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1. 发明专利

JP2011235558A Bonding film transfer device and bonding device 审中-公开
标题翻译：连接薄膜传输器件和接合器件
公开(公告)号：JP2011235558A
公开(公告)日：2011-11-24
申请号：JP2010109661
申请日：2010-05-11
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： GOMI KAZUHIRO , ITO YOSHIFUMI
IPC分类号： B29C65/48 , B23K20/00 , B29C65/78 , H01L21/02
摘要： PROBLEM TO BE SOLVED: To provide a bonding film transfer device which can transfer a bonding film with a target pattern on a surface of an adherend regardless of its simple structure and which can efficiently bond the adherend and the other adherend via the transferred bonding film, and a bonding device which can efficiently bond the adherend to which the bonding film is transferred by the bonding film transfer device and the other adherend.SOLUTION: The bonding film transfer sheet 1 has base material and the bonding film formed on the base material, and can transfer the bonding film to the first adherend 5. The bonding film transfer device 700 includes a plasma treatment mechanism 710 for performing plasma treatment on the bonding film of the bonding film transfer sheet 1, an adherend supply mechanism 720 which supplies the first adherend 5 on the bonding film to obtain a first temporary bonding body 7 composed by bonding the bonding film transfer sheet 1 and the first adherend 5, a pressing mechanism 730 for pressing the first temporary bonding body 7, and a peeling mechanism 740 for peeling the base material from the first temporary bonding body 7.
摘要翻译：要解决的问题：提供一种能够在被粘物表面上以目标图案转印接合膜的接合膜转移装置，而不管其结构简单，并且可以经由转印的有效粘合被粘物和其他被粘物接合膜和能够通过接合膜转移装置和其它被粘物高效地接合粘合膜被转印的被粘物的接合装置。解决方案：接合膜转印片1具有形成在基材上的基材和接合膜，并且可以将接合膜转印到第一被粘物5.接合膜转移装置700包括用于执行的等离子体处理机构710 在接合膜转印片1的接合膜上进行等离子体处理，将粘合剂供给机构720提供给接合膜上的第一被粘物5，以获得通过接合粘合膜转印片1和第一被粘物构成的第一临时粘合体7 5，用于按压第一临时粘合体7的按压机构730，以及用于从第一临时粘结体7剥离基材的剥离机构740.权利要求（C）2012，JPO＆INPIT

2. 发明专利

JP2011129591A Bonding method and method of manufacturing sealed type device 审中-公开
标题翻译：粘合方法和制造密封型设备的方法
公开(公告)号：JP2011129591A
公开(公告)日：2011-06-30
申请号：JP2009284439
申请日：2009-12-15
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： ONISHI HAJIME , ITO YOSHIFUMI
IPC分类号： H01L23/02
摘要： PROBLEM TO BE SOLVED: To provide a bonding method capable of achieving easy bonding while controlling a bonding region of a member to which a bonding film has been transferred, so that the bonding film in a desired shape can be easily transferred to a surface of the member; and to provide a method of manufacturing a sealed type device in which the sealed type device with high reliability can be efficiently manufactured. SOLUTION: Two bonding film transfer sheets have a base material and a first bonding film 31 formed thereon, and a base material and a second bonding film 32 formed thereon, respectively. The former has a part of the first bonding film 31 transferred corresponding to an energy-imparted region of a case 2, and the latter has a part of the second bonding film 32 transferred corresponding to an energy-imparted region of a cover body 4. The bonding films 31 and 32 each includes an atomic structure including a siloxane bond, and a leaving group bonded to the siloxane bond, and the case 2 and cover body 4 are bonded together through the transferred parts to constitute a quartz oscillator 1. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种能够在控制已经转移接合膜的部件的接合区域的同时实现容易的接合的接合方法，使得能够容易地将期望形状的接合膜转移到构件表面; 并且提供一种制造密封型装置的方法，其中可以有效地制造具有高可靠性的密封型装置。解决方案：两个接合膜转移片分别具有基材和形成在其上的第一接合膜31，分别形成在基材和第二接合膜32上。前者具有与壳体2的能量赋予区域对应地转移的第一接合膜31的一部分，后者具有与盖体4的能量赋予区域对应的第二接合膜32的一部分。接合膜31和32各自包括包含硅氧烷键的原子结构和与硅氧烷键接合的离去基团，壳体2和盖体4通过转印部分结合在一起，构成石英振荡器1.
版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2011129589A Bonding method and method of manufacturing seal type device 审中-公开
标题翻译：粘合方法和制造密封型设备的方法
公开(公告)号：JP2011129589A
公开(公告)日：2011-06-30
申请号：JP2009284436
申请日：2009-12-15
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： ITO YOSHIFUMI
IPC分类号： H01L23/10 , C09J5/00 , C09J7/02
摘要： PROBLEM TO BE SOLVED: To provide a bonding method that facilitates bonding a member to which a bonding film is transferred and another member while controlling the bonding area between both members, the bonding film facilitating transfer to the surface of the member, and to provide a method of manufacturing a seal type device capable of efficiently manufacturing a high reliability seal type device.
SOLUTION: A bonding film transfer sheet 10 has a base material 20 and a bonding film formed on the base material. The bonding film transfer sheet 10 is used so that the bonding film is patterned in a predetermined shape and thereafter the patterned bonding film 3 is transferred to a case 2. The bonding film 3 contains an Si frame having an atom structure containing a siloxane bond, and a leaving group which is bonded to the Si frame. The bonding film 3 expresses adhesion properties by being provided with energy.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种在控制两个部件之间的接合面积的同时，有助于将接合膜转移的部件与另一部件接合的接合方法，便于将接合膜转移到部件的表面，以及提供一种能够有效地制造高可靠性密封型装置的密封型装置的制造方法。解决方案：接合膜转印片10具有基材20和形成在基材上的接合膜。使用接合膜转印片10，使得接合膜以预定形状图案化，然后将图案化接合膜3转移到外壳2.接合膜3包含具有含硅氧烷键的原子结构的Si框架，和与Si框结合的离去基团。接合膜3通过提供能量来表现粘合性。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2010029869A Joining method and joined body 审中-公开
标题翻译：接合方法和接合体
公开(公告)号：JP2010029869A
公开(公告)日：2010-02-12
申请号：JP2008191528
申请日：2008-07-24
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： ITO YOSHIFUMI
IPC分类号： B23K20/00 , B41J2/16 , H01L21/02
摘要： PROBLEM TO BE SOLVED: To provide a joined body which is firmly joined efficiently and at low temperature with high dimensional precision, and to provide a joining method in which the joined body is efficiently produced at low temperature. SOLUTION: The joining method includes: a stage where a first joining film 31 containing first metal atoms and leaving groups is formed on a first base material 21, so as to obtain a first joining film-fitted base material 11; a stage where a second joining film 32 containing second metal atoms having an ionization tendency higher than that of the first metal atoms and leaving groups is formed on a second base material 22, so as to obtain a second joining film-fitted base material 12; and a stage where energy is applied to the first joining film 31 and the second joining film 32, and the leaving groups are left from the joining films 31, 32, so as to allow adhesive properties to appear in the joining films 31, 32; and a stage where the first joining film-fitted base material 11 and the second joining film-fitted base material 12 are pasted in such a manner that the joining films 31, 32 are adhered, so as to obtain a joined body 5 in which the joining films 31, 32 are joined. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种以高尺寸精度有效地并且在低温下牢固地接合的接合体，并提供在低温下有效地生产接合体的接合方法。解决方案：接合方法包括：在第一基材21上形成含有第一金属原子和离去基团的第一接合膜31以获得第一接合膜装配的基材11的阶段; 在第二基材22上形成含有电离倾向高于第一金属原子和离去基团的第二金属原子的第二接合膜32的阶段，以获得第二接合薄膜配合基材12; 以及向第一接合膜31和第二接合膜32施加能量并且离开基团从接合膜31,32留下以使粘合性能出现在接合膜31,32中的阶段; 并且以使接合膜31,32粘接的方式粘贴第一接合薄膜配合基材11和第二接合薄膜配合基材12的阶段，以获得接合体5，其中接合薄膜31,32。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2009292917A Bonding method and bonded material 审中-公开
标题翻译：结合方法和粘结材料
公开(公告)号：JP2009292917A
公开(公告)日：2009-12-17
申请号：JP2008147242
申请日：2008-06-04
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： ITO YOSHIFUMI
IPC分类号： C09J5/00 , B41J2/16 , C08J7/04 , C09J5/02 , C09J5/04 , C09J5/06 , C09J183/04 , C09J183/06 , C09K3/10
摘要： PROBLEM TO BE SOLVED: To provide a bonding method for forming a bonded material obtained by bonding two members having different durability levels interposing a bonding film between the members, and enabling the reuse of the member having higher durability by separating these two members without discarding the whole bonded material at the end of the life of the member having lower durability, and to provide a bonded material formed by using the bonding method. SOLUTION: The bonding method comprises the application of a peeling energy to a bonding film 3 of a bonded material 11 obtained by bonding the first base material 21 and the second base material 22 through a bonding film 3 containing a silicone material to generate cleavage in the bonding film 3, peeling the first base material 21 having residual bonding film 3 from the second base material 22, and bonding the first base material 21 with the third base material 23 different from the second base material 22 through the bonding film 3 to obtain a second bonded material 12. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过在两个构件之间插入接合膜来粘合具有不同耐久性水平的两个构件而获得的接合材料的接合方法，并且通过分离这两个构件能够重新使用具有较高耐久性的构件而不会在耐久性较差的部件的寿命结束时丢弃整个粘结材料，并且提供通过使用接合方法形成的粘合材料。解决方案：接合方法包括通过粘合第一基材21和第二基材22通过含有硅氧烷材料的接合膜3将粘合材料11的接合膜3施加剥离能，以产生在接合膜3中分解，从第二基材22剥离具有残留接合膜3的第一基材21，并且通过接合膜3将第一基材21与不同于第二基材22的第三基材23接合以获得第二粘合材料12.版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP2009076696A Bonding method and junction 审中-公开
标题翻译：结合方法和结
公开(公告)号：JP2009076696A
公开(公告)日：2009-04-09
申请号：JP2007244518
申请日：2007-09-20
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： ITO YOSHIFUMI
IPC分类号： H01L21/02
摘要： PROBLEM TO BE SOLVED: To provide a bonding method capable of bonding two substrates partly in a partial region, strongly with a high dimensional accuracy and efficiently bonding them under a low temperature, and a junction formed by jointing these two substrates partly in the partial region by such a bonding method. SOLUTION: The bonding method has the steps of: preparing a first substrate 21 and a second substrate 22 (second adherend 42), and forming a bonding film 3 in a predetermined partial region on a bonding face of the first substrate 21 to manufacture a first adherend 41; applying an energy to the bonding film 3 to leave a leaving group from in the bonding film 3, thereby activating the bonding film 3; and attaching the first adherend 41 to the second adherend 42 so as to bond the bonding film 3 to a bonding face 24 of the second substrate 22, thereby obtaining the junction 1 formed by jointing them partly in a predetermined region. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够以部分区域强烈地以高尺寸精度粘合两个基板并且在低温下有效地将它们有效地接合的接合方法，以及通过将这两个基板部分地接合而形成的接合部该部分区域通过这种接合方法。解决方案：接合方法具有以下步骤：制备第一基板21和第二基板22（第二被粘物42），并且在第一基板21的接合面上形成预定部分区域中的接合膜3至制造第一被粘物41; 向接合膜3施加能量以在接合膜3中留下离去基团，由此激活接合膜3; 并且将第一被粘物41附接到第二被粘物42，以将接合膜3接合到第二基板22的接合面24，从而获得通过部分地将其接合在预定区域而形成的接合部1。版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2009068071A Adhesion preventing plate, vacuum processing apparatus and method for recycling adhesion preventing plate 审中-公开
标题翻译：粘合防止板，真空加工装置和回收粘合防止板的方法
公开(公告)号：JP2009068071A
公开(公告)日：2009-04-02
申请号：JP2007237638
申请日：2007-09-13
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： ITO YOSHIFUMI
IPC分类号： C23C14/00
摘要： PROBLEM TO BE SOLVED: To provide an adhesion preventing plate which suppresses generation of particles by making an adhered substance hard to be peeled and is excellent in maintainability, a vacuum processing apparatus, and a method for recycling the adhesion preventing plate.
SOLUTION: The adhesion preventing plate 130 is used in the vacuum processing apparatus 100 for forming a film by adhering particles released from a material source 120 on an object P in a chamber 104 of a vacuum atmosphere, and prevents the formation of an adhered film containing particles on the inner surface of the chamber 104. A coating film composed of an ionic liquid is formed on the surface of the adhesion preventing plate 130.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：提供一种通过使粘附物质难以剥离并且具有优异的可维护性来抑制颗粒产生的粘附防止板，真空处理装置和用于再循环防粘板的方法。解决方案：粘附防止板130用于通过将从材料源120释放的颗粒附着在真空气氛的室104中的物体P上而形成膜的真空处理设备100中，并且防止形成在室104的内表面上附着含有颗粒的膜。在防粘板130的表面上形成由离子液体构成的涂膜。（C）2009，JPO＆INPIT

8. 发明专利

JP2014042179A Method for manufacturing vibrator, vibrator, oscillator, and electronic apparatus 审中-公开
标题翻译：制造振动器，振动器，振荡器和电子装置的方法
公开(公告)号：JP2014042179A
公开(公告)日：2014-03-06
申请号：JP2012183899
申请日：2012-08-23
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： ITO YOSHIFUMI , NAMOSE ISAMU
IPC分类号： H03H3/04 , H01L41/09 , H01L41/18 , H01L41/22 , H03B5/32 , H03H9/19 , H03H9/215
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a vibrator capable of surely forming a weight part in a desired size when the vibrator is manufactured by forming the weight part for the frequency adjustment on a diaphragm by vapor deposition.SOLUTION: A method for manufacturing a vibrator is a method for manufacturing the vibrator having a diaphragm 11 and weight parts 12a, 12b and adjusted to a target frequency. The method comprises: a weight part formation step of forming the weight parts 12a, 12b on the diaphragm 11 having a frequency being higher than the target frequency by a vapor deposition device 1, and setting the vibrator so as to have a frequency being lower than the target frequency. The vapor deposition device 1 has a nozzle 2 in which a linear body 12' to be the weight parts 12a, 12b, can be inserted therein; a coil 3; means for applying voltage 4; and means for supplying gas 5. Gas G is supplied by the means for supplying gas 5, AC voltage is applied by the means for applying voltage 4, thereby plasma G' is generated in the nozzle 2 to melt the linear body 12' and spray it to the diaphragm 11. Thereby the weight parts 12a, 12b are formed.
摘要翻译：要解决的问题：提供一种制造振动器的方法，当振动器通过气相沉积在隔膜上形成用于频率调节的重量部分制造时，能够确定地形成所需尺寸的重量部分。解决方案：制造振动器是制造振动器的方法，该振动器具有振动板11和重量部分12a，12b并被调整到目标频率。该方法包括：重量部分形成步骤，通过气相沉积装置1在振动板11上形成频率高于目标频率的重量部分12a，12b，并将振动器设定为频率低于目标频率。气相沉积装置1具有喷嘴2，其中可以将作为重量部分12a，12b的直线体12'插入其中; 线圈3; 施加电压4的装置; 用于供给气体的装置5.气体G由供给气体的装置5供给，通过用于施加电压的装置施加交流电压4，从而在喷嘴2中产生等离子体G'，使直线体12'熔化并喷雾由此形成配重部12a，12b。

9. 发明专利

JP2013238747A Optical component, method for manufacturing the same, and image forming apparatus 审中-公开
标题翻译：光学元件，其制造方法和图像形成装置
公开(公告)号：JP2013238747A
公开(公告)日：2013-11-28
申请号：JP2012111892
申请日：2012-05-15
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： ITO YOSHIFUMI , MATSUO YASUHIDE
IPC分类号： G02B7/02
摘要： PROBLEM TO BE SOLVED: To provide a highly reliable optical component capable of preventing the positional displacement of a lens with respect to a fixing member and the coming off of the lens from the fixing member, and to provide a manufacturing method of the optical component, and an imaging apparatus.SOLUTION: An optical component 1 comprises: a lens 3; and a fixing member 2 having a support part 21 which is in contact with the outer circumference of the lens 3 as seen from a direction orthogonal to the optical axis 31 of the lens 3 and supports the lens 3. In at least one of the lens 3 and the support part 21, a smoothing film 4 made of a low frictional material is provided in a portion where the lens 3 and the support part 21 are in contact with each other. A plasma polymerization film 5 is provided as a base film of the smoothing film 4. The support part 21 has an inclined surface inclined with respect to a direction orthogonal to the optical axis 31 of the lens 3.
摘要翻译：要解决的问题：为了提供一种高度可靠的光学部件，能够防止透镜相对于固定部件的位置偏移和透镜从固定部件脱落，并且为了提供光学部件的制造方法，和成像装置。解决方案：光学部件1包括：透镜3; 以及固定构件2，其具有从与透镜3的光轴31正交的方向观察的与透镜3的外周接触的支撑部21，并且支撑透镜3.在至少一个透镜 3和支撑部21，在透镜3和支撑部21彼此接触的部分设置由低摩擦材料制成的平滑膜4。提供等离子体聚合膜5作为平滑膜4的基膜。支撑部21具有相对于与透镜3的光轴31正交的方向倾斜的倾斜面。

10. 发明专利

JP2013137351A Optical element 审中-公开
标题翻译：光学元件
公开(公告)号：JP2013137351A
公开(公告)日：2013-07-11
申请号：JP2011287146
申请日：2011-12-28
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： ITO YOSHIFUMI
IPC分类号： G02B5/30 , G02B1/02 , G02B5/00
摘要： PROBLEM TO BE SOLVED: To provide an optical element that is formed by bonding two optical components via a bonding film and has high light resistance, high dimensional accuracy and high light transmittance.SOLUTION: An optical element 5 includes: a first optical component 2 and a second optical component 4; and a bonding film 3 that is formed by plasma polymerization containing an Si skeleton having an atomic structure containing a siloxane (Si-O) bond and a leaving group bonded to the Si skeleton and composed of an organic group and bonds the first optical component 2 and the second optical component 4. As a result that energy is imparted to at least a partial region of the bonding film 3 and the leaving group existing at least in the vicinity of a surface of the bonding film 3 is separated from the Si skeleton, the first optical component 2 and the second optical component 4 are bonded by adhesive properties developing in the bonding film 3. A mean thickness of the bonding film 3 exceeds 300 nm and is not greater than 50 μm.
摘要翻译：要解决的问题：提供一种通过接合膜将两个光学部件接合而形成的光学元件，具有高耐光性，高尺寸精度和高透光率。解决方案：光学元件5包括：第一光学部件2和第二光学部件4; 以及通过含有具有含有硅氧烷（Si-O）键的原子结构的Si骨架和与Si骨架结合并由有机基构成并与第一光学部件2结合的离去基团的等离子体聚合而形成的接合膜3 和第二光学部件4.结果，能量被施加到接合膜3的至少一部分区域，并且至少存在于接合膜3的表面附近的离去基团与Si骨架分离，第一光学部件2和第二光学部件4通过在接合膜3中显影的粘合性而接合。接合膜3的平均厚度超过300nm且不大于50μm。

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