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1. 发明专利

JP2013143292A Anisotropic conductive film material, connection structure, and method for manufacturing connection structure 审中-公开
标题翻译：各向异性导电膜材料，连接结构和制造连接结构的方法
公开(公告)号：JP2013143292A
公开(公告)日：2013-07-22
申请号：JP2012003381
申请日：2012-01-11
申请人： Sekisui Chem Co Ltd , 積水化学工業株式会社
发明人： NAKAYAMA ATSUSHI , ISHIZAWA HIDEAKI , ENAMI TOSHIO , HATAI MUNEHIRO
IPC分类号： H01R11/01 , B32B27/18 , C09J7/00 , C09J11/04 , C09J201/00 , H01B5/16 , H01R43/00 , H05K1/14 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To provide an anisotropic conductive film material which allows the lowering of the inter-electrode connection resistance in a case where members to be connected apiece including copper electrodes on a surface thereof have been connected with each other.SOLUTION: An anisotropic conductive film material 11 according to the invention is used for connecting a member to be connected which has copper electrodes on a surface thereof. The anisotropic conductive film material 11 comprises: a first layer 1; and a second layer 2 arranged on one surface of the first layer 1 or to be arranged on the one surface and then used. The first layer 1 includes conductive particles 3 and a binder resin. The second layer 2 includes no conductive particle while including a binder resin. The minimum value of the melt viscosity of the first layer 1 at a temperature of 60-100°C is higher than that of the second layer 2.
摘要翻译：要解决的问题：提供一种各向异性导电膜材料，其在包括其表面上的铜电极的连接构件彼此连接的情况下允许降低电极间连接电阻。解决方案：各向异性根据本发明的导电膜材料11用于连接其表面上具有铜电极的待连接部件。各向异性导电膜材料11包括：第一层1; 以及布置在第一层1的一个表面上或被布置在一个表面上然后使用的第二层2。第一层1包括导电颗粒3和粘合剂树脂。第二层2不包括导电颗粒，同时包括粘合剂树脂。第一层1在60-100℃的温度下的熔体粘度的最小值高于第二层2的熔体粘度的最小值。

2. 发明专利

JP2012074482A Method of forming through hole electrode and electronic component 有权
标题翻译：通过孔电极和电子元件形成方法
公开(公告)号：JP2012074482A
公开(公告)日：2012-04-12
申请号：JP2010217333
申请日：2010-09-28
申请人： Agt:Kk , Chiba Univ , Sekisui Chem Co Ltd , 国立大学法人千葉大学 , 株式会社Agt , 積水化学工業株式会社
发明人： NAKASUGA AKIRA , ENAMI TOSHIO , HITAI YOJI , ITO SHO , NAGASAWA MASAMICHI , TACHIKAWA SHIGERU
IPC分类号： H05K3/40 , B23K26/00 , H05K1/11 , H05K3/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a method of forming a through hole electrode exhibiting excellent reliability of electrical connection wherein the through hole electrode can be formed inexpensively with fewer steps, and a metal film having a uniform thickness over the depth direction of a through hole can be formed.SOLUTION: In the method of forming a through hole electrode, a laminate 1 where a substrate 6 is laminated on a metal plate 2 is prepared, and irradiated with laser light A from the substrate 6 side to form through holes 4a, 5a in the substrate 6. The metal plate 2 at the lower through holes is irradiated continuously with laser light and the metal composing the metal plate is gradually scattered thus forming a through hole electrode consisting of a metal film on the inner peripheral surface of the through holes 4a, 5a.
摘要翻译：要解决的问题：提供一种形成通孔电极的方法，所述通孔电极具有优异的电连接可靠性，其中可以以较少的步骤廉价地形成通孔电极，并且在深度方向上具有均匀厚度的金属膜可以形成通孔。解决方案：在形成通孔电极的方法中，准备将基板6层叠在金属板2上的层压体1，并从基板6侧照射激光A形成通孔4a，5a 在基板6上。在下部通孔处的金属板2被激光连续照射，并且构成金属板的金属逐渐散开，从而在通孔的内周面上形成由金属膜构成的通孔电极 4a，5a。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2005108871A Metal bump, its forming method, semiconductor chip, and conductive connection structure 审中-公开
标题翻译：金属制品，其成型方法，半导体芯片和导电连接结构
公开(公告)号：JP2005108871A
公开(公告)日：2005-04-21
申请号：JP2003335905
申请日：2003-09-26
申请人： Sekisui Chem Co Ltd , 積水化学工業株式会社
发明人： ENAMI TOSHIO , WAKIYA TAKESHI
IPC分类号： H01L21/60
CPC分类号： H01L2224/11
摘要： PROBLEM TO BE SOLVED: To provide a metal bump capable of conductive connection of a semiconductor chip and a substrate with high connection reliability, a method for forming the metal bump, a semiconductor chip having the metal bump, and a conductive connection structure employing the metal bump. SOLUTION: The metal bump for connecting a semiconductor chip and a substrate contains fine particles of resin. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种能够以高连接可靠性导电连接半导体芯片和基板的金属凸块，形成金属凸块的方法，具有金属凸块的半导体芯片和导电连接结构采用金属凸块。解决方案：用于连接半导体芯片和基板的金属凸块包含细小的树脂颗粒。版权所有（C）2005，JPO＆NCIPI

4. 发明专利

JP2004207698A Method for connecting transfer sheet, conductive particle transfer sheet and conductive particle to electrode 审中-公开
公开(公告)号：JP2004207698A
公开(公告)日：2004-07-22
申请号：JP2003396087
申请日：2003-11-26
申请人： Sekisui Chem Co Ltd , 積水化学工業株式会社
发明人： ENAMI TOSHIO , FUKUI KOJI
IPC分类号： B32B7/02 , C08G65/329 , C08G65/336 , C08J11/06 , C08K3/22 , C08K5/14 , C08K5/17 , C08K5/23 , C08K5/37 , C08L71/02 , C09J7/02 , C09J11/00 , C09J171/00 , H01B5/14 , H01L21/60 , H01L21/68 , H01L21/768 , H05K1/03 , H05K3/04 , H05K3/20 , H05K3/34
CPC分类号： C08G65/329 , C08G65/336 , C08J9/26 , C08J11/06 , C08J2300/30 , C08J2367/02 , C08L71/02 , H01L21/6835 , H01L21/7682 , H01L24/11 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05548 , H01L2224/05571 , H01L2224/05624 , H01L2224/05647 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/0101 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01047 , H01L2924/01054 , H01L2924/01056 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01088 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/13091 , H01L2924/14 , H01L2924/3025 , H05K1/0373 , H05K3/048 , H05K3/20 , H05K3/3478 , H05K2201/0116 , H05K2201/0212 , H05K2201/10424 , H05K2203/041 , H05K2203/083 , H05K2203/1105 , Y02W30/701 , Y10T156/1153 , Y10T428/24802 , Y10T428/28 , H01L2924/00 , H01L2224/05099
摘要： PROBLEM TO BE SOLVED: To provide a method for connecting a conductive particulate transfer sheet and a conductive particulate to an electrode capable of arranging the conductive particulate on the electrode of electronic of electronic components so as not to shift and drop out and collectively, surely, and easily welding and connecting to an electrode on electronic components. SOLUTION: A transfer sheet bonding a member to be transferred on a heating annihilation bonding resin layer, a conductive particulate transfer sheet bonding a conductive particulate on a sheet-like heating annihilation bonding resin and arranged, a conductive particulate transfer sheet arranged the conductive particulate on the heating annihilation bonding sheet so that the conductive particulate is arranged in the state contact or noncontact, and the electronic components are superimposed. The conductive particulate is weld to the electrode of the electronic components to connect. The conductive particulate, which the heating annihilation bonding sheet is eliminated by heating, is connected to the electrode. COPYRIGHT: (C)2004,JPO&NCIPI

5. 发明专利

JP2004193594A Circuit formation transfer sheet, and manufacturing method for circuit board 审中-公开
标题翻译：电路形成转移表和电路板的制造方法
公开(公告)号：JP2004193594A
公开(公告)日：2004-07-08
申请号：JP2003396088
申请日：2003-11-26
申请人： Sekisui Chem Co Ltd , 積水化学工業株式会社
发明人： ENAMI TOSHIO , FUKUI KOJI
IPC分类号： B32B7/02 , C08G65/329 , C08G65/336 , C08J11/06 , C08K3/22 , C08K5/14 , C08K5/17 , C08K5/23 , C08K5/37 , C08L71/02 , C09J7/02 , C09J11/00 , C09J171/00 , H01B5/14 , H01L21/60 , H01L21/68 , H01L21/768 , H05K1/03 , H05K3/04 , H05K3/20 , H05K3/34
CPC分类号： C08G65/329 , C08G65/336 , C08J9/26 , C08J11/06 , C08J2300/30 , C08J2367/02 , C08L71/02 , H01L21/6835 , H01L21/7682 , H01L24/11 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05548 , H01L2224/05571 , H01L2224/05624 , H01L2224/05647 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/0101 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01047 , H01L2924/01054 , H01L2924/01056 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01088 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/13091 , H01L2924/14 , H01L2924/3025 , H05K1/0373 , H05K3/048 , H05K3/20 , H05K3/3478 , H05K2201/0116 , H05K2201/0212 , H05K2201/10424 , H05K2203/041 , H05K2203/083 , H05K2203/1105 , Y02W30/701 , Y10T156/1153 , Y10T428/24802 , Y10T428/28 , H01L2924/00 , H01L2224/05099
摘要： PROBLEM TO BE SOLVED: To highly accurately obtain a circuit board having minute and highly dense wiring by using a circuit formation transfer sheet. SOLUTION: The circuit formation transfer sheet 1 has, in FIG.(a), a metal layer 3 formed on the surface of an adhesive sheet 2 made only of heat annihilation resin. Further, in FIG.(b), the metal layer 3 is formed on a heat annihilation resin layer 2b of the surface of the adhesive sheet 2 as a composite membrane that is a resin substrate 2a of non-heat annihilation resin and heat annihilation resin layer 2b formed into a laminated structure. In FIG.(c), the metal layer 3 is formed on the surface of an adhesive sheet 2c made by mixing different resins such as heat annihilation resin and non-heat annihilation resin. Here, non-heat annihilation resin means common resin that does not resolve with heating. COPYRIGHT: (C)2004,JPO&NCIPI
摘要翻译：要解决的问题：通过使用电路形成转印片来高精度地获得具有微细且高密度布线的电路板。解决方案：电路形成转印片1在图（a）中具有形成在仅由热湮灭树脂制成的粘合片2的表面上的金属层3。此外，在图（b）中，金属层3形成在作为非热湮灭树脂的树脂基板2a和热湮没树脂的复合膜的粘合片2的表面的热湮没树脂层2b上层2b形成为层叠结构。在图（c）中，金属层3形成在通过混合不同树脂如热湮灭树脂和非热湮灭树脂制成的粘合片2c的表面上。这里，非热湮灭树脂是指在加热时不能解决的普通树脂。版权所有（C）2004，JPO＆NCIPI

6. 发明专利

JP2004186264A Method of connecting electronic parts to substrate 审中-公开
公开(公告)号：JP2004186264A
公开(公告)日：2004-07-02
申请号：JP2002349196
申请日：2002-11-29
申请人： Sekisui Chem Co Ltd , 積水化学工業株式会社
发明人： ENAMI TOSHIO , FUKUI KOJI
IPC分类号： H05K13/00 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a method of connecting electronic parts to a substrate without causing a mounting position to be displaced. SOLUTION: The method of connecting electronic parts to the substrate comprises the steps of disposing an electrode of the substrate and an electrode of the electronic parts via a conductive connecting material while opposing them, pressing and fixing the electronic parts disposed on the substrate with a bonding sheet vanishing with heating, then fusing the conductive connection material to the electrode to conductively connect the substrate and the electronic parts, and further heating and extinguishing the bonding sheet vanishing with heating. COPYRIGHT: (C)2004,JPO&NCIPI

7. 发明专利

JP2004186263A Reinforced semiconductor wafer and method for manufacturing ic chip 审中-公开
公开(公告)号：JP2004186263A
公开(公告)日：2004-07-02
申请号：JP2002349193
申请日：2002-11-29
申请人： Sekisui Chem Co Ltd , 積水化学工業株式会社
发明人： ENAMI TOSHIO , FUKUI KOJI
IPC分类号： H01L21/304 , H01L21/301
摘要： PROBLEM TO BE SOLVED: To provide a reinforced semiconductor wafer which has proper handleability and in which even if the wafer is polished to a thickness of about 50μm, a support plate can be released without damage, etc., and to provide a method for manufacturing an IC chip in which the IC chip divided into pieces by dicing the semiconductor wafer polished to the thickness of about 50μm can be released from the support plate without bringing about a crack, a cutout, etc. SOLUTION: The reinforce semiconductor wafer includes the semiconductor wafer, and the support plate which is adhered to the one side surface of the semiconductor wafer via an adhesive made of a heat extinguishable resin or an adhesive containing the heat extinguishable resin. COPYRIGHT: (C)2004,JPO&NCIPI

8. 发明专利

JP2004039922A Three dimensional wiring structure, manufacturing method therefor, and cutting method therefor 审中-公开
公开(公告)号：JP2004039922A
公开(公告)日：2004-02-05
申请号：JP2002196088
申请日：2002-07-04
申请人： Sekisui Chem Co Ltd , 積水化学工業株式会社
发明人： NAKASUGA AKIRA , ENAMI TOSHIO
IPC分类号： H01L21/3205
摘要： PROBLEM TO BE SOLVED: To provide a three dimensional wiring structure where there can be electrically easily connected portions which are desired to be made electrically conductive, and when electrical conduction is interrupted owing to circumstances, there is lost electrical conduction at a portion where electrical conduction is desired to be obstructed, and hereby electrical conduction/insulation can be changed with ease. SOLUTION: In the three dimensional wiring structure wherein opposing wiring pattern-shaped metal wiring circuits are provided via a semi-insulating substance which is conductive when higher voltage than operation voltage is applied, voltage is applied between specific metal wiring circuits to permit metal to be deposited on the one metal wiring circuit, whereby a wiring for connecting between the foregoing metal wiring circuits is formed in the foregoing semi-insulating substance. COPYRIGHT: (C)2004,JPO

9. 发明专利

JP2004015010A Vessel for storing semiconductor wafer 审中-公开
公开(公告)号：JP2004015010A
公开(公告)日：2004-01-15
申请号：JP2002170323
申请日：2002-06-11
申请人： Sekisui Chem Co Ltd , 積水化学工業株式会社
发明人： ENAMI TOSHIO
IPC分类号： B65D81/30 , B65D85/86 , H01L21/673 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a vessel for storing semiconductor wafer, which can prevent a support stuck to a wafer by ultraviolet curing-type adhesive from being peeled off during transport. SOLUTION: The vessel is formed of a vessel body 11 where the thin wafer 2 to which the support is stuck by ultraviolet curing-type adhesive is stored and of a lid 12, and it interrupts light whose wavelength is not more than 500nm. COPYRIGHT: (C)2004,JPO

10. 发明专利

JP2013149774A Anisotropic conductive material, connection structure and method for producing connection structure 审中-公开
标题翻译：各向异性传导材料，连接结构和生产连接结构的方法
公开(公告)号：JP2013149774A
公开(公告)日：2013-08-01
申请号：JP2012008820
申请日：2012-01-19
申请人： Sekisui Chem Co Ltd , 積水化学工業株式会社
发明人： NAKAYAMA ATSUSHI , ISHIZAWA HIDEAKI , ENAMI TOSHIO , HATAI MUNEHIRO
IPC分类号： H05K3/32 , C09J7/00 , C09J11/02 , C09J201/00 , H01B1/22 , H01B5/16 , H01R11/01 , H01R43/00 , H05K1/14
摘要： PROBLEM TO BE SOLVED: To provide an anisotropic conductive material and a connection structure capable of making migration resistance in a copper electrode excellent when connected to a connection object member having the copper electrode on a surface thereof.SOLUTION: An anisotropic conductive material is used for connection of a connection object member having a copper electrode on a surface thereof. The anisotropic conductive material includes: a conductive particle 3 having metal whose melting point is 400°C or more on a conductive surface thereof; a curable composition capable of being cured by heating; a thermal curing agent; and a flux. A connection structure 21 includes: a first connection object member 22 having a first electrode 22b on a surface 22a; a second connection object member 23 having a second electrode 23b on a surface 23a; and a connection 1A. At least one of the first electrode 22b and the second electrode 23b is the copper electrode. The connection 1A is formed by curing the anisotropic conductive material.
摘要翻译：要解决的问题：提供一种各向异性导电材料和能够使铜电极中的耐迁移性在连接到其表面上具有铜电极的连接对象部件时优异的各向异性导电材料和连接结构。解决方案：使用各向异性导电材料在其表面上连接具有铜电极的连接对象构件。各向异性导电材料包括：在其导电表面上具有熔点为400℃以上的金属的导电粒子3; 能够通过加热固化的可固化组合物; 热固化剂; 和助焊剂。连接结构21包括：在表面22a上具有第一电极22b的第一连接对象部件22; 在表面23a上具有第二电极23b的第二连接对象部件23; 和连接1A。第一电极22b和第二电极23b中的至少一个是铜电极。通过固化各向异性导电材料形成连接1A。

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