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    • 1. 发明专利
    • Semiconductor device
    • 半导体器件
    • JP2013051421A
    • 2013-03-14
    • JP2012206132
    • 2012-09-19
    • Sharp Corpシャープ株式会社
    • CHIKAMA YOSHIMASANISHIKI HIROHIKOOTA AYAFUMIMIZUNO YUJIHARA TAKESHIAIDA TETSUYASUZUKI MASAHIKOTAKEI MICHIKONAKAGAWA OKIFUMIHARUMOTO YOSHIMASA
    • H01L21/768G02F1/1345G02F1/1368G09F9/30H01L21/28H01L21/336H01L23/522H01L29/417H01L29/786
    • H01L27/1225G02F1/13458G02F1/136213H01L27/124H01L27/1244H01L27/1248
    • PROBLEM TO BE SOLVED: To control a tapered shape of a contact hole in a terminal part with high accuracy.SOLUTION: A semiconductor device comprises: a thin film transistor including an oxide semiconductor layer 7a, a source wiring 13as and a drain electrode 13ad; and a terminal part including a first connection part 3c, a second connection part 13c and a third connection part 19c formed on the second connection part. The second connection part contacts the first connection part in a first opening provided in first and second insulation films 5,9. The third connection part 19c contacts the second connection part in a second opening provided in a protection film 15. The first opening is formed by simultaneously etching the first insulation film 5 and the second insulation film 9. The second opening is formed by etching the protection film 15 separately from the first and second insulation film. The second connection part 13c covers end faces of the first and the second insulation films in the first opening and not covers an end face of the protection film 15 in the second opening.
    • 要解决的问题:以高精度控制端子部分中的接触孔的锥形形状。 解决方案:半导体器件包括:薄膜晶体管,其包括氧化物半导体层7a,源极布线13as和漏极13ad; 以及包括形成在第二连接部上的第一连接部3c,第二连接部13c和第三连接部19c的端子部。 第二连接部分在设置在第一和第二绝缘膜5,9中的第一开口中接触第一连接部分。 第三连接部分19c在设置在保护膜15中的第二开口中与第二连接部分接触。第一开口通过同时蚀刻第一绝缘膜5和第二绝缘膜9而形成。第二开口通过蚀刻保护 薄膜15与第一和第二绝缘薄膜分开。 第二连接部13c覆盖第一开口中的第一绝缘膜和第二绝缘膜的端面,并且不覆盖第二开口中的保护膜15的端面。 版权所有(C)2013,JPO&INPIT
    • 2. 发明专利
    • Liquid crystal display panel and manufacturing method thereof
    • 液晶显示面板及其制造方法
    • JP2013246257A
    • 2013-12-09
    • JP2012118955
    • 2012-05-24
    • Sharp Corpシャープ株式会社
    • HARUMOTO YOSHIMASA
    • G02F1/1368G02F1/1333G02F1/1343G09F9/00G09F9/30G09F9/40
    • PROBLEM TO BE SOLVED: To prevent electric leakage of a leading wiring part from occurring in a liquid crystal display panel of a super narrow frame type.SOLUTION: A liquid crystal display panel can constitute one display screen by multiple connection, and includes a leading wiring structure 20 in a frame area around a display area. The leading wiring structure 20 includes an auxiliary line electrode 23 adjacent to a gate line electrode 12 and formed on the same flat surface 22a, an insulating film 24 laminated on the gate line electrode and the auxiliary line electrode, and a source line electrode 25 laminated on the insulating film. The gate line electrode 12 and the auxiliary line electrode 23 each have a trapezoidal cross section whose both lateral faces have gentle gradient, and an inclination angle θ of the lateral face with respect to the flat surface 22a is in a range of 20-40°.
    • 要解决的问题:为了防止在超窄框式液晶显示面板中发生引导布线部分的漏电。解决方案:液晶显示面板可以通过多个连接构成一个显示屏,并且包括引线 结构20在显示区域周围的框区域中。 前导布线结构20包括与栅线电极12相邻并形成在同一平面22a上的辅助线电极23,层叠在栅极线电极和辅助线电极上的绝缘膜24和层叠的源极线电极25 在绝缘膜上。 栅极线电极12和辅助线电极23均具有梯形截面,其两个侧面具有缓和的梯度,倾斜角度为θ。 相对于平坦表面22a的侧面的宽度在20-40°的范围内。
    • 4. 发明专利
    • Thin film transistor, and method of manufacturing the same
    • 薄膜晶体管及其制造方法
    • JP2010287645A
    • 2010-12-24
    • JP2009138832
    • 2009-06-10
    • Sharp Corpシャープ株式会社
    • INOUE TAKESHIOKABE TATSUKANEDA TAKESHIAIDA TETSUYAHARUMOTO YOSHIMASA
    • H01L29/786G02F1/1368G09F9/30H01L21/3205H01L21/336H01L23/52
    • PROBLEM TO BE SOLVED: To provide a thin film transistor increasing the operation speed by using a crystalline semiconductor layer of large mobility as a channel layer. SOLUTION: A laser beam absorbed into an amorphous silicon layer 106a is converted to heat in laser-annealing. The heat so converted melts the amorphous silicon layer 106a and is applied to a gate electrode 150 as radiation heat. However, in laser annealing, the gate electrode 150 is separated from a gate wiring 30, so that the applied heat raises the temperature of the gate electrode 150 by heat conduction from the gate electrode 150 to the gate wiring 30 without being radiated. Thus, heat generated in the amorphous silicon layer 106a on the gate electrode 150 is mainly used to melt and crystallize the amorphous silicon layer 106a and hence the grain diameter of the crystal of a microcrystal silicon layer 106b is increased and the mobility is increased. COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:提供通过使用大迁移率的结晶半导体层作为沟道层来提高操作速度的薄膜晶体管。 吸收到非晶硅层106a中的激光束在激光退火中被转换为热。 这样转换的热量熔化非晶硅层106a并作为辐射热施加到栅电极150。 然而,在激光退火中,栅电极150与栅极布线30分离,使得所施加的热量不会被辐射而从栅极电极150向栅极布线30的热传导提高栅电极150的温度。 因此,主栅极电极150上的非晶硅层106a中产生的热量主要用于非晶硅层106a的熔化和结晶化,因此微晶硅层106b的晶体的晶粒直径增加,迁移率增加。 版权所有(C)2011,JPO&INPIT