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1. 发明专利

JP2013187253A Electronic device and electronic device manufacturing method 审中-公开
标题翻译：电子设备和电子设备制造方法
公开(公告)号：JP2013187253A
公开(公告)日：2013-09-19
申请号：JP2012049615
申请日：2012-03-06
申请人： Seiko Instruments Inc , セイコーインスツル株式会社
发明人： NAKAMURA NORIHIKO , SATO KEIJI , TAKEUCHI HITOSHI , ARATAKE KIYOSHI , NUMATA SATOSHI
IPC分类号： H01L23/04
摘要： PROBLEM TO BE SOLVED: To provide an electronic device which is manufactured at low cost, which has resistance against stress such as deformation and resistance against weather, and which has good reliability; and provide a manufacturing method of the electronic device.SOLUTION: An electronic device 1 comprises: a glass substrate 10; internal wiring 30 provided on a top face of the glass substrate 10; an electronic component 50 mounted on the glass substrate 10 and electrically connected to the internal wiring 30; a through electrode 20 with one end being connected to the internal wiring 30; an insulation resin layer 70 formed on an undersurface of the glass substrate 10 having a uniform thickness on a position at a distance from another end of the through electrode 20; and a conductive resin layer 80 stacked so as to be connected to the insulation resin layer 70 and the other end of the through electrode 20.
摘要翻译：要解决的问题：提供一种低成本制造的电阻器件，其具有抗变形和耐气候等应力，并具有良好的可靠性; 并提供电子设备的制造方法。电子设备1包括：玻璃基板10; 设置在玻璃基板10的顶面的内部布线30; 安装在玻璃基板10上并电连接到内部布线30的电子部件50; 一端连接到内部布线30的通孔电极20; 形成在玻璃基板10的下表面上的绝缘树脂层70，其在距通孔20的另一端一定距离的位置处具有均匀的厚度; 以及与绝缘树脂层70和贯通电极20的另一端连接的导电性树脂层80。

2. 发明专利

JP2013143443A Method of manufacturing electronic component package and electronic component package 有权
标题翻译：制造电子元件封装和电子元件封装的方法
公开(公告)号：JP2013143443A
公开(公告)日：2013-07-22
申请号：JP2012002368
申请日：2012-01-10
申请人： Seiko Instruments Inc , セイコーインスツル株式会社
发明人： NAKAMURA NORIHIKO , TAKEUCHI HITOSHI , KOZUKI ATSUSHI , ARATAKE KIYOSHI , NUMATA SATOSHI
IPC分类号： H01L23/04 , H01L23/08 , H03H3/02 , H03H9/02
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component package in which productivity is excellent and which secures conductivity between an electronic component and an external electrode, and also to provide the electronic component package.SOLUTION: An electronic component package includes: a base material 11 obtained by polishing a base material 10; a conductive member 31 which penetrates through the base material 11 and is fused with a low melting glass 21 after an insulating substance on the surface is removed by polishing ; an electronic component 60 installed on one face of the conductive member 31 via internal wiring 40 and a connection 50; an external electrode 90 installed on the face of the base material 11 opposite to the face on which the electronic component 60 is installed, via an insulation resin 25 and a metal film 80; and a cover 70 which protects the electronic component 60 on the base material 11.
摘要翻译：要解决的问题：提供一种制造生产率优异并且确保电子部件和外部电极之间的导电性并且还提供电子部件封装的电子部件封装的方法。解决方案：一种电子部件封装，包括：通过研磨基材10获得的基材11; 在表面上的绝缘物质通过研磨去除之后，穿透基材11并与低熔点玻璃21熔融的导电部件31; 经由内部布线40和连接50安装在导电构件31的一个面上的电子部件60; 通过绝缘树脂25和金属膜80安装在与安装有电子部件60的面相反的基材11的表面上的外部电极90; 以及保护基材11上的电子部件60的盖70。

3. 发明专利

JP2013055114A Manufacturing method of electronic device 审中-公开
标题翻译：电子器件的制造方法
公开(公告)号：JP2013055114A
公开(公告)日：2013-03-21
申请号：JP2011190574
申请日：2011-09-01
申请人： Seiko Instruments Inc , セイコーインスツル株式会社
发明人： NAKAMURA NORIHIKO , ARATAKE KIYOSHI , NUMATA SATOSHI
IPC分类号： H01L23/08 , H01L23/04
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic device capable of stably keeping conduction between an electronic component and an external electrode, and easily forming a through electrode.SOLUTION: A manufacturing method of an electronic device includes the steps of: (a) forming a hollow on either of upper and lower surfaces of a base material 9; (b) filling the hollow with a plating layer 21 by performing via-fill plating processing for the hollow; and (c) forming a base 10 having a through electrode 20 composed of a plating layer 21 on a base material 9 after polishing by polishing the base material 9 so that at least a bottom surface of the hollow is exposed outside.
摘要翻译：解决的问题：提供能够稳定地保持电子部件与外部电极之间的导通性并容易形成贯通电极的电子器件的制造方法。解决方案：电子设备的制造方法包括以下步骤：（a）在基材9的上表面和下表面中的任一个上形成中空; （b）通过对中空部进行过孔填充电镀处理，用镀层21填充中空部; 和（c）通过抛光基材9在基体材料9上抛光后形成具有由电镀层21构成的通孔20的基底10，使得至少中空部分的底面暴露在外部。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2012114231A Light emitting component, light emitter, and manufacturing method of the light emitting component 有权
标题翻译：发光元件的发光元件，发光元件及制造方法
公开(公告)号：JP2012114231A
公开(公告)日：2012-06-14
申请号：JP2010261717
申请日：2010-11-24
申请人： Seiko Instruments Inc , セイコーインスツル株式会社
发明人： NAKAYAMA HITOSHI , NAKAMURA NORIHIKO
IPC分类号： H01L33/56 , H01L23/29 , H01L23/31
CPC分类号： H01L2224/48091 , H01L2224/8592 , H01L2224/92247 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a light emitting component which improves adhesion of a sealing resin without changing material composition while maintaining light resistance of the sealing resin and a gas shut off function of a primer layer, and to provide a manufacturing method of the light emitting component.SOLUTION: A light emitting element and a primer layer having an excellent gas shut off function are sealed with a sealing resin having excellent light resistance. Further, the primer layer is formed so as to have a multilayer structure composed of a gas shut off layer and an adhesion layer improving the adhesion of the sealing resin. This structure improves the adhesion of the sealing resin.
摘要翻译：要解决的问题：提供一种在不改变材料组成的情况下提高密封树脂的粘附性的发光组分，同时保持密封树脂的耐光性和底漆层的气体截止功能，并提供制造方法的发光元件。解决方案：具有优异的气体切断功能的发光元件和底漆层用耐光性优异的密封树脂密封。此外，底涂层形成为具有由气体切断层和粘合层构成的多层结构，从而提高密封树脂的粘附性。这种结构改善了密封树脂的粘合性。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2011124449A Light emission component, light emitter and method for manufacturing light emission component 审中-公开
标题翻译：光发射部件，发光元件及制造光发射部件的方法
公开(公告)号：JP2011124449A
公开(公告)日：2011-06-23
申请号：JP2009282135
申请日：2009-12-11
申请人： Seiko Instruments Inc , セイコーインスツル株式会社
发明人： NAKAMURA NORIHIKO
IPC分类号： H01L33/48
CPC分类号： H01L33/60 , H01L24/97 , H01L33/40 , H01L33/56 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/12041 , H01L2933/0033 , Y10T29/49146 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a highly reliable light emission component using an LED which is satisfactory in heat dissipation, and high in luminance and high in output. SOLUTION: The light emission component is provided with: a light source; a first metallic substrate on which the light source is mounted; a wire bond connected to the light source; a second metallic substrate electrically connected to the light source by the wire bond, formed like the same plane as the first metallic substrate, and insulated from the first metallic substrate; plane-shaped reflecting members formed on the first metallic substrate and the second metallic substrate, respectively, and have through-holes whose light source side faces are smaller than opposite side faces of the light source side faces, and have the through-hole side faces formed of inclined reflection faces; a molding section covering the light source; a slit formed between the first metallic substrate and the second metallic substrate; and an insulating material filling the slit. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供使用LED散热好，亮度高，输出高的LED的高度可靠的发光部件。解决方案：发光部件设置有：光源; 安装有光源的第一金属基板; 连接到光源的引线键; 第二金属基板，通过线接合电连接到光源，与第一金属基板形成为与第一金属基板相同的平面，并与第一金属基板绝缘; 分别形成在第一金属基板和第二金属基板上的平面状的反射部件，并且具有光源侧面比光源侧的相对侧面小的通孔，并且具有通孔侧面由倾斜反射面形成; 覆盖光源的成型部; 形成在所述第一金属基板和所述第二金属基板之间的狭缝; 以及填充狭缝的绝缘材料。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2010267740A Electronic device 有权
标题翻译：电子设备
公开(公告)号：JP2010267740A
公开(公告)日：2010-11-25
申请号：JP2009116888
申请日：2009-05-13
申请人： Seiko Instruments Inc , セイコーインスツル株式会社
发明人： TAKEUCHI HITOSHI , SATO KEIJI , ARATAKE KIYOSHI , NAKAMURA NORIHIKO , NUMATA SATOSHI , SUGIYAMA TAKESHI , TERADA DAISUKE
IPC分类号： H01L23/08
摘要： PROBLEM TO BE SOLVED: To provide an electronic device which has high soldering and mounting quality of an electronic component and a circuit board. SOLUTION: An external electrode formed on a bottom surface of a glass package housing an electronic element includes: an electrode metal layer bonded to a glass-made base 3; and a surface layer formed on a surface of the electrode metal layer. The electrode metal layer consists of a metal element, Cr, Ti, Mo, W, Ta, etc., which has good adhesion to the glass and forms no compound with the solder within an in-use temperature range. The surface layer consists of a metal, Au, Ag, Pd, etc., which is hard to oxidize within the in-use temperature range, has small diffusion to the electrode metal layer, and is easily diffused in the solder during soldering. Further, when the metal element (the same as what constitutes the metal electrode layer) which forms no compound with the solder is included in the surface layer, a solder junction surface has excellent shear strength and bending resistance. Consequently, the electronic device is provided which has the high soldering and mounting quality. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种电子部件和电路板具有高焊接和安装质量的电子设备。解决方案：形成在容纳电子元件的玻璃封装的底表面上的外部电极包括：结合到玻璃制基座3的电极金属层; 以及形成在电极金属层的表面上的表面层。电极金属层由金属元素Cr，Ti，Mo，W，Ta等组成，其与玻璃具有良好的粘合性，并且在使用温度范围内不与焊料形成化合物。表面层由在使用温度范围内难以氧化的金属Au，Ag，Pd等构成，对电极金属层的扩散少，在焊接时容易在焊料中扩散。此外，当在表面层中包含不与焊料形成化合物的金属元素（与构成金属电极层相同的金属元素）时，焊料接合面具有优异的抗剪切强度和耐弯曲性。因此，提供了具有高焊接和安装质量的电子设备。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2010267739A Electronic component and electronic component manufacturing method 有权
标题翻译：电子元件和电子元件制造方法
公开(公告)号：JP2010267739A
公开(公告)日：2010-11-25
申请号：JP2009116887
申请日：2009-05-13
申请人： Seiko Instruments Inc , セイコーインスツル株式会社
发明人： TAKEUCHI HITOSHI , SATO KEIJI , ARATAKE KIYOSHI , NAKAMURA NORIHIKO , TERADA DAISUKE , NUMATA SATOSHI , SUGIYAMA TAKESHI
IPC分类号： H01L23/12 , H01L23/02 , H01L23/15 , H03H3/02 , H03H9/02
摘要： PROBLEM TO BE SOLVED: To improve the soldering and mounting quality of an electronic component and a circuit board and so on. SOLUTION: A base 3 is made of a glass having through electrodes 7, 17 formed thereon, and an external electrode 8 which conducts with an electrode of a crystal vibrator 6 is formed on a bottom surface of the base 3. The external electrode 8 includes: an electrode film 31 for bonding, which is bonded to solder during soldering; and an oxidation-preventive film 51 formed thereupon. The oxidation preventive film 51 is formed by stacking an Au layer and a Cr layer alternately, and a front surface of an Au layer is bonded to the electrode film 31 for bonding. The total thickness of Au layers constituting the oxidation preventive film 51 is set to 300 to 100[nm], preferably, 300 to 450[nm], and a thickness which is thick enough to effectively prevent oxidation of the electrode film 31 for bonding is secured, embrittlement of the solder due to too much Au being prevented. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提高电子部件和电路板等的焊接和安装质量。解决方案：底座3由形成有贯通电极7,17的玻璃制成，在基座3的底面上形成有与晶体振子6的电极导通的外部电极8.外部电极8包括：焊接时焊接的焊料用电极膜31，和形成在其上的防氧化膜51。氧化防止膜51通过交替层叠Au层和Cr层而形成，Au层的前表面接合到用于接合的电极膜31。构成防氧化膜51的Au层的总厚度设定为300〜100 [nm]，优选为300〜450 [nm]，厚度足以有效防止用于接合的电极膜31的氧化的厚度为防止由于太多的Au而导致的焊料脆化。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2010157668A Electronic circuit component and electronic apparatus 有权
标题翻译：电子电路元件和电子设备
公开(公告)号：JP2010157668A
公开(公告)日：2010-07-15
申请号：JP2009000410
申请日：2009-01-05
申请人： Seiko Instruments Inc , セイコーインスツル株式会社
发明人： KUME AKIRA , HAYASHI KEIICHIRO , NAKAMURA NORIHIKO
IPC分类号： H05K3/32 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To prevent a pat from being detached by the solvent of conductive paste.
SOLUTION: An electronic component 1 has printed wiring formed on the front surface of a resin body 5 to be mounted. The printed wiring 3 includes a pat 31 which bonds connection terminals 20 and 80 through a bonding material 6 consisting of conductive paste having a curing temperature lower than the heat-resistant temperature of the body 5 to be mounted. The pat 31 is arranged on a protective layer 7 bonded to the front surface of the body 5 to be mounted, and the protective layer 7 consists of a polymer material which exhibits swelling resistance for the solvent contained in the conductive paste.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了防止由导电浆料的溶剂分离。解决方案：电子部件1具有形成在要安装的树脂体5的前表面上的印刷布线。印刷布线3包括通过由具有低于待安装的主体5的耐热温度的固化温度的导电浆料构成的接合材料6将连接端子20和80接合的轻拍31。轻拍31布置在粘合到待安装的主体5的前表面上的保护层7上，并且保护层7由对导电浆料中包含的溶剂表现出具有溶胀阻力的聚合物材料组成。版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2010010940A Method for manufacturing crystal oscillator 审中-公开
标题翻译：制造水晶振荡器的方法
公开(公告)号：JP2010010940A
公开(公告)日：2010-01-14
申请号：JP2008166282
申请日：2008-06-25
申请人： Seiko Instruments Inc , セイコーインスツル株式会社
发明人： SATO KEIJI , TAKEUCHI HITOSHI , NAKAMURA NORIHIKO , NUMATA SATOSHI , KAWADA YASUO
IPC分类号： H03H3/02 , H01L23/04 , H01L23/06 , H03H9/02
CPC分类号： H01L2224/45144 , H01L2224/48091 , H01L2224/48471 , H01L2224/48479 , H01L2924/00014 , H01L2924/00 , H01L2224/4554
摘要： PROBLEM TO BE SOLVED: To provide a press-fit sealed cylindrical crystal oscillator which is excellent in press-fit performance, thermal resistance, shock resistance and long-term reliability, by modification of a plating for press-fit process, and to provide a method for manufacturing the crystal oscillator. SOLUTION: The plating of stem and lead is formed in order of a Cu plating layer 13, an Sn plating layer 14, and a metal layer 15 for formation of intermetallics with Sn, suppression of reaction between Sn and Au, and wire bonding. COPYRIGHT: (C)2010,JPO&INPIT

10. 发明专利

JP2009297216A Cerebrovascular disease risk evaluation system 有权
标题翻译：脑血管病风险评估系统
公开(公告)号：JP2009297216A
公开(公告)日：2009-12-24
申请号：JP2008154262
申请日：2008-06-12
申请人： Tsutomu Kamei , Koji Murata , Seiko Instruments Inc , セイコーインスツル株式会社 , 勉亀井 , 幸治村田
发明人： NAKAMURA NORIHIKO , KAMEI TSUTOMU , MURATA KOJI
IPC分类号： A61B8/06 , A61B5/0285
CPC分类号： A61B8/06 , A61B5/02 , A61B5/021 , A61B5/026 , A61B5/4064 , A61B5/7275 , A61B8/04 , A61B8/488
摘要： PROBLEM TO BE SOLVED: To provide a system carrying out cerebrovascular disease risk evaluation with little load to a subject and with a simple measuring means. SOLUTION: The system comprises a sensor section 1, a circuit section 2, a calculating section 3, and an output section 4. The circuit section 2 is a functional section for driving the sensor section 1 and transmitting the signals detected in the sensor section 1 to the calculating section 3 and has a transmitting circuit 21, the first receiving circuit 22, and the second receiving circuit 23 and others. The transmitting circuit 21 is connected to a transmitting element 111 and a transmitting element 121, and drives these elements to generate continuous waves. A speed waveform calculating section 31 is connected to the first receiving circuit 22 and the second receiving circuit 23 and obtains the frequency of the reflecting continuous waves detected by the receiving elements 112, 122. Thereafter, the frequency of the reflecting continuous waves are compared with the frequency of the transmitting circuit 21 to detect the changing amount of the frequency. The velocity v of blood can be obtained from these values. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种进行脑血管疾病风险评估的系统，并且以简单的测量方法对受试者施加负载较小。解决方案：系统包括传感器部分1，电路部分2，计算部分3和输出部分4.电路部分2是用于驱动传感器部分1的功能部分，并且传送在传感器部分1到计算部分3，并且具有发送电路21，第一接收电路22和第二接收电路23等。发送电路21连接到发送元件111和发送元件121，并且驱动这些元件以产生连续波。速度波形计算部分31连接到第一接收电路22和第二接收电路23，并且获得由接收元件112,122检测的反射连续波的频率。此后，将反射连续波的频率与发送电路21的频率来检测频率的变化量。血液的速度v可以从这些值得到。版权所有（C）2010，JPO＆INPIT

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