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1. 发明专利

JP2011122235A Mask for evaporation, and method and apparatus for manufacturing the same 审中-公开
标题翻译：用于蒸发的掩模，以及用于制造其的方法和装置
公开(公告)号：JP2011122235A
公开(公告)日：2011-06-23
申请号：JP2010174407
申请日：2010-08-03
申请人： Samsung Mobile Display Co Ltd , 三星モバイルディスプレイ株式會社Samsung Mobile Display Co., Ltd.
发明人： KIM JUN-HYEONG , CHO YOUNG-GEUN , SHIN EUI-SHIN , KIM JONG HEON , CHOI SEUNG-HO , ROH CHEOL-LAE , JO CHANG-MOG , PARK JAE-SEOK
IPC分类号： C23C14/04 , H01L51/50 , H05B33/10
CPC分类号： B23K26/402 , B23K26/032 , B23K26/066 , B23K26/0661 , B23K26/702 , B23K2203/50 , H01L51/0011
摘要： PROBLEM TO BE SOLVED: To provide a mask for evaporation free from any shadow effect by an auxiliary frame when increasing the size of the mask, and a method and an apparatus for manufacturing the same. SOLUTION: The mask for evaporation includes a first division mask 170a and a second division mask 170b. The first division mask 170a and the second division mask 170b are directly bonded to each other by welding, thereby forming a welding portion on side surfaces opposite to each other of the first and the second division masks. The division masks according to the embodiment do not use sub-frames, and are directly bonded to one another by welding, so that a shadow effect does not occur. The favorable welding quality can be ensured even in the breaking strength. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：当增加掩模的尺寸时，提供一种不伴随辅助框架的任何阴影效应的蒸发掩模，及其制造方法和装置。解决方案：用于蒸发的掩模包括第一分隔掩模170a和第二分隔掩模170b。第一分割掩模170a和第二分割掩模170b通过焊接彼此直接接合，从而在第一和第二分隔掩模的彼此相对的侧表面上形成焊接部。根据本实施例的分割掩模不使用子框架，并且通过焊接直接彼此结合，使得不发生阴影效应。即使在断裂强度下也能够保证良好的焊接质量。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2011113982A Method of manufacturing organic light-emitting display device, surface processing device for the same, and organic light-emitting display device 有权
标题翻译：制造有机发光显示装置的方法，其相关的表面处理装置和有机发光显示装置
公开(公告)号：JP2011113982A
公开(公告)日：2011-06-09
申请号：JP2010263949
申请日：2010-11-26
申请人： Samsung Mobile Display Co Ltd , 三星モバイルディスプレイ株式會社
发明人： CHOI EUN-SUN , KIM WON-YONG , NAM MYENG-WOO , PARK JIN-HAN , KIM SUNG KON , KIM JUN-HYEONG
IPC分类号： H05B33/10 , H01L51/50 , H05B33/12 , H05B33/22
CPC分类号： H01L51/0012 , H01L21/268 , H01L27/3283 , H01L51/0004
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing an organic light-emitting display device capable of easily forming an organic light-emitting layer, a surface processing device for an organic light-emitting display device, and the organic light-emitting display device.
SOLUTION: The method of manufacturing an organic light-emitting display device includes a process of forming a first electrode on a substrate, a process of forming a pixel-defining film with an opening so as to expose a designated portion of the first electrode on the first electrode, a process of forming an electric charge transmission layer on the exposed first electrode through the pixel-defining film and the opening, a process of making a surface not corresponding to the opening out of the exposed surface of the electric charge transmission layer hydrophobic by selectively making use of laser light, a process of forming the organic light-emitting layer on the electric charge transmission layer, and a process of forming a second electrode so as to be electrically connected with the organic light-emitting layer.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：为了提供一种能够容易地形成有机发光层的有机发光显示装置的制造方法，有机发光显示装置的表面处理装置和有机发光显示装置，发射显示装置。解决方案：制造有机发光显示装置的方法包括在基板上形成第一电极的工艺，形成具有开口的像素限定膜的工艺，以暴露第一电极的指定部分第一电极上的电极，通过像素限定膜和开口在暴露的第一电极上形成电荷传输层的过程，使与电荷的暴露表面不相对应的表面的工艺通过选择性地利用激光进行疏水化的透射层，在电荷传输层上形成有机发光层的工序，以及形成与有机发光层电连接的第二电极的工序。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2010250315A Sealing device 有权
标题翻译：密封装置
公开(公告)号：JP2010250315A
公开(公告)日：2010-11-04
申请号：JP2010075369
申请日：2010-03-29
申请人： Samsung Mobile Display Co Ltd , 三星モバイルディスプレイ株式會社
发明人： PARK JIN-HAN , KIM HYUNG SIK , KIM JUN-HYEONG , MYOUNG SEUNG-HO , KIN SHODAI , CHOI JIN-BAEK
IPC分类号： G09F9/00 , B32B37/00 , G02F1/1339 , G09F9/30
CPC分类号： H01J9/261 , B23K26/206 , H01L51/5237 , H01L51/5246 , H01L51/56 , H01L2251/566
摘要： PROBLEM TO BE SOLVED: To provide a sealing device capable of suppressing stress to be generated to the minimum extent and suppressing the occurrence of defective crack on a cutting face to the minimum extent when joining a first substrate and a second substrate mutually; and to provide a method for manufacturing a flat plate display device using this sealing device. SOLUTION: The sealing device 100 for joining the first substrate 101 and the second substrate 102 mutually by utilizing a joint member 103 includes a stage 110 for loading the first substrate 101 on it, a halogen lamp 121 for applying light on the joint member 103 arranged between the first substrate 101 and the second substrate 102, and a reflection device 122 for reflecting the light emitted from the halogen lamp 121 toward the joint member 103. The flat plate display device using this sealing device is manufactured by this manufacturing method. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种密封装置，其能够在最小程度上抑制产生的应力，并且在相互接合第一基板和第二基板时最小程度地抑制切割面上的有缺陷的裂纹的发生; 并提供一种使用该密封装置制造平板显示装置的方法。解决方案：用于通过使用接头构件103相互连接第一基板101和第二基板102的密封装置100包括用于将第一基板101装载在其上的台架110，用于在接头上施加光的卤素灯121 布置在第一基板101和第二基板102之间的部件103以及用于将从卤素灯121发射的光朝向接合部件103反射的反射装置122.使用该密封装置的平板显示装置通过该制造方法。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2011051014A Substrate cutting apparatus and method for cutting substrate 有权
标题翻译：基板切割装置和切割基板的方法
公开(公告)号：JP2011051014A
公开(公告)日：2011-03-17
申请号：JP2010128786
申请日：2010-06-04
申请人： Samsung Mobile Display Co Ltd , 三星モバイルディスプレイ株式會社
发明人： LEE HYUU-CHUL , LIM WON-KYU , KIM JUN-HYEONG , PARK JAE-SEOK , ROH CHEOL-LAE
IPC分类号： B23K26/38 , B23K26/00 , B23K26/08 , B23K26/40 , C03B33/037 , C03B33/04 , C03B33/09
CPC分类号： B23K26/082 , B23K26/06 , B23K26/0604 , B23K26/0624 , B23K26/0738 , B23K26/0853 , B23K26/142 , B23K26/144 , B23K26/40 , B23K26/60 , C03B33/04 , C03B33/091 , C03B33/093
摘要： PROBLEM TO BE SOLVED: To provide a substrate cutting apparatus and method by which a substrate can be effectively and stably cut. SOLUTION: The substrate cutting apparatus 101 includes: a stage 20 configured to support a substrate 10; a laser generator 30 configured to emit a short-pulse laser beam SLB toward the substrate; and a beam swing unit 50 disposed on a beam path of the short-pulse laser beam and configured to swing the short-pulse laser beam in a predetermined light irradiating section LBD on the substrate. The light irradiating section includes at least one of a curved line section and a straight line section. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种可以有效且稳定地切割基板的基板切割装置和方法。解决方案：基板切割装置101包括：构造成支撑基板10的台架20; 激光发生器30，被配置为朝向所述基板发射短脉冲激光束SLB; 以及设置在短脉冲激光束的光束路径上并被配置为使短脉冲激光束在基板上的预定光照射部分LBD中摆动的光束摆动单元50。光照射部分包括曲线部分和直线部分中的至少一个。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2010229023A Substrate cutting apparatus and method of cutting substrate using the same 有权
标题翻译：基板切割装置和使用该基板切割基板的方法
公开(公告)号：JP2010229023A
公开(公告)日：2010-10-14
申请号：JP2010068321
申请日：2010-03-24
申请人： Samsung Mobile Display Co Ltd , 三星モバイルディスプレイ株式會社
发明人： LEE HYUU-CHUL , ROH CHEOL-LAE , HAN GYOO-WAN , MYOUNG SEUNG-HO , KIM JONG-HEON , KIM JUN-HYEONG , KIM SUNG-GON , LEE YUNG-JIN
IPC分类号： C03B33/09 , B23K26/08 , B23K26/38 , B23K26/40 , B28D5/00
CPC分类号： C03B33/091 , H01L51/56 , H01L2251/566 , H05K3/0029 , H05K3/0052 , H05K2203/1121
摘要： PROBLEM TO BE SOLVED: To provide a substrate cutting apparatus effectively and stably cutting even a thin glass substrate, and to provide a method of cutting a substrate by using the substrate cutting apparatus.
SOLUTION: The substrate cutting apparatus includes: a stage unit to support a substrate to be cut along a virtual cutting line; a laser generating unit to emit a laser beam to heat a part of the substrate along the cutting line; a light-swinging unit, which is disposed on the optical path of the laser beam, to swing the inclination angle of the laser beam toward the cutting line; and a cooling unit to cool the substrate heated by the laser beam.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种基板切割装置，有效且稳定地切割薄玻璃基板，并提供使用基板切割装置切割基板的方法。解决方案：基板切割装置包括：台架单元，用于支撑沿虚拟切割线切割的基板; 激光发生单元，其发射激光束以沿着切割线加热所述基板的一部分; 设置在激光束的光路上的摆动单元，使激光束朝向切割线的倾斜角度摆动; 以及用于冷却由激光束加热的基板的冷却单元。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2010037194A Method for producing flat display device 有权
标题翻译：生产平板显示装置的方法
公开(公告)号：JP2010037194A
公开(公告)日：2010-02-18
申请号：JP2009183461
申请日：2009-08-06
申请人： Samsung Mobile Display Co Ltd , 三星モバイルディスプレイ株式會社
发明人： KIM HYOUNG-SHICK , PARK JIN-HAN , KIM JUN-HYEONG , LEE HYUN-CHUL , KIM SUNG KON , KANG TAE-WOOK , KIM JONG-DAE , HAN GYOO-WAN , ROH CHEOL-LAE
IPC分类号： C03B33/07 , C03B33/09 , G09F9/00 , H01L51/50 , H05B33/10
CPC分类号： H01L51/56 , C03C8/24 , C03C27/06 , C03C2218/34 , H01L51/5246 , H01L2251/566
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a flat display device. SOLUTION: The method minimizes the stress deviation applied to mother glass when a glass sealing material is melted by a laser to join the mother glass. The method comprises the steps of: forming a plurality of light-emitting parts between first and second substrates arranged opposite to each other, wherein a unit display element is formed for each light-emitting part; forming a plurality of walls between the first and second substrates, wherein each wall is arranged so as to surround each light-emitting part; irradiating the walls with laser beams, wherein a plurality of walls arranged in a first direction is simultaneously irradiated with laser beams; scanning the laser beams in a second direction that is different from the first direction; and cutting the first and second substrates into each unit display element. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造平面显示装置的方法。解决方案：当玻璃密封材料通过激光熔化以接合母玻璃时，该方法最小化施加到母玻璃上的应力偏差。该方法包括以下步骤：在彼此相对布置的第一和第二基板之间形成多个发光部分，其中为每个发光部分形成单位显示元件; 在所述第一和第二基板之间形成多个壁，其中每个壁布置成围绕每个发光部分; 用激光照射壁，其中以激光束同时照射沿第一方向布置的多个壁; 沿与第一方向不同的第二方向扫描激光束; 以及将所述第一和第二基板切割成每个单位显示元件。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2010229024A Method of cutting substrate 审中-公开
标题翻译：切割基板的方法
公开(公告)号：JP2010229024A
公开(公告)日：2010-10-14
申请号：JP2010068330
申请日：2010-03-24
申请人： Samsung Mobile Display Co Ltd , 三星モバイルディスプレイ株式會社
发明人： LEE HYUU-CHUL , PARK JIN-HAN , KIM JUN-HYEONG , LIM WON-KYU , PARK JAE-SEOK , ROH CHEOL-LAE , LEE YUNG-JIN
IPC分类号： C03B33/09 , B23K26/00 , B23K26/08 , B28D5/00 , C03B33/07 , G02F1/13 , G02F1/1333
CPC分类号： C03B33/082 , B23K26/082 , B23K26/40 , B23K2203/50 , C03B33/033 , C03B33/076 , G02F1/133351 , H01L51/56 , H01L2251/566 , Y10T225/12 , Y10T225/321
摘要： PROBLEM TO BE SOLVED: To provide a method of cutting a substrate by which a bonded panel including a plurality of substrates bonded to each other can be effectively and stably cut. SOLUTION: The method of cutting a substrate includes steps of aligning a bonded panel including two or more substrates bonded to each other along a virtual cutting line; forming groove lines in the respective substrates of the bonded panel along the virtual cutting line, by using UV-light laser beams which are subjected to beam swinging to swing inclination angles with respect to the panel; and cutting the bonded panel along the groove lines by applying force to the panel. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种切割基板的方法，通过该方法可以有效且稳定地切割包括彼此接合的多个基板的接合面板。解决方案：切割基板的方法包括以下步骤：沿着虚拟切割线对准包括两个或更多个彼此粘合的基板的接合面板; 通过使用经过光束摆动的紫外光激光束相对于面板摆动倾斜角度，沿着虚拟切割线在接合面板的各个基板中形成凹槽线; 以及通过向所述面板施加力沿着所述凹槽线切割所述接合面板。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2010228005A Substrate cutting apparatus and method of cutting substrate using the same 有权
标题翻译：基板切割装置和使用该基板切割基板的方法
公开(公告)号：JP2010228005A
公开(公告)日：2010-10-14
申请号：JP2010068338
申请日：2010-03-24
申请人： Samsung Mobile Display Co Ltd , 三星モバイルディスプレイ株式會社
发明人： LEE HYUU-CHUL , HAN GYOO-WAN , KIN SHODAI , PARK JIN-HAN , KIM JUN-HYEONG , KIM HYUNG SIK , CHOI IN-SU , LEE YUNG-JIN
IPC分类号： B23K26/38 , B23K26/00 , B23K26/08 , B23K26/36 , C03B33/09
CPC分类号： C03B33/102 , B23K26/40 , B23K2203/50 , C03B33/0222
摘要： PROBLEM TO BE SOLVED: To provide a substrate cutting apparatus which can effectively and stably cut even a relatively thin glass substrate, and to provide a method of cutting a substrate using the same. SOLUTION: The substrate cutting apparatus 101 includes a stage 20 configured to support a substrate 10 to be cut along a virtual cutting line CL, a laser generator 30 configured to emit an ultraviolet (UV)-based laser beam for cutting the substrate by removing part of the substrate along the cutting line, and a beam oscillator 50 disposed on a beam path of the laser beam and configured to perform a beam swing on the laser beam in a direction parallel to the length direction of the cutting line by oscillating a tilt angle of the laser beam toward the cutting line. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够有效且稳定地切割相对薄的玻璃基板的基板切割装置，并提供使用该基板切割装置的基板的切割方法。解决方案：基板切割装置101包括：台架20，被配置为沿着虚拟切割线CL支撑待切割的基板10;激光发生器30，被配置为发射用于切割基板的基于紫外线（UV）的激光束通过沿着切割线去除部分基板;以及光束振荡器50，其设置在激光束的光束路径上，并且被配置为通过振荡在与激光束的平行于切割线的长度方向的方向上在激光束上进行光束摆动激光束朝向切割线的倾斜角度。版权所有（C）2011，JPO＆INPIT

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