专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2006086216A Inductance element 审中-公开
标题翻译：电感元件
公开(公告)号：JP2006086216A
公开(公告)日：2006-03-30
申请号：JP2004267234
申请日：2004-09-14
申请人： Tdk Corp , Tdk株式会社
发明人： TOZAWA YOJI , ISHIFUNE MITSURU , OKAMOTO SATORU , SATO HIDEKAZU , MOCHIZUKI NOBUNORI , KUMAGAI OSAMI
IPC分类号： H01F17/00 , H01F17/02
摘要： PROBLEM TO BE SOLVED: To provide an inductance element which can be reduced in floating capacitance while at the same time being improved in Q value.
SOLUTION: A multilayer inductor L1 comprises a belt-like conductor 10, an outer package 20 which covers the belt-like conductor 10 and has an electric insulation property, and a pair of external electrodes 3 and 5 connected to both ends of the conductor 10, respectively. The outer package 20 has two first side faces 20a and 20b which intersect with the longitudinal direction at both ends of the conductor 10 and are not adjacent to each other, and second side faces which face the broad surface of the conductor 10. Each of the external electrodes 3 and 5 contains an electrode 3 or 5 which is formed along the widthwise direction of the conductor 10 on the first side face 20a or 20b while being substantially not formed on the second side face.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供可以减小浮动电容的电感元件，同时Q值提高。解决方案：多层电感器L1包括带状导体10，覆盖带状导体10的外部封装20并具有电绝缘性能，以及一对外部电极3和5，其连接到导体10。外包装20具有两个第一侧面20a和20b，它们在导体10的两端处与纵向方向交叉，并且彼此不相邻，并且面向导体10的宽表面的第二侧面。外部电极3和5包含在第一侧面20a或20b上沿着导体10的宽度方向形成的电极3或5，同时基本上不形成在第二侧面上。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2006032430A Coil component 有权
标题翻译：线圈组件
公开(公告)号：JP2006032430A
公开(公告)日：2006-02-02
申请号：JP2004205090
申请日：2004-07-12
申请人： Tdk Corp , Tdk株式会社
发明人： TOZAWA YOJI , SATO HIDEKAZU , KAWASAKI KUNIHIKO , MOCHIZUKI NOBUNORI , OKAMOTO SATORU , SASAKI KOZO , ISHIFUNE MITSURU , SATO SHINICHI , ABE KATSUMI , KUMAGAI OSAMI
IPC分类号： H01F17/00 , H01F27/29
CPC分类号： H01F27/292 , H01F17/0013 , H01F41/10
摘要： PROBLEM TO BE SOLVED: To provide a coil component capable of suppressing deterioration in a Q value while ensuring the mount strength.
SOLUTION: A laminated inductor L1 is provided with a coil 10 including a coil conductor 11 and lead-out conductors 13, 14 located at both ends of the coil conductor 11 and having the same width as that of the coil conductor 11, an outer package 20 covering the coil part 10 and having electric insulation, and external electrodes 3, 5 respectively electrically connected to the lead-out conductors 13, 14. The outer package 20 includes two first side faces 20a, 20b in parallel with the core axial direction of the coil conductor 11 and not adjacent to each other, and a second side face in crossing with the core axial direction of the coil conductor 11. The external electrodes 3, 5 respectively include first electrodes 3a, 5b formed over a direction orthogonal to a core axis direction of the coil conductor 11 on the first side faces 20a, 20b and not substantially formed on the second side face.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供能够抑制Q值劣化同时确保安装强度的线圈部件。解决方案：层叠电感器L1设置有线圈10，线圈10包括线圈导体11和位于线圈导体11的两端并具有与线圈导体11相同宽度的引出导体13,14，覆盖线圈部10并具有电绝缘体的外包装20以及分别电连接到引出导体13,14的外部电极3,5。外包装20包括与芯部平行的两个第一侧面20a，20b 线圈导体11的轴向并且彼此不相邻，以及与线圈导体11的芯轴方向交叉的第二侧面。外部电极3,5分别包括在正交方向上形成的第一电极3a，5b 相对于第一侧面20a，20b上的线圈导体11的芯轴方向，并且基本上不形成在第二侧面上。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2000252131A LAMINATED CHIP COMPONENT 失效
公开(公告)号：JP2000252131A
公开(公告)日：2000-09-14
申请号：JP5320099
申请日：1999-03-01
申请人： TDK CORP
发明人： MOCHIZUKI NOBUNORI , SHINOHARA RYOEI
IPC分类号： H01F27/00 , H01F27/29 , H01G4/252 , H01G4/30
摘要： PROBLEM TO BE SOLVED: To provide a laminated chip component which can increase the positional accuracy of a terminal electrode and can be made small in size. SOLUTION: External electrodes 4 and 5 connected to internal electrodes 2 and 3 are provided on an outer peripheral surface of the laminated chip component. Terminal electrodes 6 and 7 are formed into form of a conductor pattern, on at least one of front and rear surface of the chip part. Relaying internal electrodes 8 and 9 connected to the external electrodes 4 and 5 are built in the interior of the chip part in the vicinity of the terminal electrodes 6 and 7. The terminal electrodes 6 and 7 are connected to the relaying internal electrodes 8 and 9 associated therewith through via holes 10 and 11.

4. 发明专利

JPH11186045A NOISE REMOVAL PART 失效
公开(公告)号：JPH11186045A
公开(公告)日：1999-07-09
申请号：JP36579997
申请日：1997-12-22
申请人： TDK CORP
发明人： TAKATANI MINORU , MOCHIZUKI NOBUNORI , YASUDA KATSUHARU , WATANABE KUNIYASU
IPC分类号： H01F17/00 , H01F17/06
摘要： PROBLEM TO BE SOLVED: To provide a noise removal part for a based structure which is able to remove high frequency noise more accurately. SOLUTION: This noise removal part includes a beaded structure, having magnetic members 1 and 2 and conductors 3, 4 and 5 penetrating through the magnetic members, and also includes a grounding electrode 6 provided on substantially full outer surfaces of the magnetic members except for end faces for the lead-out to the outside of the conductors and not contacted with the conductors. Thereby a noise filter can be provided which is of a distribution constant type and of a simple structure, which is capable of reliably removing high frequency noise.

5. 发明专利

JPH11186040A LAMINATED NOISE FILTER 失效
公开(公告)号：JPH11186040A
公开(公告)日：1999-07-09
申请号：JP36580097
申请日：1997-12-22
申请人： TDK CORP
发明人： TAKATANI MINORU , MOCHIZUKI NOBUNORI , YASUDA KATSUHARU , WATANABE KUNIYASU
IPC分类号： H01F27/00 , H01F17/00 , H01G4/40 , H03H7/075
摘要： PROBLEM TO BE SOLVED: To provide an absorption type noise filter which can be manufactured easily on volume production basis. SOLUTION: This laminated noise filter includes a laminate 1 of plural laminated magnetic and conductor filters, the conductor filters being mutually connected to form an internal spiral conductor in a laminated-layer direction, terminal electrodes 4 provided on the laminate and connected to both ends of the internal conductor and to surround the internal conductor on the surface of the laminate, and a grounding electrode 3 provided on the laminate, so as not to make mutual be contact with the terminal electrodes. Thereby an absorption type laminated noise filter can be provided which can be easily and accurately manufactured on a volume production basis.

6. 发明专利

JPH11122024A LAMINATED CHIP ANTENNA 失效
公开(公告)号：JPH11122024A
公开(公告)日：1999-04-30
申请号：JP27848897
申请日：1997-10-13
申请人： TDK CORP
发明人： MOCHIZUKI NOBUNORI , ENDO TOSHIICHI , TAKATANI MINORU
IPC分类号： H01Q1/40 , H01Q1/36 , H01Q11/08
摘要： PROBLEM TO BE SOLVED: To provide a laminated chip antenna, capable of suppressing the level of radio signals to be transmitted so as not to affect human bodies and easily providing suitable directivity. SOLUTION: This antenna is provided with a base body 20 which is composed of plural kinds of materials with different dielectric constants or magnetic permeabilities and an antenna conductor 3. A part or the entire surface of the at least the back surface side of the base body 20 is constituted of a layer 2 composed of a high dielectric constant material or a high magnetic permeability material. The other part of the base body 20 is turned into a low dielectric constant material layer 1 to be put on a high dielectric constant material layer 2 or a low magnetic permeability material layer to be put on a high magnetic permeability material layer. The antenna conductor 3 is formed on at least one from among the inside, surface, and the boundary surface 13 with the high dielectric constant material layer 2 or the high magnetic permeability material layer of the low dielectric constant material layer 1 or of low magnetic permeability material layer. On the outer surface of the base body 20, a power feeding terminal 5 connected to a part of the antenna conductor 3 is provided.

7. 发明专利

JPH09304127A MULTIFUNCTIONAL SENSOR COMPONENT 失效
公开(公告)号：JPH09304127A
公开(公告)日：1997-11-28
申请号：JP14823696
申请日：1996-05-17
申请人： TDK CORP
发明人： TAKATANI MINORU , MOCHIZUKI NOBUNORI
IPC分类号： G01K7/16 , G01D21/00 , G01R33/02 , H05K1/14 , H05K1/16
摘要： PROBLEM TO BE SOLVED: To obtain a multifunctional sensor component which can be made small and thin and whose function can be expanded by a method wherein a plurality of kinds of sensors out of a temperature sensor, a humidity sensor, a pressure sensor, an optical sensor, a magnetic sensor and a heat sensor are stacked. SOLUTION: A shock sensor 1, a magnetic sensor 2, a humidity sensor 3, an optical sensor 4 and a temperature sensor 5 are piled up on a sheet so as to be bonded, or they are stacked continuously, an insulating layer 6 is added, and a laminated body 7 is formed. The sensors 4, 5 are stacked integrally on the rear side of the sensor 1. A semiconductor circuit 8 which constitutes an auxiliary circuit for the sensors 1 to 5 is integrated in such a way that terminals 9 on its side faces are connected to conductor patterns on the laminated body 7 by using a conductive adhesive or the like. External terminals 10 which are connected respectively to terminals at the sensors 1 to 5 are bonded and fixed to side faces of the stacked body 7 by using a conductive adhesive or the like. By this constitution, a multifunctional sensor component can be made small and thin, and it can be attached easily.

8. 发明专利

JPH06275248A MOUNTING STRUCTURE FOR LAMINATED BATTERY ONTO SUBSTRATE 失效
公开(公告)号：JPH06275248A
公开(公告)日：1994-09-30
申请号：JP8933293
申请日：1993-03-23
申请人： TDK CORP
发明人： TAKATANI MINORU , TABUCHI KATSUHIKO , MOCHIZUKI NOBUNORI
IPC分类号： H01M2/10 , H01M2/30 , H05K1/18
摘要： PURPOSE:To provide a mounting structure for a laminated battery capable of mounting the laminated battery onto various substrates with compatibility like chip-like electronic parts. CONSTITUTION:Terminal electrodes 7a, 7b for external connection are integrally formed on at least one of the side face and the fitting face of a laminated battery 7 made of a layered product of a positive electrode 21, a negative electrode 22, and an electrolyte or a separator 23 containing the electrolyte between them. Conductor films 15, 16 to be connected to the external connecting terminals of the laminated battery 7 are formed on a substrate 1. The terminal electrodes 7a, 7b are fixed to the conductor films 15, 16 on the substrate 1 with a conducting binder 20, and the laminated battery 7 is mounted on the substrate 1.

9. 发明专利

JPH06176928A LAMINATED ELECTRONIC COMPONENT 失效
公开(公告)号：JPH06176928A
公开(公告)日：1994-06-24
申请号：JP35271292
申请日：1992-12-10
申请人： TDK CORP
发明人： TAKATANI MINORU , MOCHIZUKI NOBUNORI , YASUDA KATSUHARU , KANEKO YOSHINOBU
IPC分类号： H01F27/00 , H01F17/00 , H01F15/00
摘要： PURPOSE:To prevent a crosstalk by forming between inductors a short ring that crosses a magnetic flux that passes between the inductors. CONSTITUTION:In a complex inductor 1, a conductor 11a formed of conductor paste, the same material of a conductor for forming a coil 3, is applied between inductors 2a and 2b so that its both ends may be exposed to outside of a laminate at the same time with application of the conductor for forming a coil 3, in the lamination process. Nextly, the conductor for forming a coil and an insulator are laminated and the laminate thus obtained is bonded and sintered into one body. Then, a closed-loop conductor 11b formed of conductor paste is so formed as to surround the external part of the laminate between the inductors 2a and 2b in the shape of a ring, being connected to both ends of the built-in conductor 11a, and is sintered into one body with the laminate. Thus, a short ring 11 is formed. By this, a magnetic flux going to an adjacent inductor is consumed as current by the short ring and thereby a crosstalk can be prevented. At the same time, the size of the component can be reduced and the manufacturing processes can be simplified.

10. 发明专利

JPH0613497A LAMINATED HYBRID INTEGRATED CIRCUIT COMPONENT 失效
公开(公告)号：JPH0613497A
公开(公告)日：1994-01-21
申请号：JP19298392
申请日：1992-06-27
申请人： TDK CORP
发明人： TAKATANI MINORU , MOCHIZUKI NOBUNORI
IPC分类号： H01L23/28 , H01L23/50 , H01L25/065 , H01L25/07 , H01L25/18
摘要： PURPOSE:To provide a construction capable of achieving a higher density and more compactness for parts of a laminated hybrid integrated circuit in which a semiconductor chip is placed on a laminated body and molded with a resin. CONSTITUTION:A semiconductor chip 1 is mounted on a laminated body 6 built in a passive element, the whole is molded with a resin 4, and a lead terminal 3 is applied to the parts of the laminated hybrid integrated circuit. The semiconductor chip 1 and the laminated body 6 are connected together with a flexible printed circuit 10 which is made of a conductor foil 12 adhered to a plastic film 11. Instead, the semiconductor chip 1 is connected to the laminated body 6 by the flip chip construction. Also, a connecting end portion to the printed substrate of lead terminal 3 is bent and formed in J-shape inside the molded body. Solder is sufficiently applied only to the lead terminal 3 in advance, the lead terminal with solder attached to the conductors on the printed substrate is placed and heated for soldering.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式