double layer battery.
SOLUTION: There are provided the surface mountable coin type (button type) electric double layer capacitor and the surface mountable coin type ( button type) battery that include lead terminals 4, 5 each attached to a large diameter electrode 2 and small diameter electrode 3 of a capacitor cell 1. In the capacitor and the battery, the lead terminal 4 attached to the large diameter electrode 2 is welded to a side electrode. The lead terminal 4 is equipped with a connecting part 4c processed so as to be approximately parallel with a soldering surface of a mounting substrate and similarly the lead terminal 5 attached to the small diameter electrode 3 is equipped with the connecting part 5c processed so as to be approximately parallel with a soldering surface of the mounting substrate, and then the connecting parts 4c, 5c are positioned in the same plane.
COPYRIGHT: (C)2004,JPO

3. 发明专利

JP2002231593A ELECTRIC DOUBLE-LAYERED CAPACITOR 失效
公开(公告)号：JP2002231593A
公开(公告)日：2002-08-16
申请号：JP2001029286
申请日：2001-02-06
申请人： NEC TOKIN CERAMICS CORP
发明人： OGAWA KEIICHI
IPC分类号： H01G11/00 , H01G11/74 , H01G11/78 , H01G11/80 , H01G11/84 , H01G9/155
摘要： PROBLEM TO BE SOLVED: To provide an electric double-layered capacitor with high productivity in which external appearance deterioration due to cracks of an insulating case is not generated and the number of components is small. SOLUTION: A capacitor element 9 is accommodated in a part between a metal case 8 and the insulating case 7 which is engaged with the metal case 8. A first electrode surface of the element 9 is brought into contact with the metal case, with which a first lead terminal 5 is brought into contact. A second lead terminal 6 is brought into contact with a second electrode surface of the element 9. The insulating case prevents a contact between the first lead terminal and the second lead terminal and a contact between the metal case and the second electrode surface. A notched part 12 is formed in at least one portion of the insulating case, thereby controlling the progress of cracks of the insulating case.

4. 发明专利

JP2001307968A ELECTRONIC PART 失效
公开(公告)号：JP2001307968A
公开(公告)日：2001-11-02
申请号：JP2000117372
申请日：2000-04-19
申请人： TOKIN CERAMICS CORP
发明人： OGAWA KEIICHI
IPC分类号： H01G11/10 , H01G11/12 , H01G11/74 , H01G11/78 , H01G11/82 , H01G9/155
摘要： PROBLEM TO BE SOLVED: To provide a chip type electronic part having a molded resin exterior structure for reducing the number of parts, preventing a crack at the molded resin exterior even under high-temperature environment, such as a solder re-flow condition, and reducing the height of the whole body. SOLUTION: The electronic part has at least one pair of electrode plate lead terminals 1 and 2, not coming in contact mutually. The pair of electrode plate lead terminals 1 and 2 have each C shaped hanging part 11 or 21, and the hanging part 11 and 21 are so located that these parts are overlapped and hung on each other. In a molding step, the mold resin of the mold resin exterior 4 is made to flow into a space between the hanging parts 11 and 21, and the pair of electrode plate lead terminals 1 and 2 are insulated thereby.

5. 发明专利

JP2001035751A ELECTRONIC COMPONENT 失效
公开(公告)号：JP2001035751A
公开(公告)日：2001-02-09
申请号：JP20678399
申请日：1999-07-21
申请人： TOKIN CERAMICS CORP
发明人： OGAWA KEIICHI
IPC分类号： H01G2/04 , H01G9/00 , H01G9/004 , H01G9/008
摘要： PROBLEM TO BE SOLVED: To provide an electronic component, where at surface-mounting on a fitting substrate, the stability in mounting is very superior, while facilitating reflow-soldering. SOLUTION: One electrode surface of a component element 52 is housed in a bottomed cylinder metal case 11 so as to contact the inner bottom part, and its opening part is sealed with a bottomed cylinder insulating case 14, which prevents contact and short between the side surface of the bottomed cylinder metal case 11 and the side surface of component element. A plate-like lead terminal 13 is led out of the electrode surface of the component element 52 penetrating through the insulating case 14, a plate-like lead terminal 12 provided on the outside surface of the insulating case, at the opening part of the cylinder metal case, is led out to the same end part as the end part, forming an electronic component main body. An insulating plate 17 is provided so as to contact the end surface, where a pair of plate-like lead terminals 12 and 13 of the electronic part main body are led out. The insulating plate 17 comprises an electrically insulating material having heat resistance, and through- holes 4 and 4 which penetrate the pair of plate-like lead terminals 12 and 13.

6. 发明专利

JP2001023867A ELECTRONIC PART 失效
公开(公告)号：JP2001023867A
公开(公告)日：2001-01-26
申请号：JP19362699
申请日：1999-07-07
申请人： TOKIN CERAMICS CORP
发明人： OGAWA KEIICHI
IPC分类号： H01G9/00 , H01G2/02 , H01G11/22 , H01G11/66 , H01G11/74 , H01G11/78 , H01G11/80 , H01G11/82 , H01G11/84 , H01G9/016 , H01G9/155
摘要： PROBLEM TO BE SOLVED: To obtain an electronic part capable of decreasing its height and the number of its parts, and also of implementing stable mounting to a printed board. SOLUTION: The electronic part has a bottomed metallic case 13 which incorporates therein one electrode surface of a part element in a manner coming in contact with the bottom of the case 13. The electronic part further includes an insulating portion that closes the opening of the case 13 and prevents the contact and shorting of the side surface of the case 13 with a side surface of the part element, and an integrally formed insulating mounting portion 1 that serves also as a mounting portion for preventing the contact and shorting of an attachment board with the case 13. The portion 1 is made from a heat- resistant electrical insulating material, and has a pair of lead terminals 15 and 17 formed by insert molding or the like. One of these terminals 15 and 17 is disposed so as to come in contact with the electrode surface of the part element, and the other with the case 13. For surface-mounting the electronic part, the tips of the terminals 15 and 17 for mounting to the board are folded in a manner matching respectively opposed surfaces of the board.

7. 发明专利

JP2000223375A ELECTRIC DOUBLE LAYER CAPACITOR AND MANUFACTURE THEREOF 失效
公开(公告)号：JP2000223375A
公开(公告)日：2000-08-11
申请号：JP1936199
申请日：1999-01-28
申请人： TOKIN CERAMICS CORP
发明人： OGAWA KEIICHI
IPC分类号： H01G11/00 , H01G11/10 , H01G11/12 , H01G11/66 , H01G11/78 , H01G11/80 , H01G11/82 , H01G11/84 , H01G9/155 , H01G9/016
摘要： PROBLEM TO BE SOLVED: To provide an electric double layer capacitor of a structure, wherein a crack in a molding resin packaging under high-temperature environment such as the condition of a solder reflow can be easily prevented from being generated. SOLUTION: A holding member 5, which is held to an element laminate material 3 and the outer side of a pair of lead integral type electrode plates 1 and 2, in a state that an insulation between the electrode plates 1 and 2 is maintained and is used for pressure-holding the laminated material 3 and the electrode plates 1 and 2 in the laminating direction of the laminated material 3 and the electrode plates 1 and 2, shows a continuous ring shape without joints and is held to the element laminate material 3 and the electrode plates 1 and 2, in such a way as to encircle the materiel 3 and the plates 1 and 2.

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