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1. 发明专利

JP2004213744A Memory device 审中-公开
公开(公告)号：JP2004213744A
公开(公告)日：2004-07-29
申请号：JP2002380720
申请日：2002-12-27
申请人： Tdk Corp , Tdk株式会社
发明人： HAYASHI KATSUHIKO
IPC分类号： G11C11/15 , H01L21/8246 , H01L27/105 , H01L43/08
CPC分类号： G11C11/16 , G11C11/5607 , G11C13/003 , G11C2213/75
摘要： PROBLEM TO BE SOLVED: To improve reliability of read-out of data while to increase memory capacity. SOLUTION: One block SB being a basic unit constituting a data read-out circuit is constituted of four memory cells MS1-MS4 connected electrically in series, four FETs S1-S4 connected in parallel to each of the memory cells MS1-MS4 respectively, and a FET S0 of which the one end is connected to one side of serial connection end of the memory cells MS1-MS4. Each memory cell MS1-MS4 is constituted of a TMR element having two TMR element parts connected electrically in series. The two TMR element parts are connected in series and constitutes a serial connection body. A sense current is made to flow in only one end of the serial connection body of the two TMR element parts, and after passing through successively these TMR element parts, and made to flow out from only the other end of the serial connection body. COPYRIGHT: (C)2004,JPO&NCIPI

2. 发明专利

JP2004063897A Capacitor for high frequency and high-frequency electronic component using the same 审中-公开
公开(公告)号：JP2004063897A
公开(公告)日：2004-02-26
申请号：JP2002221880
申请日：2002-07-30
申请人： Tdk Corp , Tdk株式会社
发明人： HAYASHI KATSUHIKO
IPC分类号： H01G4/38
摘要： PROBLEM TO BE SOLVED: To provide a capacitor for high frequency used in a high-frequency circuit, wherein self resonant frequency is shifted further to the high-frequency side and the frequency characteristics of the capacitor is made suited to wide band and a high-frequency electronic component using the same.
SOLUTION: A plurality of capacitors formed on a dielectric sheet are used to make one capacitor for high frequency, and the capacitors are connected to each other, because at least one of the respective electrodes constituting the capacitors is connected to each other in a line shape.
COPYRIGHT: (C)2004,JPO

3. 发明专利

JP2004031855A Chip capacitor for high frequency 审中-公开
公开(公告)号：JP2004031855A
公开(公告)日：2004-01-29
申请号：JP2002189288
申请日：2002-06-28
申请人： Tdk Corp , Tdk株式会社
发明人： HAYASHI KATSUHIKO
IPC分类号： H01G4/12 , H01G4/30
摘要： PROBLEM TO BE SOLVED: To provide a chip capacitor for high frequency, which is used in a high band above 1GHz, reduced irregularity in its capacitance and maintained stable and high precision of capacitance when it is in mass production.
SOLUTION: The chip capacitor for high frequency comprises a first dielectric sheet on which a first electrode pattern made of a plurality of linear conductors is formed, a second dielectric sheet on which a second electrode pattern made of the plurality of linear conductors is formed. Each linear conductor of the second electrode pattern is arranged in a space between linear patterns of the first pattern as seen through from the laminating direction of the chip capacitor for high frequency.
COPYRIGHT: (C)2004,JPO

4. 发明专利

JP2003045907A Method and apparatus for manufacturing electronic component 审中-公开
标题翻译：制造电子元件的方法和装置
公开(公告)号：JP2003045907A
公开(公告)日：2003-02-14
申请号：JP2001226979
申请日：2001-07-27
申请人： Tdk Corp , ティーディーケイ株式会社
发明人： HAYASHI KATSUHIKO
IPC分类号： H05K3/34 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing electronic components by which the fine patterning of electrode pads for connection becomes easy and the high density assembly of electronic components becomes possible, and to provide its manufacturing apparatus. SOLUTION: Sizes of metal small balls used are not more than 0.2 mm. A lower jig 2 having a plurality of through-holes 6 whose top surfaces are provided with recesses 4 of a diameter and a depth that enable an individual metal small ball to be dropped and put therein and an upper jig 3 having a plurality of through-holes 7 whose lower surfaces are provided with recesses 5 of a diameter and a depth that make more than one-half of the metal small ball 1 to be exposed are used as a mounting means of the metal small balls 1. Each metal small ball 1 is sucked and accommodated by each through-hole 6 of the lower jig 2. The upper jig 3 is made to face the lower jig 2, and the air 9 in the through-holes 7 of the upper jig 3 is sucked and compressed air 10 is sent to the recess 4 side from the through-holes 6 of the lower jig 2. Thus the metal small balls 1 are transferred to the recesses 5 of the upper jig 3. The upper jig sucking the metal small balls is made to face with a substrate or a chip component where they are collectively mounted and then the metal small balls are transferred to the substrate or the chip component by pushing out air.
摘要翻译：要解决的问题：提供一种用于制造电子部件的制造方法，通过该方法，用于连接的电极焊盘的精细图案化变得容易并且电子部件的高密度组装成为可能，并且提供其制造装置。解决方案：使用的金属小球尺寸不大于0.2 mm。具有多个通孔6的下夹具2，其上表面设置有能够使各个金属小球落下并放置的直径和深度的凹部4，以及具有多个通孔的上夹具3，作为金属小球1的安装构件，使用下表面设置有直径的凹部5和使金属小球1暴露的一半以上的深度的孔7，每个金属小球1 被下夹具2的各个通孔6吸引并容纳。上夹具3与下夹具2相对，并且上夹具3的通孔7中的空气9被吸入，压缩空气10 从下夹具2的通孔6向凹部4侧输送。因此，金属小球1被转移到上夹具3的凹部5.吸附金属小球的上夹具与一个衬底或芯片组件，它们被集中安装，然后是金属sm 通过推出空气将所有球转移到基板或芯片部件。

5. 发明专利

JP2002271104A HIGH-FREQUENCY SIGNAL SWITCHING DEVICE AND ANTENNA MULTICOUPLER USING THE SAME 失效
公开(公告)号：JP2002271104A
公开(公告)日：2002-09-20
申请号：JP2001068643
申请日：2001-03-12
申请人： TDK CORP
发明人： HAYASHI KATSUHIKO
IPC分类号： H01P1/15 , H04B1/50
摘要： PROBLEM TO BE SOLVED: To provide a high-frequency signal switching device which can more effectively remove higher harmonic components generated by a switching element. SOLUTION: This high-frequency signal switching device is provided with a transmission input terminal TX, a reception output terminal RX, and an antenna terminal ANT. The switching device is also provided with a switching means, which switches the connecting destination of the antenna terminal ANT between the transmission input terminal TX and reception output terminal RX, a transmission-side matching circuit MT, which is provided between the input terminal TX and antenna terminal ANT and matches the impedance between the terminals TX and ANT, and a reception-side matching circuit MR, which is provided between the output terminal RX and antenna terminal ANT and matches the impedance between the terminals RX and ANT.

6. 发明专利

JP2002224884A SOLDERING FLUX AND METHOD FOR FORMING SOLDER BUMP USING THE FLUX 失效
公开(公告)号：JP2002224884A
公开(公告)日：2002-08-13
申请号：JP2001020098
申请日：2001-01-29
申请人： TDK CORP
发明人： HAYASHI KATSUHIKO
IPC分类号： B23K3/00 , B23K3/06 , B23K35/363 , B23K101/40 , H01L21/60 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide soldering flux capable of being stably and easily applied even when a backing electrode is small. SOLUTION: In the soldering flux, metallic particles consisting of metal having a melting point higher than hat of solder are added in flux consisting of resin. Silver is preferable as the metallic particles. The particles of 0.1-10 μm, in particular, 0.1-5 μm diameters are preferable. Thus, since print characteristics are remarkably improved, the soldering flux can be stably applied even when the backing electrode is small.

7. 发明专利

JP2002223135A HIGH FREQUENCY AMPLIFIER AND HIGH FREQUENCY OUTPUT CIRCUIT USING THE SAME 失效
公开(公告)号：JP2002223135A
公开(公告)日：2002-08-09
申请号：JP2001020084
申请日：2001-01-29
申请人： TDK CORP
发明人： HAYASHI KATSUHIKO
IPC分类号： H01P5/18 , H01P5/12 , H03F3/24 , H03F3/60 , H03G3/30 , H04B1/04
摘要： PROBLEM TO BE SOLVED: To provide a high frequency amplifier the output impedance of which is not fluctuated even when an APC circuit is connected to the amplifier. SOLUTION: The high frequency amplifier is provided with an amplifier circuit 12 that receives an input signal and amplifies it, an output terminal 13, and an impedance conversion section 14 that is connected between the amplifier circuit 12 and the output terminal 13 and converts the output impedance of the amplifier circuit 12 when viewed from the output terminal 13 into an impedance of about 50 ohms, and the impedance conversion section 14 includes a high frequency transmission line 16 through which the output signal from the amplifier circuit 12 passes and a power level detection circuit 19 that detects a power level of the output signal passing through the high frequency transmission line 16. Since fluctuations in the output impedance due to the effect of the APC circuit are not caused according to the configuration above, impedance mismatching between the high frequency amplifier and a circuit of a post-stage can be prevented.

8. 发明专利

JP2002223044A METHOD FOR MANUFACTURING ELECTRONIC COMPONENT AND AGGREGATE BOARD 失效
公开(公告)号：JP2002223044A
公开(公告)日：2002-08-09
申请号：JP2001016122
申请日：2001-01-24
申请人： TDK CORP
发明人： HAYASHI KATSUHIKO
IPC分类号： H05K1/02 , H05K3/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component whose throughput is high and which is divided easily from an aggregate board. SOLUTION: The method for manufacturing the electronic component is provided with a lamination step which creates the aggregate board in such a way that a plurality of green sheets on which conductive patterns are formed respectively are laminated, a groove formation steps in which grooves 3 are formed on the aggregate board 1, a firing step in which the aggregate board 1 with the formed grooves 3 is fired, and a division step in which the fired aggregate board 1 is cut along the grooves 3 so as to be divided into individual electronic components 2. As a result, a load can be suppressed when the aggregate board 1 is cut.

9. 发明专利

JP2001144202A HIGH-FREQUENCY MODULE 失效
公开(公告)号：JP2001144202A
公开(公告)日：2001-05-25
申请号：JP32615699
申请日：1999-11-16
申请人： TDK CORP
发明人： HAYASHI KATSUHIKO
IPC分类号： H01L23/04
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive low-profile high frequency module having a high-frequency amplifier, which includes a substrate and a semiconductor chip, and an irreversible element such as an isolator. SOLUTION: In a high-frequency module, a high-frequency amplifier 3 is arranged next to, electrically connected to, and physically fixed to an irreversible element 4. The high-frequency amplifier 3 and the irreversible element 4 are covered with a metal cap 13. Since the irreversible element 4 having a large height is not placed on a substrate 5, this module becomes a low-profile one and the substrate does not need a space for a hole in which the irreversible element 4 is mounted.

10. 发明专利

JP2001044631A MULTILAYER BOARD 失效
公开(公告)号：JP2001044631A
公开(公告)日：2001-02-16
申请号：JP21291999
申请日：1999-07-27
申请人： TDK CORP
发明人： HAYASHI KATSUHIKO
IPC分类号： H05K1/11 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To acquire a multilayer board on which electrode patterns on the board surface can be formed in high density. SOLUTION: A dielectric substrate 10 is composed of laminated dielectric layers 11 to 14. Conductive wirings are provided in the dielectric substrate 10. Electrode patterns 31, 32, and 33 are arranged on the surface of the outermost dielectric layer 11. The outermost dielectric layer 11 comprises through hole electrodes 21 and 22. The through hole electrodes 21 and 22 arranged on the outermost dielectric layer 11 connect the electrode patterns 31 and 32 with the conductive wiring, and their diameter are smaller than the diameter of the through hole electrodes 23 and 24. The through hole electrodes 23 and 24 are formed in the dielectric substrate 10 and connects conductive wirings therebetween.

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