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1. 发明专利

JP2014036222A Package carrier and manufacturing method therefor 有权
标题翻译：包装及其制造方法
公开(公告)号：JP2014036222A
公开(公告)日：2014-02-24
申请号：JP2013011674
申请日：2013-01-25
申请人： Subtron Technology Co Ltd , 旭徳科技股▲ふん▼有限公司
发明人： SON SEO HO
IPC分类号： H01L23/12 , H01L23/14 , H01L23/32
CPC分类号： H05K3/42 , H01L21/447 , H01L21/486 , H01L23/49827 , H01L33/642 , H01L2224/16225 , H01L2224/16227 , H01L2924/00014 , H01L2924/15311 , Y10T29/49165 , H01L2224/0401
摘要： PROBLEM TO BE SOLVED: To provide a package carrier which increases the use reliability, by reducing thermal expansion difference effectively when the package carrier is mounting a heating element, and to provide a manufacturing method therefor.SOLUTION: An insulating substrate having an upper surface, a lower surface, a plurality of cavities installed on the lower surface, and a plurality of through holes communicating, respectively, with the cavities by passing through the insulating substrate is provided. A plurality of vias are defined by the cavities and through holes. A plurality of conductive posts are defined by forming a conductive material filling the vias. An insulating layer having a top face and a plurality of blind vias extending from the top face to the conductive post is formed on the upper surface. A patterning circuit layer filling the blind vias, connected with the conductive post, and exposing a part of the top face is formed on the top face. A solder mask layer having a plurality of openings for defining a plurality of pads by exposing a part of the patterning circuit layer is formed on the patterning circuit layer.
摘要翻译：要解决的问题：提供一种提高使用可靠性的封装载体，通过在封装载体安装加热元件时有效降低热膨胀差异，并提供其制造方法。解决方案：具有上表面的绝缘基板，提供了安装在下表面上的下表面，多个空腔以及分别通过绝缘基板与空腔连通的多个通孔。多个通孔由空腔和通孔限定。通过形成填充通孔的导电材料来限定多个导电柱。在上表面上形成具有顶表面和从顶面延伸到导电柱的多个盲通孔的绝缘层。填充与导电柱连接的盲通孔并暴露顶面的一部分的图案化电路层形成在顶面上。在图案化电路层上形成具有用于通过暴露图案形成电路层的一部分来限定多个焊盘的多个开口的焊接掩模层。

2. 发明专利

JP2012235090A Package carrier and manufacturing method of the same 有权
标题翻译：包装载体及其制造方法
公开(公告)号：JP2012235090A
公开(公告)日：2012-11-29
申请号：JP2012042238
申请日：2012-02-28
申请人： Kyokutoku Kagi Kofun Yugenkoshi , 旭徳科技股▲ふん▼有限公司
发明人： SON SEO HO
IPC分类号： H01L23/34 , H01L23/427 , H01L33/64 , H05K7/20
CPC分类号： H01L23/427 , H01C17/02 , H01L23/13 , H01L23/367 , H01L23/498 , H01L33/486 , H01L2224/48091 , H01L2224/48137 , H01L2933/0075 , Y10T29/49083 , Y10T29/49087 , Y10T29/49126 , Y10T29/49353 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a package carrier which efficiently radiates heat.SOLUTION: An insulation cover is provided. The insulation cover has an inner surface and an outer surface, which face each other; multiple openings; and a housing space. A patterning metal layer is formed on an outer surface of the insulation cover. A surface treatment layer is formed on the patterning metal layer. A heat radiation element is formed in a housing space of an insulation layer and is structurally connected with the insulation layer. A heat conducting layer is formed on a surface of the heat radiation element and a part of the heat conducting layer is exposed by the openings of the insulation cover.
摘要翻译：要解决的问题：提供一种有效散热的封装载体的制造方法。
解决方案：提供绝缘盖。绝缘盖具有彼此面对的内表面和外表面; 多个开口; 和住房空间。图案化金属层形成在绝缘盖的外表面上。在图案形成金属层上形成表面处理层。散热元件形成在绝缘层的容纳空间中并与绝缘层结构地连接。导热层形成在散热元件的表面上，导热层的一部分被绝缘盖的开口露出。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2012244159A Package structure and manufacturing method of the same 有权
标题翻译：其包装结构和制造方法
公开(公告)号：JP2012244159A
公开(公告)日：2012-12-10
申请号：JP2012034206
申请日：2012-02-20
申请人： Kyokutoku Kagi Kofun Yugenkoshi , 旭徳科技股▲ふん▼有限公司
发明人： SON SEO HO
IPC分类号： H01L23/12
CPC分类号： H01L21/568 , H01L21/6835 , H01L23/3107 , H01L24/48 , H01L24/81 , H01L24/85 , H01L2221/68345 , H01L2224/16245 , H01L2224/48091 , H01L2224/48247 , H01L2224/85439 , H01L2224/85444 , H01L2224/85455 , H01L2924/00014 , H01L2924/12041 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , Y10T29/49117 , Y10T29/49124 , Y10T29/49204 , H01L2924/01046 , H01L2924/01079 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a package structure which has a relatively small thickness and protects adjacent solder balls from short circuits due to a reflow process, and to provide a manufacturing method of the package structure.SOLUTION: A patterning insulation layer 130 is formed on a first seed layer to expose a part of the first seed layer. A patterning circuit layer 140 is formed on an exposed portion of the first seed layer to cover a part of the patterning insulation layer 130. A chip bonding process is performed so that a chip electrically connects with the patterning circuit layer 140. A sealant 170, sealing the chip and the patterning circuit layer 140 and covering the patterning insulation layer 130, is formed. The metal substrate and the first seed layer are removed so as to expose a bottom surface 132 of the patterning insulation layer 130 and a lower surface 142 of the patterning circuit layer 140. Solder balls 180 are formed on the lower surface 142 of the patterning circuit layer 140.
摘要翻译：要解决的问题：提供一种封装结构，其具有相对较小的厚度并且由于回流工艺而保护邻近的焊球免于短路，并提供封装结构的制造方法。解决方案：图案化绝缘层130形成在第一种子层上以暴露第一籽晶层的一部分。图案化电路层140形成在第一晶种层的暴露部分上以覆盖图案绝缘层130的一部分。进行芯片接合工艺，使得芯片与图案化电路层140电连接。密封剂170，形成密封芯片和图形化电路层140并覆盖图案化绝缘层130。去除金属基底和第一籽晶层，以暴露图案化绝缘层130的底表面132和图案化电路层140的下表面142.焊球180形成在图案化电路的下表面142上版权所有。（C）2013，JPO＆INPIT

4. 发明专利

JP2012164982A Package carrier and manufacturing method of the same 有权
标题翻译：包装载体及其制造方法
公开(公告)号：JP2012164982A
公开(公告)日：2012-08-30
申请号：JP2012017023
申请日：2012-01-30
申请人： Kyokutoku Kagi Kofun Yugenkoshi , 旭徳科技股▲ふん▼有限公司
发明人： SON SEO HO
IPC分类号： H01L23/12 , H01L23/14 , H01L23/15
CPC分类号： H01L23/3677 , H01L23/49827 , H01L24/48 , H01L33/486 , H01L33/642 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/73265 , H01L2924/00014 , H01L2924/01019 , H01L2924/12041 , H01L2924/15153 , H01L2924/181 , H05K1/0204 , H05K2201/10106 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a package carrier suitable for carrying a heat-generating element and a manufacturing method of the package carrier.SOLUTION: A manufacturing method of a package carrier is provided. A first opening that communicates an upper surface and a lower surface of a substrate is formed. A heat-conducting element having a top surface and a bottom surface is disposed in the first opening and fixed into the first opening through an insulation material. A first insulation layer and a first metal layer are laminated onto the upper surface. A second insulation layer and a second metal layer are laminated onto the lower surface. A second opening and a third opening, each of which exposes a portion of the top surface and the bottom surface, are formed. At least one through via that penetrates the first metal layer, the first insulation layer, the substrate, the second insulation layer, and the second metal layer is formed. A third metal layer that covers the first metal layer, the second metal layer, and an inner wall of the through via is formed.
摘要翻译：要解决的问题：提供适于承载发热元件的包装载体和包装载体的制造方法。解决方案：提供一种封装载体的制造方法。形成连通基板的上表面和下表面的第一开口。具有顶表面和底表面的导热元件设置在第一开口中并通过绝缘材料固定到第一开口中。第一绝缘层和第一金属层层叠在上表面上。第二绝缘层和第二金属层层压到下表面上。形成第一开口和第三开口，每个开口暴露出顶表面和底表面的一部分。形成穿过第一金属层的至少一个通孔，形成第一绝缘层，基板，第二绝缘层和第二金属层。形成覆盖通孔的第一金属层，第二金属层和内壁的第三金属层。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2012235083A Package structure and manufacturing method of the same 有权
标题翻译：其包装结构和制造方法
公开(公告)号：JP2012235083A
公开(公告)日：2012-11-29
申请号：JP2012003203
申请日：2012-01-11
申请人： Kyokutoku Kagi Kofun Yugenkoshi , 旭徳科技股▲ふん▼有限公司
发明人： SON SEO HO , CHIN CHANG-BO
IPC分类号： H01L23/12
CPC分类号： H01L21/563 , H01L21/4821 , H01L21/568 , H01L23/49582 , H01L24/48 , H01L24/73 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/85001 , H01L2924/00014 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , H01L2924/3025 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： PROBLEM TO BE SOLVED: To provide a package structure having a relatively thin thickness and a manufacturing method of the package structure.SOLUTION: A pattern dry film layer exposing a part of a seed layer of a metal substrate is formed, and a pattern circuit layer 140 and a surface protection layer 150 are formed at the part of the exposed seed layer by electric plating. The pattern dry film layer is removed, and a chip pad 142 and a pad 144 are formed. A chip 160a is disposed on the chip pad 142, and the chip 160a is electrically connected to the pad 144 through a bonding wire 170. The chip 160a, the bonding wire 170, the chip pad 142, and the pad 144 are encapsulated by a sealing material 180. The metal substrate and the seed layer are removed, a bottom surface 182 of the sealing material 180 and lower surfaces 146 of the chip pad 142 and the pad 144 are exposed.
摘要翻译：要解决的问题：提供具有相对薄的厚度的封装结构和封装结构的制造方法。解决方案：形成暴露金属基底的种子层的一部分的图案干膜层，并且通过电镀在暴露的种子层的一部分处形成图案电路层140和表面保护层150。去除图案干膜层，形成芯片焊盘142和焊盘144。芯片160a设置在芯片焊盘142上，并且芯片160a通过接合线170电连接到焊盘144.芯片160a，接合线170，芯片焊盘142和焊盘144被一个密封材料180.金属基底和种子层被去除，密封材料180的底表面182和芯片垫142的下表面146和垫144暴露。版权所有（C）2013，JPO＆INPIT

6. 发明专利

JP2012151473A Package carrier and manufacturing method thereof 有权
标题翻译：包装及其制造方法
公开(公告)号：JP2012151473A
公开(公告)日：2012-08-09
申请号：JP2012006575
申请日：2012-01-16
申请人： Kyokutoku Kagi Kofun Yugenkoshi , 旭徳科技股▲ふん▼有限公司
发明人： SON SEO HO
IPC分类号： H01L23/12 , H01L23/36 , H05K1/02
CPC分类号： H01L23/49827 , H01L21/486 , H01L23/3121 , H01L23/3677 , H01L24/48 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/85444 , H01L2224/85455 , H01L2924/00014 , H01L2924/01019 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , Y10T29/49124 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a package carrier suitable for mounting a heat generation element, and a method for manufacturing the package carrier.SOLUTION: A substrate 110a is provided, and a first opening 115a communicated with an upper surface 111a and a lower surface 113a is formed. A heat conducting element 120 is arranged in the first opening 115a, and fixed in the first opening 115a by an insulating material 130. A through hole 117a penetrating through the substrate 110a is formed. A metal layer 140 is formed on the upper surface 111a and lower surface 113a of the substrate 110a and inside the through hole 117a, so as to coat the upper surface 111a and the lower surface 113a of the substrate 110a, the heat conducting element 120 and the insulating material 130. A part of the metal layer 140 is removed. A solder mask 150 is formed on the metal layer. A surface protection layer 160 is formed to coat the metal layer 140 exposed by the solder mask 150 and the metal layer 140 positioned in the through hole 117a.
摘要翻译：要解决的问题：提供适合于安装发热元件的封装载体，以及用于制造封装载体的方法。解决方案：提供基板110a，形成与上表面111a和下表面113a连通的第一开口115a。导热元件120布置在第一开口115a中，并通过绝缘材料130固定在第一开口115a中。形成穿过基板110a的通孔117a。金属层140形成在基板110a的上表面111a和下表面113a上以及通孔117a的内部，以便涂覆基板110a的上表面111a和下表面113a，导热元件120和绝缘材料130.去除金属层140的一部分。在金属层上形成焊接掩模150。形成表面保护层160以涂覆由焊料掩模150暴露的金属层140和位于通孔117a中的金属层140。版权所有（C）2012，JPO＆INPIT

7. 发明专利

JP2012151431A Package carrier and method of manufacturing the same 有权
标题翻译：包装载体及其制造方法
公开(公告)号：JP2012151431A
公开(公告)日：2012-08-09
申请号：JP2011126262
申请日：2011-06-06
申请人： Kyokutoku Kagi Kofun Yugenkoshi , 旭徳科技股▲ふん▼有限公司
发明人： SON SEO HO
IPC分类号： H01L23/12
CPC分类号： H01L33/644 , H01L23/13 , H01L23/142 , H01L23/3121 , H01L23/36 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/32013 , H01L2224/48091 , H01L2224/73265 , H01L2924/00013 , H01L2924/00014 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/181 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a package carrier exhibiting excellent heat dissipation effect suitable for mounting a heat generation element, and to provide a method of manufacturing a package carrier.SOLUTION: A substrate including a first metal layer 110, a second metal layer 120 having a top face and a bottom face facing each other, and an insulation layer 130 between the first and second metal layers is provided by a method of manufacturing a package carrier. The second metal layer 120 has a thickness greater than the first metal layer 110. A first opening S1 is formed to penetrate the first metal layer 110 and the insulation layer 130 and to expose a part of the top face of the second metal layer 120. The first metal layer 110 is patterned and a patterned conductive layer 110' is formed. A second opening S2 is formed in the bottom face 124 of the second metal layer 120. The second metal layer 120 is divided into a plurality of heat transfer blocks 120' by the second opening S2 not communicating with the first opening S1.
摘要翻译：要解决的问题：提供一种显示出适合于安装发热元件的散热效果优异的封装载体，并提供制造封装载体的方法。解决方案：通过制造方法提供包括第一金属层110，具有顶面和彼此面对的底面的第二金属层120的基板和第一和第二金属层之间的绝缘层130 包装承运人第二金属层120具有大于第一金属层110的厚度。形成第一开口S1以穿透第一金属层110和绝缘层130并暴露第二金属层120的顶面的一部分。图案化第一金属层110并形成图案化的导电层110'。第二开口S2形成在第二金属层120的底面124中。第二金属层120被不与第一开口S1连通的第二开口S2分成多个传热块120'。版权所有（C）2012，JPO＆INPIT

8. 发明专利

JP2013222959A Package carrier and manufacturing method thereof 有权
标题翻译：包装及其制造方法
公开(公告)号：JP2013222959A
公开(公告)日：2013-10-28
申请号：JP2012236374
申请日：2012-10-26
申请人： Kyokutoku Kagi Kofun Yugenkoshi , 旭徳科技股▲ふん▼有限公司
发明人： SON SEO HO
IPC分类号： H01L23/12
CPC分类号： H01L23/3677 , H01L23/3121 , H01L23/5383 , H01L23/5389 , H01L25/16 , H01L25/167 , H01L33/64 , H01L2224/48091 , H01L2224/48228 , H01L2924/181 , H05K1/0204 , H05K1/185 , H05K3/4602 , H05K2201/09581 , H05K2201/10416 , H05K2203/1469 , Y10T29/49139 , H01L2924/00014 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a package carrier and a method for manufacturing the same.SOLUTION: In a manufacturing method of a package carrier, a substrate having an upper surface, a lower surface and an opening communicating the two surfaces is provided. An electronic device is disposed inside the opening. A first insulation layer and a superimposed first metal layer are laminated on the upper surface. A second insulation layer and a superimposed second metal layer are laminated on the lower surface. The opening is filled with the first and second insulation layers. First blind holes, second blind holes and a heat-dissipation channel are formed. A third metal layer is formed on the first and second blind holes and an inner wall of the heat-dissipation channel. A heat-conducting device is disposed inside the heat-dissipation channel and fixed into the heat-dissipation channel via an insulation material. The first and second metal layers are patterned to form a first patterned metal layer and a second patterned metal layer.
摘要翻译：要解决的问题：提供一种封装载体及其制造方法。解决方案：在封装载体的制造方法中，提供具有上表面，下表面和连通两个表面的开口的基板。电子设备设置在开口内。第一绝缘层和叠置的第一金属层层压在上表面上。第二绝缘层和叠加的第二金属层层叠在下表面上。开口填充有第一和第二绝缘层。形成第一盲孔，第二盲孔和散热通道。在第一和第二盲孔和散热通道的内壁上形成第三金属层。导热装置设置在散热通道的内部并通过绝缘材料固定到散热通道中。图案化第一和第二金属层以形成第一图案化金属层和第二图案化金属层。

9. 发明专利

JP2013140940A Package carrier and manufacturing method thereof 有权
标题翻译：包装及其制造方法
公开(公告)号：JP2013140940A
公开(公告)日：2013-07-18
申请号：JP2012182830
申请日：2012-08-22
申请人： Kyokutoku Kagi Kofun Yugenkoshi , 旭徳科技股▲ふん▼有限公司
发明人： SON SEO HO
IPC分类号： H01L23/12 , H05K3/40 , H05K3/46
CPC分类号： H05K1/181 , H01L21/486 , H01L21/6835 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2221/68345 , H01L2224/32225 , H01L2224/32227 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2224/83439 , H01L2224/83444 , H01L2224/83455 , H01L2924/00014 , H01L2924/01028 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/0132 , H01L2924/0133 , H01L2924/12041 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H05K1/186 , Y10T156/10 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： PROBLEM TO BE SOLVED: To provide a package carrier suitable for locating at least one chip, and a manufacturing method thereof.SOLUTION: A support plate having an upper surface and a patterning circuit layer thereon is formed. One part of the upper surface of the support plate is exposed by the patterning circuit layer. An insulation layer, and a conductive layer provided on a first surface of the insulation layer are laminated on the patterning circuit layer. The patterning circuit layer and an exposed portion of the upper surface are covered by the insulation layer. Plural conductive connection structures are formed on the patterning circuit layer. The conductive layer is patterned, so as to define plural pads respectively connected to the conductive connection structure and expose one part of the first surface of the insulation layer. By removing the support plate, a second surface of the insulation layer is exposed. The second surface and a joint face of the patterning circuit layer are the same plane.
摘要翻译：要解决的问题：提供适于定位至少一个芯片的封装载体及其制造方法。解决方案：形成有其上表面和图案化电路层的支撑板。支撑板的上表面的一部分被构图电路层露出。设置在绝缘层的第一表面上的绝缘层和导电层层叠在图案形成电路层上。图案化电路层和上表面的露出部分被绝缘层覆盖。在图案化电路层上形成多个导电连接结构。图案化导电层，以便限定分别连接到导电连接结构并暴露绝缘层的第一表面的一部分的多个焊盘。通过移除支撑板，露出绝缘层的第二表面。图形电路层的第二表面和接合面是相同的平面。

10. 发明专利

JP2012244166A Package structure and manufacturing method of the same 有权
标题翻译：其包装结构和制造方法
公开(公告)号：JP2012244166A
公开(公告)日：2012-12-10
申请号：JP2012103121
申请日：2012-04-27
申请人： Kyokutoku Kagi Kofun Yugenkoshi , 旭徳科技股▲ふん▼有限公司
发明人： SON SEO HO
IPC分类号： H01L23/34 , H01L23/12 , H05K3/46
CPC分类号： H05K13/00 , H01L23/13 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L2224/16225 , H01L2224/16227 , H01L2924/12041 , H01L2924/15788 , H05K1/0207 , H05K1/185 , Y10T29/49002 , Y10T29/49126 , Y10T29/49146 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a package structure which achieves good heat radiation performance and is small and thin, and to provide a manufacturing method of the package structure.SOLUTION: An electronic device 120 is disposed in an opening 116 of a substrate 110, and a patterning metal layer 140 on an adhesive layer 130 is laminated on a lower surface 113 of the substrate 110. Further, a bottom surface 124 of the electronic device 120 is exposed. A heat diffusion column 150 is formed on the exposed bottom surface 124. A first laminate structure 160 covers an upper surface 111 of the substrate 110 and a top surface 122 of the electronic device 120, and a second laminate structure 170 covers the heat diffusion column 150 and the patterning metal layer 140.
摘要翻译：要解决的问题：提供一种实现良好的散热性能并且薄而薄的封装结构，并提供封装结构的制造方法。解决方案：电子器件120设置在衬底110的开口116中，并且粘合剂层130上的图案形成金属层140层压在衬底110的下表面113上。此外，底表面124 电子设备120被暴露。在暴露的底表面124上形成热扩散塔150.第一层叠结构160覆盖基板110的上表面111和电子装置120的顶表面122，第二叠层结构170覆盖热扩散柱 150和图案形成金属层140.版权所有（C）2013，JPO＆INPIT

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