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1. 发明专利

JP2005120277A Method for producing resin composition for semiconductor sealing and method for finely grinding coloring agent therefor 审中-公开
标题翻译：用于生产半导体密封用树脂组合物的方法及其精细研磨着色剂的方法
公开(公告)号：JP2005120277A
公开(公告)日：2005-05-12
申请号：JP2003358293
申请日：2003-10-17
申请人： Sumitomo Bakelite Co Ltd , 住友ベークライト株式会社
发明人： BABA SHOSHI , ASHIKARI KOTA , SHIBATA HIROSHI
IPC分类号： C09C3/04 , C09C1/48 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide a resin composition for semiconductor sealing, in which crude aggregate of carbon black is finely ground in order to reduce occurrence of electric defect of a semiconductor package caused by crude aggregate of carbon black, scarcely causing electric failure.
SOLUTION: A method for finely grinding a coloring agent used for resin composition for semiconductor sealing comprises finely grinding the coloring agent by a grinder. A method for producing a resin composition having resin for semiconductor sealing and the coloring agent comprises a process for finely grinding the coloring agent by the grinder.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种半导体密封用树脂组合物，其中炭黑的粗骨料被精细研磨，以减少由炭黑的粗骨料引起的半导体封装的电缺陷的发生，几乎不引起电失败。解决方案：用于精细研磨用于半导体密封用树脂组合物的着色剂的方法包括用研磨机细化研磨着色剂。一种制造具有用于半导体密封用树脂的树脂组合物和着色剂的方法包括用研磨机细化着色剂的方法。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2006187873A Resin table for sealing semiconductor, its manufacturing method, manufacturing method of resin molded product and semiconductor device 有权
标题翻译：用于密封半导体的树脂表及其制造方法，树脂模制产品和半导体器件的制造方法
公开(公告)号：JP2006187873A
公开(公告)日：2006-07-20
申请号：JP2004381793
申请日：2004-12-28
申请人： Sumitomo Bakelite Co Ltd , 住友ベークライト株式会社
发明人： BABA SHOSHI , TAKAYAMA KENJI , ASHIKARI KOTA
IPC分类号： B29B9/08 , B29B11/06 , H01L21/56
摘要： PROBLEM TO BE SOLVED: To provide a resin molded product (especially a resin tablet for sealing a semiconductor) reduced in the mixing with impurities such as a metal or the like, its manufacturing method and a semiconductor device using the resin molded product.
SOLUTION: The manufacturing method of the resin tablet for sealing the semiconductor comprises: a first mixing process for mixing a first compound containing a powder of a thermoplastic resin and a powder of an inorganic filler; and a molding process for supplying the mixed powder obtained in the first mixing process into a mold and heating and pressing the same to mold the resin tablet, wherein, the tablet is molded without substantially passing the mixed powder through a melting and kneading process. In addition, the resin tablet for sealing the semiconductor is obtained by this manufacturing method and the semiconductor device is sealed by the resin tablet for sealing the semiconductor.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供减少与杂质如金属等的混合的树脂模制产品（特别是用于密封半导体的树脂片），其制造方法和使用树脂模制产品的半导体装置。解决方案：用于密封半导体的树脂片的制造方法包括：第一混合方法，用于混合含有热塑性树脂的粉末的第一种化合物和无机填料的粉末; 以及将在第一混合过程中获得的混合粉末供给到模具中并对其加热和压制以模制树脂片的模塑工艺，其中，通过熔融捏合工艺基本上不使混合粉末模制片剂。此外，通过该制造方法获得用于密封半导体的树脂片，并且通过用于密封半导体的树脂片密封半导体器件。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2008307452A Method and apparatus for catching magnetic metallic foreign matters, and method for inspecting object to be treated 有权
标题翻译：用于捕获磁性金属外部事项的方法和装置，以及用于检查待处理对象的方法
公开(公告)号：JP2008307452A
公开(公告)日：2008-12-25
申请号：JP2007156615
申请日：2007-06-13
申请人： Sumitomo Bakelite Co Ltd , 住友ベークライト株式会社
发明人： SATO TAMOTSU , ASHIKARI KOTA , TAKAYAMA KENJI
IPC分类号： B03C1/00 , B03C1/28 , H01L21/56
摘要： PROBLEM TO BE SOLVED: To provide a method of surely isolating and catching magnetic metallic foreign matters of minute sizes such as minute particulate iron from an object to be treated even if they are mixed within nonmagnetic particles of weak magnetic attraction. SOLUTION: The method for catching magnetic metallic foreign matters comprises dissolving an object to be treated into a solvent and causing the resulting liquid object to be treated to flow through a flow-path member 14 disposed directly on a magnet 12, whereby the magnetic metallic foreign matters in the liquid object to be treated are caught on the face of the flow-path member 14 by virtue of the magnetism of the magnet 12. The flow-path member 14 is constituted of a duct 18 having a shape matching the shape of the surface of the magnet 12. The duct 18 and the magnet 12 are tiltingly disposed and the liquid object to be treated is poured thereinto so that the magnetic metallic foreign matters are caught in the grooves 20 formed in the duct 18 while they are flowing therethrough. At least the passage face of the duct 18 is made to have a thickness of not greater than 100 μm. The liquid object to be treated is poured into the duct 18 at a controlled constant flow rate. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种即使在弱磁吸引力的非磁性粒子中混合的情况下，也能够将来自待处理物体的微小的铁等微小的微小的金属异物牢固地分离并捕捉的方法。解决方案：用于捕获磁性金属异物的方法包括将待处理的物体溶解在溶剂中并使所得到的液体物质经过直接设置在磁体12上的流路部件14流动，由此，待处理液体中的磁性金属杂质由于磁体12的磁性而被捕获在流路部件14的表面上。流动通道部件14由具有与磁体12的表面的形状。管道18和磁体12倾斜地设置，并且将被处理液体注入其中，使得磁性金属异物被捕获在形成在管道18中的槽20中，同时它们是流过至少使导管18的通道面的厚度不大于100μm。将待处理的液体物质以受控的恒定流速倒入管道18中。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2010042347A Method and device of removing magnetic metal foreign substance 有权
标题翻译：去除磁性金属外来物质的方法和装置
公开(公告)号：JP2010042347A
公开(公告)日：2010-02-25
申请号：JP2008207709
申请日：2008-08-12
申请人： Sumitomo Bakelite Co Ltd , 住友ベークライト株式会社
发明人： SATO TAMOTSU , ASHIKARI KOTA , TAKAYAMA KENJI
IPC分类号： B03C1/28 , B03C1/00 , H01F7/02
摘要： PROBLEM TO BE SOLVED: To securely capture, at stepped-up treatment velocity, a fine magnetic metal foreign substance 1 such as iron by separating it from a material to be treated, while avoiding restrictions on the particle diameter and the dispersion medium of a non-magnetic metal oxide to be treated such as silica or a non-magnetic hydroxide to be treated such as aluminum hydroxide. SOLUTION: A suspension 2 is obtained by dispersing a material to be treated in a dispersion medium, then is allowed to flow through the entire length of a flow path 14A of a magnetic holder 14 with a flow path 14A formed around a magnet 12, and the magnetic metal foreign substance 1 included in the suspension 2, is captured inside the flow path 14A around the magnet 12 by the magnetic force of the magnet 12. Further, the magnetic metal foreign substance 1 is separated from the material to be treated, and the suspension 2 passing through the flow path 14A is recovered/dried to obtain the material to be treated. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了以加速的处理速度，通过将细小的磁性金属异物1（例如铁）从被处理材料中分离出来，同时避免对粒径和分散介质的限制，的待处理的非磁性金属氧化物如二氧化硅或待处理的非磁性氢氧化物如氢氧化铝。解决方案：通过将待处理的材料分散在分散介质中而获得悬浮液2，然后通过形成在磁体周围的流路14A流过磁性保持器14的流路14A的整个长度如图12所示，并且包含在悬架2中的磁性金属异物1被磁体12的磁力捕获在磁体12周围的流路14A的内部。此外，磁性金属异物1与材料分离将通过流路14A的悬浮液2回收/干燥，得到待处理的材料。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2005119197A Powder mixing device, apparatus and method for producing resin composition for sealing semiconductor 有权
标题翻译：粉末混合装置，用于生产用于密封半导体的树脂组合物的装置和方法
公开(公告)号：JP2005119197A
公开(公告)日：2005-05-12
申请号：JP2003358294
申请日：2003-10-17
申请人： Sumitomo Bakelite Co Ltd , 住友ベークライト株式会社
发明人： BABA SHOSHI , ASHIKARI KOTA , SHIBATA HIROSHI
IPC分类号： B02C19/06 , B29B7/06 , B29B13/10 , H01L21/56
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for sealing a semiconductor which reduces electric defects occurring in a semiconductor package by producing the resin composition while pulverizing coarse carbon black aggregates in order to reduce the electric defects of a semiconductor chips caused by the coarse carbon black aggregates.
SOLUTION: A powder mixing device used in the production of the resin composition for sealing the semiconductor having a resin for sealing the semiconductor and a coloring agent has an air current type pulverizer for pulverizing the coloring agent, a filter device which is connected directly or indirectly to the air current type pulverizer and recovers the pulverized coloring agent, and a mixer which is connected directly or indirectly to the filter device and mixes the pulverized coloring agent with another raw material. An apparatus for producing the resin composition for sealing the semiconductor having the resin for sealing the semiconductor and the coloring agent has the mixer.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：解决的问题：为了提供一种用于密封半导体的热固性树脂组合物，其通过在粉碎粗炭黑聚集体的同时制造树脂组合物来减少半导体封装中发生的电缺陷，以减少半导体芯片的电缺陷由粗炭黑聚集体组成。解决方案：用于生产用于密封具有用于密封半导体的树脂的半导体的半导体的树脂组合物和着色剂的粉末混合装置具有用于粉碎着色剂的气流式粉碎机，连接的过滤器装置直接或间接地连接到气流式粉碎机，并回收粉碎的着色剂，以及直接或间接地连接到过滤装置并将粉碎的着色剂与另一种原料混合的混合器。用于密封具有用于密封半导体和着色剂的树脂的半导体的树脂组合物的设备具有混合器。版权所有（C）2005，JPO＆NCIPI

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