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1. 发明专利

JPH0772111A OXYGEN CONCENTRATION MEASURING METHOD AND APPARATUS 失效
公开(公告)号：JPH0772111A
公开(公告)日：1995-03-17
申请号：JP15950193
申请日：1993-06-29
申请人： TAMURA SEISAKUSHO KK
发明人： ABE YOSHINOBU , FURUNO MASAHIKO , SUGIYAMA NAOKI , KATSUSE JUNICHI , OKANO TERUO , MIYAMOTO YASUO
IPC分类号： G01N1/00 , G01N1/22 , G01N27/26 , G01N27/28 , G01N27/409
摘要： PURPOSE:To provide a method which can automatically detect saturation of a combustible gas of an activated charcoal filter with an oxygen concentration meter without the use of an indicator containing hexavalent chromium. CONSTITUTION:Normally, a solenoid valve 13 is opened while a solenoid valve 14 is closed. A combustible gas in a measuring gas sampled with an N2 soldering device 1 is removed with a plurality of activated charcoal filters 2a and 2b in a main piping 11 and the concentration of oxygen in the measuring gas is measured with an oxygen concentration meter 3. Then, the solenoid valves 13 and 14 are switched periodically to operate so that a measuring gas supply path to the oxygen concentration meter 3 is changed over to a piping 12 for inspection from the main piping 11. When a filter 2a on the upstream side is saturated with the combustible gas, the combustible gas in the measuring gas enters the oxygen concentration meter 3 merely passing through the filter 2a. As the oxygen concentration meter 3 consumes oxygen by the combustion of the combustible gas, it indicates a lower oxygen concentration measured value as compared with the case where the combustible gas is with a plurality of filters 2a and 2b. The oxygen concentration meter 3 detecting a difference in the results outputs an alarm or the like.

2. 发明专利

JPH0550217A REFLOW SOLDERING DEVICE 失效
公开(公告)号：JPH0550217A
公开(公告)日：1993-03-02
申请号：JP1335491
申请日：1991-02-04
申请人： TAMURA SEISAKUSHO KK
发明人： OKANO TERUO , SUZUKI KIYOSHI , ONOZAKI JUNICHI , FUJII MAMORU , ABE YOSHINOBU , SOTONO KAZUO , UCHIDA TOSHIYA
IPC分类号： B23K1/008 , B23K101/42 , F27B9/10 , F27B9/36 , H05K3/34
摘要： PURPOSE:To improve a temperature rise speed and uniformity of a substrate by constituting the structure so that high temperature gas for reflow blown to a substrate loaded with parts can circulate smoothly. CONSTITUTION:In an inner bottom part of a reflow furnace 11, an air blower 12 is provided, and a guide plate 13 is provided along an inner wall of one side of the reflow face from the periphery of this air blower 12. By this guide plate 13, a heater 15 is provided in an air current ascending passage 14 divided and formed in the furnace. In the upper end part of this passage 14, an inclined nozzle 16 is provided continuously. In a bottom part of the reflow furnace 11, an inert gas injecting port 17 for nitrogen gas, etc., is provided. To the substrate surface of a substrate W loaded with parts carried into the reflow furnace 11 by a conveyor 21, the inclined nozzle 16 blows high temperature gas obliquely from one side. Accordingly, the high temperature gas blown to the substrate surface, and gas which is reflected from the substrate surface and circulates to the air blower 32 do not interfere with each other but flow smoothly. By heat of the high temperature gas, solder paste of the substrate W loaded with parts is reflowed.

3. 发明专利

JPH04322878A INERT GAS ATMOSPHERE REFLOW SOLDERING DEVICE 失效
公开(公告)号：JPH04322878A
公开(公告)日：1992-11-12
申请号：JP1335591
申请日：1991-02-04
申请人： TAMURA SEISAKUSHO KK
发明人： ABE YOSHINOBU , SUZUKI KIYOSHI , OKANO TERUO , ONOZAKI JUNICHI , FUJII MAMORU , SOTONO KAZUO , UCHIDA TOSHIYA
IPC分类号： B23K1/008 , B23K31/02 , B23K101/42 , H05K3/34
摘要： PURPOSE:To curtail the nitrogen gas quantity for preventing oxidation, injected into a reflow furnace. CONSTITUTION:Nitrogen gas is injected into a reflow furnace 11 from a nitrogen gas injecting part 17, and by a heater 12 and a stirring machine 13, a nitrogen gas atmosphere of a high temperature is formed in the furnace. A work W is carried into the atmosphere by a conveyor 14 and reflow soldering is executed. In a work carrying-in part 15 of the reflow furnace 11, and infrared-ray lamp 31 and an infrared-ray sensor 32 for detecting a work are provided. In a gas injection duct line 24 connected to the nitrogen gas injecting part 17, a solenoid valve 33 is provided. This solenoid valve 33 is switched and operated through an amplifier 34 by a work existence/advance signal from the sensor 32, and executes increase/decrease control of the nitrogen gas flow rate. While the sensor 32 is detecting the work W within a prescribed time, a state that the solenoid valve 33 is fully opened is held by a signal from the sensor 32, and a large quantity of nitrogen gas is injected into the furnace. When a state that there is no work W is continued, the solenoid valve 33 constricts the gas injection duct line 24, and limits the injection flow rate of nitrogen gas injected into the furnace.

4. 发明专利

JPH04253566A REFLOW SOLDERING DEVICE IN INERT GAS ATMOSPHERE 失效
公开(公告)号：JPH04253566A
公开(公告)日：1992-09-09
申请号：JP589491
申请日：1991-01-22
申请人： TAMURA SEISAKUSHO KK
发明人： OKANO TERUO , ONOZAKI JUNICHI , SUZUKI KIYOSHI , FUJII MAMORU , SOTONO KAZUO , UCHIDA TOSHIYA , ABE YOSHINOBU
IPC分类号： B23K1/008 , B23K31/02 , F27B9/14 , F27B9/24 , H05K3/34
摘要： PURPOSE:To decrease the amt. of an inert gas to be injected and to maintain the low oxygen concn. in a reflow furnace by providing plural partition plates having narrowed apertures along the work transporting route in the work feed-in section and ejecting section of the furnace. CONSTITUTION:A work W is transported in order of the work feed-in section 15, a preheating chamber 22, a reflow chamber 23, and the work ejecting section 16 by a conveyor 14. The work W is preheated in the preheating chamber 22 and the solder paste of the work W is subjected to reflow by a high-temp. inert gaseous atmosphere in the reflow chamber 23, by which a wiring board and parts are soldered. The inert gas injected from an inert gas injection port 24 into the reflow furnace 11 is discharged to the outside through the apertures 27 of the partition plates 26 provided in the work feed-in section 15 and the ejecting section 16 at this time but the amt. of the inert gas to be discharged is throttled by the narrowed apertures of the partition plates 26. The passing rate of the inert gas increases and the possibility of the infiltration of the outdoor air into the furnace is low.

5. 发明专利

JPS62107862A GASEOUS PHASE TYPE SOLDERING DEVICE 失效
公开(公告)号：JPS62107862A
公开(公告)日：1987-05-19
申请号：JP24773485
申请日：1985-11-05
申请人： TAMURA SEISAKUSHO KK
发明人： ABE NOBUHIDE , TAKAHASHI TAKAO , ABE YOSHINOBU
IPC分类号： H05K3/34 , B23K1/015
摘要： PURPOSE:To heat adequately parts having a different heat capacity by providing in series a soldering unit for parts having a large heat capacity, and a unit for parts having a small heat capacity. CONSTITUTION:The first gaseous phase type soldering unit 23 for on-board parts having a large heat capacity is provided with the first cream solder feed ing unit 21 and the first parts feeding unit 22. Also, on the downstream side of this unit 21, the second unit 26 for on-board parts having a small heat capac ity, of the same constitution is placed in series. Accordingly, a sufficient heating time is secured for large parts, and also, an excessive heating can be prevented as for small parts. In this regard, it does not occur that which has been solidi fied by the unit 23 is remelted by the unit 26.

6. 发明专利

JPS6272474A HEATING CONTROL METHOD IN VAPOR TYPE SOLDERING DEVICE 失效
公开(公告)号：JPS6272474A
公开(公告)日：1987-04-03
申请号：JP21193585
申请日：1985-09-25
申请人： TAMURA SEISAKUSHO KK
发明人： ABE YOSHINOBU , TAKAHASHI TAKAO , OKANO TERUO
IPC分类号： H05K3/34 , B23K1/015
摘要： PURPOSE:To save the unnecessary electric power and to control the scattering of a heating medium by detecting the flow of the heating medium which condenses at the transfer port of the body to be soldered and by automatically controlling the heating power of the heating medium according to the flow quantity of the condensing heat medium thereof. CONSTITUTION:The heating medium 12a condensed by being cooled with a cooling pipe 15 by flowing out to the transfer port 16 of the body to be soldered from a vapor tank 11 is flowed into a U pipe 22 and stored once and falls by flowing out of a notched part 23. The flow quantity of the circulating heat medium 12C flowing out of the notch part 23 from the liquid level height H is operated by operating the liquid level height H on the notch part 23 by an arithmetic circuit part 26 from the pressure measuring value of the pressure gage 24 provided at the inner side of the bottom part of the U pipe 22. The signal concerning the flow quantity thereof is transmitted to a control part 27 from the circuit part 26, an input power source 28 is controlled by the control part 27 and by controlling the heating power of a heater 13 the flow quantity of the circulating heat medium 12C is controlled so as to become to the prescribed value at all times.

7. 发明专利

JPH0577040A METHOD FOR APPLYING FLUX 失效
公开(公告)号：JPH0577040A
公开(公告)日：1993-03-30
申请号：JP40784590
申请日：1990-12-27
申请人： TAMURA SEISAKUSHO KK
发明人： MASUDA TSUGUNORI , ABE NOBUHIDE , SOTONO KAZUO , YACHI MASAMITSU , MIYAMOTO YASUO , TOYODA AKIHIKO , ABE YOSHINOBU
IPC分类号： B05D1/02 , B23K1/08 , B23K3/00 , B23K101/42 , H05K3/34
摘要： PURPOSE:To provide the flux applying method which can most adequately adjust a flux applying thickness and the flux applying method suitable for applying the flux between a primary solder wave and a secondary solder wave to a substrate. CONSTITUTION:The flux F1 is sprayed intermittently from a primary spraying nozzle 12a to a substrate W under transportation by a conveyor 11, by which the flux is applied on the substrate. The substrate W is then preheated by a preheater 13. The primary spraying nozzle 12a W is subjected to primary soldering by the primary solder wave S1 gushed from a primary gushing nozzle 17 of a primary solder tank 14. The flux F2 is sprayed intermittently from the secondary spraying nozzle 12b, by which the flux is again applied on the substrate W. The substrate W is subjected to secondary soldering by the secondary solder wave S2 gushed from a secondary gushing nozzle 18 of a secondary solder tank 15. The flux spraying time is shortened and the spraying pause time is prolonged at the time of reducing the flux applying thickness.

8. 发明专利

JPH0299270A CIRCUIT BOARD 失效
公开(公告)号：JPH0299270A
公开(公告)日：1990-04-11
申请号：JP24946888
申请日：1988-10-03
申请人： TAMURA SEISAKUSHO KK
发明人： ABE YOSHINOBU
IPC分类号： B23K3/00 , H05K1/00 , H05K1/03 , H05K3/34
摘要： PURPOSE:To prevent the rise of parts at the time of reflow soldering by providing magnets to the inside of the base material of the circuit board on which chip parts are mounted and is subjected to soldering. CONSTITUTION:The magnets 22 which attract electrode parts 14a by magnetic forces are provided in the base material 21 constituting the circuit board 11. The magnets 22 are provided to a particulate shape. Solder paste 13 is applied on the land of the circuit board 11 and the electrode parts 14a of the chip parts 14 are mounted on the paste 13; thereafter, the reflow soldering is executed in the high-temp. atmosphere of a reflow device. The electrode parts 14a of the chip parts 14 are attracted to the circuit board 11 side by the magnets 22 in the circuit board 11, by which the suppressing moments based on the magnetic forces are added to the chip parts 14 and the rising of the parts is prevented.

9. 发明专利

JPS6442371A METHOD FOR JOINING BY SOLDER 失效
公开(公告)号：JPS6442371A
公开(公告)日：1989-02-14
申请号：JP20049387
申请日：1987-08-11
申请人： TAMURA SEISAKUSHO KK
发明人： ABE YOSHINOBU , SUZUKI YUKIHARU
IPC分类号： B23K31/02 , B23K3/04 , C04B37/02 , H05K3/44
摘要： PURPOSE:To produce a base plate having superior heat conductivity and bonding strength, decreasing the shortage of solder by heating to melt a solder interposed between two plate materials to be jointed with a heating solid heating medium which is brought into contact with one of the plate materials, and thereafter quenching the plate materials with quenching the heating medium. CONSTITUTION:The heating solid heating medium 12, consisting of a highly heat-conducting metal of Al, etc., in which a cooling pipe 22 is connected with both side of openings of a through hole 21 pierced from one side surface to the other side surface, is mounted on a heating source 11 of a hot-plate, etc. A metal plate 13 as one of the plate materials is mounted onto the top face of the heating medium 12. A metallized ceramics plate 15 as another plate material is further positioned, through the solder 14, on the metal plate 13, and a vertically movable pressing-body 17 integrally attached with a silicone rubber 16 is provided thereon. Then, the heating source 11 is operated. By the generated heat, the metal plate 13, the solder 14, and the metallized ceramics plate 15 are heated, through the heating medium 12, to melt the solder 14. When both metal and ceramics plates 13, 15 are wetted with the molten solder, the heating is stopped by the signal from a thermocouple 24 and a solenoid valve 27 is opened to flow the cooling gas or liquid and thus the metal and ceramics plates 13 and 15 are quenched through the heating medium 11, and joined together.

10. 发明专利

JPS63153801A HIBRID INTEGRATED CIRCUIT SUBSTRATE 失效
公开(公告)号：JPS63153801A
公开(公告)日：1988-06-27
申请号：JP30107686
申请日：1986-12-17
申请人： TAMURA SEISAKUSHO KK
发明人： ABE YOSHINOBU , SUZUKI YUKIHARU
IPC分类号： H01C7/00 , H05K1/16

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