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1. 发明专利

JP2003008216A Method of manufacturing ceramic multilayer board 有权
标题翻译：制造陶瓷多层板的方法
公开(公告)号：JP2003008216A
公开(公告)日：2003-01-10
申请号：JP2001194537
申请日：2001-06-27
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： KAWAGUCHI MASAAKI , ITO TAKUJI
IPC分类号： H05K3/46 , H01L23/12 , H01L23/13
摘要： PROBLEM TO BE SOLVED: To narrow the pad pitch of a ceramic multilayer board, so as to enable the multilayer board to cope with a reduction in size and increase in mounting density, and to improve pads and bumps in connection reliability.
SOLUTION: Via holes 24 are bored in the regions of a ceramic green sheet 21, serving as a board surface layer where pads 23 are formed; and the via holes 24 are filled with conductor paste by printing from behind the back surface of the ceramic green sheet 21, the surfaces of via hole conductors 25 exposed on the surface of the board are formed recessed or substantially flat and made to serve as pads 23. The ceramic green sheets 21 and 22, which are formed of low-temperature baking ceramic that can be baked at the temperature range of 800 to 1,000°C, a constraining green sheet 29 is fixed by pressure on each surface of the laminate composed of the ceramic green sheets 21 and 22 and baked, while being constrained in a baking process, and the residues of the constraining green sheet 29 are removed by a blast process after baking is carried out while the green sheet 29 is constrained.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了缩小陶瓷多层板的焊盘间距，以使多层板能够应对尺寸的减小和安装密度的增加，并且在连接可靠性方面改善焊盘和凸块。解决方案：在形成焊盘23的板表面层的陶瓷生片21的区域中钻有通孔24; 并且通孔24通过从陶瓷生片21的后表面的后面印刷而填充有导体糊料，露出在基板表面上的通孔导体25的表面形成为凹陷或基本上平坦并且被制成用作垫由800℃至1000℃的温度范围内可烘烤的低温焙烧陶瓷形成的陶瓷生片21和22通过压力固定在层压板的每个表面上由陶瓷生片21和22组成，并在烘烤过程中受到限制，并且在生坯片29被约束的同时进行焙烧之后通过喷砂处理除去约束生片29的残留物。

2. 发明专利

JP2003055055A Method for manufacturing low temperature fired ceramic substrate 有权
标题翻译：制造低温发光陶瓷基板的方法
公开(公告)号：JP2003055055A
公开(公告)日：2003-02-26
申请号：JP2001250973
申请日：2001-08-22
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： NAKA KATSUHIKO , KAWAGUCHI MASAAKI
IPC分类号： C04B35/645 , C04B35/64
摘要： PROBLEM TO BE SOLVED: To easily form a projection or a recess with >=30 μm height or depth on the surface of a ceramic substrate fired at low temperature with high dimensional accuracy. SOLUTION: When a low temperature fired ceramic substrate 10 is fired by a press firing method, a forming part 21 in a projection or recess state is preliminarily formed by a green sheet lamination method or a press forming method on the face of a restricting green sheet 20 (such as an alumina green sheet) to be in contact with the surface of the low temperature fired ceramic green substrate. Then, the green substrate is fired while the restricting green sheet 20 is pressed in contact with the green substrate so that the pattern of the formed part 21 in the restricting green sheet 20 is transferred to the substrate surface.
摘要翻译：要解决的问题：为了容易地在陶瓷基板的表面上以高于或等于30μm的高温或高深度在低温下高精度地形成突起或凹部。解决方案：当通过压制焙烧方法烧制低温烧制陶瓷基板10时，通过生片层压方法或压制成型方法在限制生坯片的表面上预先形成突起或凹陷状态的成形部21 20（例如氧化铝生片）与低温烧制陶瓷生坯基板的表面接触。然后，在限制生片20与生坯基板接触的同时烧绿色基板，使得限制生片20中的成形部21的图案被转印到基板表面。

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