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1. 发明专利

JPS63153896A METHOD OF LAMINATING CERAMIC MULTILAYER BOARD 失效
公开(公告)号：JPS63153896A
公开(公告)日：1988-06-27
申请号：JP30107586
申请日：1986-12-17
申请人： TAMURA SEISAKUSHO KK
发明人： ABE YOSHINOBU , SUZUKI YUKIHARU
IPC分类号： H05K3/46

2. 发明专利

JP2001196249A DETECTOR EMPLOYING NON-CONTACT POWER FEEDING 失效
公开(公告)号：JP2001196249A
公开(公告)日：2001-07-19
申请号：JP2000007290
申请日：2000-01-17
申请人： TAMURA SEISAKUSHO KK
发明人： OKADA YOSHIO , SUZUKI YUKIHARU
IPC分类号： H01F38/14 , H02M3/28 , H02J17/00
摘要： PROBLEM TO BE SOLVED: To prevent a complicated structure and a variation in performance of a photo coupler caused by variety of installation, in which a photo diode and a photo transistor in the photo coupler are separately installed by using a board. SOLUTION: A primary side iron-core coil 2 is composed of a primary side core 2a, a photo transistor 5 installed in a through hole 2c, and a secondary side coil 3b. A secondary side iron-core coil 3 is composed of a secondary side core 3a, a photo diode 4 installed in a through hole 3c, and a secondary side coil 3b. A conversion coil 1 is composed of the primary side iron-core coil 2, the secondary side iron-core coil 3, and two infrared ray transmitting material 6. By arranging the relative position between the primary side iron-core coil 2 and the secondary side iron-core coil 3 adequately, the power on the primary side is sent effectively to the secondary side. The optical axis of the photo diode 4 and the photo diode 5 is made coincident to realize the maximum performance.

3. 发明专利

JPH0582301A SURFACE MOUNTING FIXED RESISTOR 失效
公开(公告)号：JPH0582301A
公开(公告)日：1993-04-02
申请号：JP40589490
申请日：1990-12-25
申请人： TAMURA SEISAKUSHO KK
发明人： OKA SADATO , SUZUKI YUKIHARU
IPC分类号： H01C1/012 , H01C3/00 , H01C7/00 , H05K3/34
摘要： PURPOSE:To provide a surface mounting fixed resistor in which a small resistance value less than 1OMEGA can be obtained. CONSTITUTION:A manganin wire 11 of a material for a standard resistance is formed in a normal size, and plated with solder, tin, nickel, silver, etc., thereby to form a soldering film 12. A fixed resistor in Fig. (A) is obtained by plating a soldering film 12 on the entire surface of the wire 11. Since the thickness of the film 12 is very thin, its resistance value cannot be ignored. When the entirely plated resistor is surface-mounted on a land of a board, a solder quantity on the land is decided to obtain a predetermined land pattern interval. Fixed resistors of Figs. (B), (C), (D) and (E) are obtained by partly plating the film 12 on one end and the other of a manganin wire 11.

4. 发明专利

JPH04171792A PART MOUNTING BOARD 失效
公开(公告)号：JPH04171792A
公开(公告)日：1992-06-18
申请号：JP29920490
申请日：1990-11-05
申请人： TAMURA SEISAKUSHO KK
发明人： SUZUKI YUKIHARU , OKA SADATO
IPC分类号： H05K3/34 , H05K3/30
摘要： PURPOSE:To prevent the fatigue failure of a solder joint by sticking an electrically insulating adhesive tape thicker than a land to a board side surface of leadless parts where an electrode is soldered on the board land. CONSTITUTION:An electrode 14 of lower leadless parts 12 is fixed onto a land 13 of a board 11 through a solder joint 15 formed by reflow-soldering. Further, upper leadless parts 12 are integrated with the lower leadless parts 12 through an electrically insulating adhesive tape 21. For materials of the tape 21 and the adhesive agent there are selected materials which are not melted and deformed upon reflow-soldering. The tape 21 is adapted to serve as a spacer and enough stand-off height is ensured between the board 11 and the leadless parts 12. Hereby, there can be ensured the enough thickness solder joint 15 between the land 13 and the electrode 14.

5. 发明专利

JPS6442371A METHOD FOR JOINING BY SOLDER 失效
公开(公告)号：JPS6442371A
公开(公告)日：1989-02-14
申请号：JP20049387
申请日：1987-08-11
申请人： TAMURA SEISAKUSHO KK
发明人： ABE YOSHINOBU , SUZUKI YUKIHARU
IPC分类号： B23K31/02 , B23K3/04 , C04B37/02 , H05K3/44
摘要： PURPOSE:To produce a base plate having superior heat conductivity and bonding strength, decreasing the shortage of solder by heating to melt a solder interposed between two plate materials to be jointed with a heating solid heating medium which is brought into contact with one of the plate materials, and thereafter quenching the plate materials with quenching the heating medium. CONSTITUTION:The heating solid heating medium 12, consisting of a highly heat-conducting metal of Al, etc., in which a cooling pipe 22 is connected with both side of openings of a through hole 21 pierced from one side surface to the other side surface, is mounted on a heating source 11 of a hot-plate, etc. A metal plate 13 as one of the plate materials is mounted onto the top face of the heating medium 12. A metallized ceramics plate 15 as another plate material is further positioned, through the solder 14, on the metal plate 13, and a vertically movable pressing-body 17 integrally attached with a silicone rubber 16 is provided thereon. Then, the heating source 11 is operated. By the generated heat, the metal plate 13, the solder 14, and the metallized ceramics plate 15 are heated, through the heating medium 12, to melt the solder 14. When both metal and ceramics plates 13, 15 are wetted with the molten solder, the heating is stopped by the signal from a thermocouple 24 and a solenoid valve 27 is opened to flow the cooling gas or liquid and thus the metal and ceramics plates 13 and 15 are quenched through the heating medium 11, and joined together.

6. 发明专利

JPS63153801A HIBRID INTEGRATED CIRCUIT SUBSTRATE 失效
公开(公告)号：JPS63153801A
公开(公告)日：1988-06-27
申请号：JP30107686
申请日：1986-12-17
申请人： TAMURA SEISAKUSHO KK
发明人： ABE YOSHINOBU , SUZUKI YUKIHARU
IPC分类号： H01C7/00 , H05K1/16

7. 发明专利

JP2001093762A TRANSFORMER HAVING MAGNETIC AIR WALL 失效
公开(公告)号：JP2001093762A
公开(公告)日：2001-04-06
申请号：JP27156599
申请日：1999-09-27
申请人： TAMURA SEISAKUSHO KK
发明人： TSUKAMOTO TOSHIO , SUZUKI YUKIHARU , KOBAYASHI TOSHIHIKO , KURIHARA ISATO , KATADA KIYOSHI
IPC分类号： H01F38/14 , H01F27/24 , H01F30/00
摘要： PROBLEM TO BE SOLVED: To prevent having a magnetic air wall where the coupling coefficient drops due to the occurrence of the magnetic air wall in units of several mm between primary and secondary cores. SOLUTION: 1 shows a disc-like primary core 1, 2 shows a disc-like secondary core, the dotted line of a vertical axis shows the dimension in the height direction, the horizontal axial shows the radial dimension of the core, and C1 shows the radial dimension of the primary core. For the cores 1 and 2, only the cross section of the right half of the vertical axis is shown. The magnetic air wall between the primary and secondary cores is 1 mm, and the radial dimension of the primary coil is changed to check the change in the coupling coefficient. The thickness of the primary core and the secondary core are both 10 mm, and the diameter of the secondary core is 24 mm. The dimensions of the primary coil and the secondary coil are 36 mm in the inside diameter, 40 mm in the outside diameter, and 3 mm in the height of winding. By numerical value analysis, when a magnetic air wall exists in the magnetic circuit forming a magnetic path, the coupling coefficient between the primary and secondary cores can be made maximum by arranging them, so that the sectional areas of the facing cores are about 1:1 to 1:1.2.

8. 发明专利

JPS6445783A SUBSTRATE HAVING GOOD THERMAL CONDUCTIVITY 失效
公开(公告)号：JPS6445783A
公开(公告)日：1989-02-20
申请号：JP20049587
申请日：1987-08-11
申请人： TAMURA SEISAKUSHO KK
发明人： ABE YOSHINOBU , SUZUKI YUKIHARU
IPC分类号： B23K1/00 , C04B37/02 , H05K1/05
摘要： PURPOSE:To contrive prevention of misregistration between a ceramics and a metallic plates in soldering, by joining the ceramics plate to the metallic plate with a brazing material having a higher melting point than that of a solder for fusing parts. CONSTITUTION:The surface of a molybdenum plate 11 as a metallic plate is roughened to form a nickel plating layer 12 as a brazing ground material. A tinning layer 13 having 193-419 deg.C melting point as a brazing material is then formed on the surface thereof. On the other hand, conductor circuits 22 and a resistor part 23 are formed on an alumina ceramic plate 21 as a ceramic plate for loading parts with a solder and the surface is subsequently roughened to form a copper plating layer 31. A nickel plating layer 32 is then formed on the surface of the copper plating layer 31. A tinning layer 13 as a brazing material is subsequently formed thereon by electrotinning. Tinning layers 13 of both the plate members are then opposed, superposed and heated at the melting point of the tinning layers 13 or above and the sides of the molybdenum plate 11 and the ceramics plate 21 are brazed and joined with the molten tin.

9. 发明专利

JPS6445782A SUBSTRATE HAVING GOOD THERMAL CONDUCTIVITY 失效
公开(公告)号：JPS6445782A
公开(公告)日：1989-02-20
申请号：JP20049487
申请日：1987-08-11
申请人： TAMURA SEISAKUSHO KK
发明人： ABE YOSHINOBU , SUZUKI YUKIHARU
IPC分类号： B23K1/19 , C04B37/02 , H05K1/05
摘要： PURPOSE:To obtain an excellent substrate having good thermal conductivity, by forming a metallic plate from an alloy containing either of molybdenum and tungsten. CONSTITUTION:The surface of a metallic plate 11 containing at least either of molybdenum and tungsten is roughened to form a nickel plating layer 12 as a brazing ground material and a tinning layer 13 as a brazing material is then formed on the surface thereof. On the other hand, the surface of a ceramics plate 21 is similarly roughened to form a copper plating layer 22 as a metallized metallic layer by electroless copper plating. A nickel plating layer 23 as a brazing ground is then formed on the surface of the copper plating layer 22 and a tinning layer 13 is subsequently formed on the surface thereof. The two plate members are opposed with the tinning layers 13, superposed and heated at the melting point of the tinning layers 13 which are the brazing material or above to braze and join the metallic plate 11 to the metallized ceramics plate 21. After brazing, the whole is quenched to complete the aimed substrate having good thermal conductivity.

10. 发明专利

JPS62244197A MANUFACTURE OF MULTILAYER BOARD USING BAKED CERAMIC PLATE 失效
公开(公告)号：JPS62244197A
公开(公告)日：1987-10-24
申请号：JP8865386
申请日：1986-04-17
申请人： TAMURA SEISAKUSHO KK
发明人： ABE YOSHINOBU , SUZUKI YUKIHARU
IPC分类号： H05K3/46

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