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1. 发明专利

JP2006074038A Field-effect transistor containing organic semiconductor layer 有权
标题翻译：包含有机半导体层的场效应晶体管
公开(公告)号：JP2006074038A
公开(公告)日：2006-03-16
申请号：JP2005242231
申请日：2005-08-24
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： RUSSEL DAVID , NEWSOME CHRISTOPHER , KUGLER THOMAS , LI SHUNPU
IPC分类号： H01L29/786 , H01L21/3205 , H01L21/336 , H01L23/52 , H01L51/00 , H01L51/05 , H01L51/10
CPC分类号： H01L51/0545 , H01L51/0019 , H01L51/0034 , H01L51/0035 , H01L51/0036 , H01L51/0541 , H01L51/105
摘要： PROBLEM TO BE SOLVED: To provide a simpler separate means in place of a conventional means by providing the region of an implantation substance between the source electrode of a field-effect transistor and a functional organic semiconductor layer.
SOLUTION: The field-effect transistor (10) containing a metal or a carbon source electrode (14) and a functional organic semiconductor layer (28) is formed. A columnar implantation substance (48) passing through the layer (28) is extended to contact the electrode (14) and the layer (28). The column facilitates a charged carrier to move between the electrode (14) and the layer (28). The organic compounds such as 3-hexyl thiophene, polyallylamine, a poly(3,4-ethylene dioxy thiophene)-polystyrene sulfonic acid or polyaniline are desirable as the implantation substance.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了通过在场效应晶体管的源电极和功能性有机半导体层之间提供注入物质的区域来提供更简单的单独装置来代替常规手段。解决方案：形成含有金属或碳源电极（14）和功能性有机半导体层（28）的场效应晶体管（10）。穿过层（28）的柱状注入物质（48）被延伸以接触电极（14）和层（28）。该柱有助于带电载体在电极（14）和层（28）之间移动。有机化合物如3-己基噻吩，聚烯丙胺，聚（3,4-亚乙基二氧噻吩） - 聚苯乙烯磺酸或聚苯胺是所需的植入物质。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2007083723A Production process of substrate which has areas different in hydrohilicity and lipophilicity in one surface 有权
标题翻译：在一个表面上在水合物和亲油性中不同的基质的生产过程
公开(公告)号：JP2007083723A
公开(公告)日：2007-04-05
申请号：JP2006254972
申请日：2006-09-20
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： KUGLER THOMAS , LI SHUNPU , NEWSOME CHRISTOPHER , RUSSEL DAVID
IPC分类号： B32B9/00 , C08J7/06 , C08J7/12 , H01L33/00 , H01L51/00 , H05K1/00 , H05K3/12
CPC分类号： H05K3/125 , B82Y20/00 , B82Y30/00 , H01L51/0004 , H01L51/0012 , H01L51/0097 , H01L2251/105 , H01L2251/5369 , H05K1/0393 , H05K3/1208 , H05K2203/013 , H05K2203/095 , H05K2203/097 , H05K2203/1173 , Y02E10/549 , Y02P70/521
摘要： PROBLEM TO BE SOLVED: To provide a substrate production process, in which areas of substantially different wettability are formed properly on a flexible substrate. SOLUTION: The invention relates to the substrate with uneven wettability on its surface. the uneven wettability consists of neighboring areas different in hydrophilicity and/or lipophilicity. The invention also relates to the production process of such substrates, and micro electronic components where electric functional materials are deposited on such substrates. The invention provides the production process of the flexible substrate with uneven wettability. The production process comprises a step to form a first area comprising an inorganic material on a substrate precursor so as to form the substrate, wherein at least a part of the inorganic material is exposed on the surface of the substrate, and the first area makes a pattern on the substrate precursor. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种基板制造工艺，其中在柔性基板上适当地形成基本上不同的润湿性的区域。解决方案：本发明涉及在其表面上具有不均匀润湿性的基材。不均匀的润湿性由亲水性和/或亲油性不同的相邻区域组成。本发明还涉及这种基板的制造方法以及其中电功能材料沉积在这种基板上的微电子部件。本发明提供了具有不均匀润湿性的柔性基材的生产方法。该制造方法包括在基板前体上形成包含无机材料的第一区域以形成基板的步骤，其中至少一部分无机材料暴露在基板的表面上，并且第一区域形成图案在基板前体上。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2006332636A Method of forming hetero-junction in organic semiconductor polymer 有权
标题翻译：在有机半导体聚合物中形成异质结的方法
公开(公告)号：JP2006332636A
公开(公告)日：2006-12-07
申请号：JP2006123033
申请日：2006-04-27
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： NEWSOME CHRISTOPHER , KUGLER THOMAS , LI SHUNPU , RUSSEL DAVID
IPC分类号： H01L51/40 , B41M5/00 , B41M5/50 , B41M5/52 , H01L21/368 , H01L29/786 , H01L33/00 , H01L51/00 , H01L51/05 , H01L51/42 , H01L51/50 , H05B33/10
CPC分类号： H01L51/0005 , H01L51/0007 , H01L51/424 , Y02E10/549
摘要： PROBLEM TO BE SOLVED: To provide a method of forming a hetero-junction of adjacent first and second organic semiconductor polymer layers.
SOLUTION: First, a first organic semiconductor polymer layer 12 is formed on a substrate 10. Then, the solution of a film formation material is deposited on it. Since the first organic semiconductor polymer 12 is insoluble to this solution, it is not influenced. A temporary film 14 having a thickness of 20 nm is formed by drying. Then, the solution 16 of the second organic semiconductor polymer dissolved in an organic solvent is deposited on the above temporary film 14, and is made to dry. The thickness of the above temporary film 14 is set so that a part for the thickness may be permeated between the time durations by which the solution 15 of the above second organic semiconductor polymer is dried. Thereby, the temporary film 14 is decomposed without giving a damage to the first organic semiconductor polymer layer 12, and the second organic semiconductor layer 19 is formed so that it may touch on the above first organic semiconductor polymer layer 12.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：提供形成相邻的第一和第二有机半导体聚合物层的异质结的方法。解决方案：首先，在基板10上形成第一有机半导体聚合物层12.然后，在其上沉积成膜材料的溶液。由于第一有机半导体聚合物12不溶于该溶液，因此不受影响。通过干燥形成厚度为20nm的临时膜14。然后，将溶解在有机溶剂中的第二有机半导体聚合物溶液16沉积在上述临时膜14上，使其干燥。上述临时膜14的厚度被设定为使得可以在上述第二有机半导体聚合物的溶液15干燥的时间间隔之间渗透厚度部分。因此，临时膜14不会对第一有机半导体聚合物层12造成损害而分解，并且形成第二有机半导体层19，使得其可以接触上述第一有机半导体聚合物层12。版权所有：（C）2007，JPO＆INPIT

4. 发明专利

JP2006041495A Method of manufacturing semiconductor element from dispersed particle of semiconductor 有权
标题翻译：从半导体分散粒子制造半导体元件的方法
公开(公告)号：JP2006041495A
公开(公告)日：2006-02-09
申请号：JP2005180203
申请日：2005-06-21
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： KUGLER THOMAS , NEWSOME CHRISTOPHER , RUSSEL DAVID , LI SHUNPU
IPC分类号： H01L29/786 , H01L21/208 , H01L21/336 , H01L21/368 , H01L51/00 , H01L51/05 , H01L51/50 , H05B33/10
CPC分类号： H01L21/02568 , H01L21/0256 , H01L21/02576 , H01L21/02579 , H01L21/02601 , H01L21/02628 , H01L51/0003 , H01L51/0037 , H01L51/0053 , H01L51/007 , H01L51/0545
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing semiconductor elements from dispersed particles of a semiconductor.
SOLUTION: This invention is a method of manufacturing semiconductor elements, such as films or the like. The method comprises a first process (i) of laminating a suspension containing first semiconductor particles and a solution containing a second semiconductor or its precursor on the surface of a board so as to produce a mixture containing the first semiconductor particles suspended in a liquid phase containing the second semiconductor or its precursor on the board and a second process (ii) of solidifying the mixture so as to form semiconductor elements containing the first semiconductor particles in a second semiconductor matrix which electrically connects the first semiconductor adjacent particles together. The first and second semiconductor are of the same conductivity type and formed of the same or other materials. The semiconductor elements are high enough in bulk charge carrier mobility and suitable for use in a microprocessor or other high-performance electric devices even when they are not subjected to sintering after lamination.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供从半导体的分散颗粒制造半导体元件的方法。解决方案：本发明是制造诸如膜等的半导体元件的方法。该方法包括在板的表面上层压包含第一半导体颗粒的悬浮液和含有第二半导体或其前体的溶液的第一工艺（i），以产生包含悬浮在液相中的第一半导体颗粒的混合物第二半导体或其前体，以及使混合物固化的第二工艺（ii），以便在将第一半导体相邻颗粒电连接在一起的第二半导体矩阵中形成包含第一半导体颗粒的半导体元件。第一和第二半导体具有相同的导电类型并且由相同或其它材料形成。半导体元件在体积电荷载流子迁移率方面足够高，并且即使在层压之后它们不经历烧结时也适用于微处理器或其它高性能电子器件。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2007243192A Method for manufacturing electronic device and embossing tool 有权
标题翻译：制造电子设备和制造工具的方法
公开(公告)号：JP2007243192A
公开(公告)日：2007-09-20
申请号：JP2007056695
申请日：2007-03-07
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： LI SHUNPU , NEWSOME CHRISTOPHER , RUSSEL DAVID , KUGLER THOMAS
IPC分类号： H01L21/288 , H01L21/336 , H01L29/417 , H01L29/423 , H01L29/49 , H01L29/786
CPC分类号： H01L51/0005 , H01L21/0337 , H01L51/0037 , H01L2251/105 , Y10T156/1039
摘要： PROBLEM TO BE SOLVED: To provide a manufacture of a capacitor structure having good insulating property, and to provide ink-jet printing and embossing technology which can form a short channel in TFT manufacturing process. SOLUTION: The method for manufacturing an electronic device has a step of embossing surfaces of work-pieces 200, 202 using an embossing tool 204, and forming a microstructure having at least two levels of thickness contrast on the work-pieces, and a step of depositing fluid 208 containing a functional material onto the microstructure. Preferably, the step of depositing the fluid 208 comprises the ink-jet printing, and the embossing tool 204 for creating the microstructure on the work-pieces 200, 202 comprises a first surface and steps of at least two different heights relative to the first surface. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供具有良好绝缘性能的电容器结构的制造，并提供可在TFT制造工艺中形成短沟道的喷墨印刷和压花技术。解决方案：电子设备的制造方法具有使用压花工具204对工件200,202的表面进行压花，并且在工件上形成具有至少两层厚度对比度的微观结构的步骤，以及将包含功能材料的流体208沉积到微结构上的步骤。优选地，沉积流体208的步骤包括喷墨打印，并且用于在工件200,202上形成微结构的压花工具204包括第一表面和相对于第一表面的至少两个不同高度的步骤。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2007088474A Method for producing substrate with different hydrophilic and/or oleophilic areas on identical surface 有权
标题翻译：用于生产具有不同的亲水性和/或亲油性表面的基底的方法
公开(公告)号：JP2007088474A
公开(公告)日：2007-04-05
申请号：JP2006254974
申请日：2006-09-20
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： KUGLER THOMAS , LI SHUNPU , NEWSOME CHRISTOPHER , RUSSEL DAVID
IPC分类号： H01L21/28 , C08K3/36 , C08K9/06 , H01L21/288 , H01L21/336 , H01L29/786 , H01L51/50 , H05B33/02 , H05B33/10
CPC分类号： C08K3/36 , C08K9/06 , H01L51/0022 , H01L51/0541 , H01L2251/105
摘要： PROBLEM TO BE SOLVED: To enhance capability to produce good wetting contrast. SOLUTION: A first embodiment of the present invention provides a method for producing a substrate with a surface comprising different hydrophilic and/or oleophilic areas which are adjacent to each other. The method comprises a process of etching and flowing out a polymer from an area in a surface layer of a substrate precursor which contains inorganic particles embedded in a polymer matrix. The etching exposes the inorganic particles in the surface to form one of the areas which are adjacent to each other. Furthermore, the present invention provides a method for producing a micro electronic component in which an electronic functional material is deposited on the substrate. Furthermore, the present invention provides the substrate and the substrate precursor. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提高产生良好的润湿对比度的能力。解决方案：本发明的第一实施方案提供了一种用于制备具有包括彼此相邻的不同亲水和/或亲油区域的表面的基材的方法。该方法包括从包含嵌入在聚合物基质中的无机颗粒的基材前体的表面层的区域中蚀刻并流出聚合物的方法。蚀刻暴露表面中的无机颗粒以形成彼此相邻的区域之一。此外，本发明提供一种微电子部件的制造方法，其中在基板上沉积电子功能材料。此外，本发明提供了基板和基板前体。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2006287224A Depositing method of polythiophene semiconductor on substrate 有权
标题翻译：基材上聚硅氧烷半导体的沉积方法
公开(公告)号：JP2006287224A
公开(公告)日：2006-10-19
申请号：JP2006093338
申请日：2006-03-30
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： NEWSOME CHRISTOPHER , LI SHUNPU , KUGLER THOMAS , RUSSEL DAVID
IPC分类号： H01L51/40 , H01L29/786 , H01L51/00 , H01L51/05 , H01L51/30
CPC分类号： H01L51/0005 , H01L51/0007 , H01L51/0036
摘要： PROBLEM TO BE SOLVED: To provide a method for forming a film on a substrate of a polythiophene semiconductor.
SOLUTION: A semiconductor is first dissolved in a solvent containing a halogen containing aromatic compound. The obtained solution is then ink jet-printed on the substrate. The method is useful for manufacturing micro electronic parts such as TFT devices.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：提供在聚噻吩半导体的基板上形成膜的方法。解决方案：首先将半导体溶解在含有卤素芳族化合物的溶剂中。然后将所得溶液喷墨印刷在基材上。该方法对于制造诸如TFT器件的微电子部件是有用的。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2006270100A Dedoping method of organic semiconductor 有权
标题翻译：有机半导体的切割方法
公开(公告)号：JP2006270100A
公开(公告)日：2006-10-05
申请号：JP2006078249
申请日：2006-03-22
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： RUSSEL DAVID , KUGLER THOMAS , NEWSOME CHRISTOPHER , LI SHUNPU
IPC分类号： H01L51/40 , C08G61/10 , C08G61/12 , C08G73/02 , H01L29/786 , H01L51/05 , H01L51/30
CPC分类号： C08G73/026 , C08G61/10 , C08G61/126 , C08G2261/312
摘要： PROBLEM TO BE SOLVED: To provide a method of easy and inexpensive dedoping of a doped organic semiconductor included in a semiconductor layer device. SOLUTION: An dedoping method of an organic semiconductor has a step of contacting a doped organic semiconductor to a compound in formula (1). In the formula, R 1 to R 8 show hydrogen atoms, or linear or branched-chain alkyl groups having the carbon number of 1 to 6. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种包含在半导体层器件中的掺杂有机半导体的简单和便宜的去掺杂的方法。解决方案：有机半导体的去掺杂方法具有使掺杂的有机半导体与式（1）中的化合物接触的步骤。在该式中，R 1 至R 8 显示氢原子，或碳数为1至6的直链或支链烷基。权利要求： C）2007，JPO＆INPIT

9. 发明专利

JP2005354044A Method of fabricating desired pattern of electronically functional material 有权
标题翻译：制作电子功能材料所需图案的方法
公开(公告)号：JP2005354044A
公开(公告)日：2005-12-22
申请号：JP2005135806
申请日：2005-05-09
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： LI SHUNPU , NEWSOME CHRISTOPHER , KUGLER THOMAS , RUSSEL DAVID
IPC分类号： B41M5/00 , B05D1/26 , B05D3/12 , G03F7/20 , H01L21/28 , H01L21/288 , H01L21/3205 , H01L21/336 , H01L21/84 , H01L29/786 , H01L51/00 , H01L51/05 , H01L51/30 , H01L51/40
CPC分类号： H01L51/0023 , H01L51/0022 , H01L51/0037 , H01L51/0541
摘要： PROBLEM TO BE SOLVED: To provide a method of forming a desired pattern of electronically functional material 3 on a substrate 1. SOLUTION: The method comprises the steps of: creating a first layer of patterning material 2 on the substrate 1 whilst leaving areas of the substrate exposed to define the desired pattern; printing a suspension comprising particles of the electronically functional material 3 in a liquid dispersant, to which the patterning material is impervious, on the patterning material and the exposed substrate; removing at least some of the liquid dispersant from the suspension to consolidate the particles; and applying a first solvent to the consolidated particles which is capable of solubilizing the patterning material 2 and to which the consolidated particles are pervious so that the patterning material is removed from the substrate 1 together with any overlying electronically functional material 3. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决方案：提供在基板1上形成所需图形的电子功能材料3的方法。解决方案：该方法包括以下步骤：在基板上形成第一层图案形成材料2 1，同时使衬底的区域暴露以限定所需图案; 将包含电子功能材料3的颗粒的悬浮液印刷在图案形成材料和暴露的基底上的图案形成材料不可渗透的液体分散剂中; 从悬浮液中除去至少一些液体分散剂以固结颗粒; 以及将第一溶剂施加到能够溶解图形材料2并且固结的颗粒可渗透的固结颗粒，使得图案形成材料与任何覆盖的电子功能材料3一起从基板1移除。（C）2006，JPO＆NCIPI

10. 发明专利

JP2007129227A Manufacturing method for electronic device, winding manufacturing process, thin-film transistor, and coating device 审中-公开
标题翻译：电子设备的制造方法，卷绕制造工艺，薄膜晶体管和涂层装置
公开(公告)号：JP2007129227A
公开(公告)日：2007-05-24
申请号：JP2006297445
申请日：2006-11-01
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： LI SHUNPU , NEWSOME CHRISTOPHER , RUSSEL DAVID , KUGLER THOMAS
IPC分类号： H01L21/288 , G03F7/00 , H01L21/312 , H01L21/336 , H01L21/368 , H01L29/417 , H01L29/786 , H01L51/00 , H01L51/05 , H01L51/40 , H01L51/56
CPC分类号： H01L51/0003 , B82Y10/00 , B82Y30/00 , B82Y40/00 , G03F7/0002 , H01L51/0012 , H01L51/0529 , H01L51/56
摘要： PROBLEM TO BE SOLVED: To provide a speedy and inexpensive high-resolution patterning method for manufacturing electronic devices. SOLUTION: A manufacturing method for the electronic device includes processes of forming a surface energy pattern on a substrate, coating the substrate with a first liquid by using a brush, and forming a pattern of liquid corresponding to the surface energy pattern on the substrate. Furthermore, a thin-film transistor has a conductive layer, a layer of an insulator formed on the conductive layer, a pattern of a conductive substance formed on the layer of the insulator and a first self-organizing single-layer film (SAM), a second SAM formed on the conductive substance, and a semiconductor layer formed on the first SAM and second SAM. Furthermore, a coating device has an ink-absorbing brush head, an ink container connected to the brush head by an ink flow passage, and a conveying belt, and a top surface of the conveying belt faces the brush head. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于制造电子设备的快速且便宜的高分辨率图形化方法。解决方案：电子设备的制造方法包括在基板上形成表面能图案的工序，使用刷子，用第一液体涂布基板，形成对应于表面能图案的液体图案基质。此外，薄膜晶体管具有导电层，形成在导电层上的绝缘体层，形成在绝缘体层上的导电物质的图案和第一自组织单层膜（SAM），形成在导电物质上的第二SAM，以及形成在第一SAM和第二SAM上的半导体层。此外，涂布装置具有吸墨刷头，通过墨流路连接到刷头的墨容器和输送带，并且输送带的顶表面面向刷头。版权所有（C）2007，JPO＆INPIT

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