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    • 1. 发明专利
    • Semiconductor light emitting element and method of manufacturing the same
    • 半导体发光元件及其制造方法
    • JP2012244183A
    • 2012-12-10
    • JP2012117811
    • 2012-05-23
    • Samsung Electronics Co Ltd三星電子株式会社Samsung Electronics Co.,Ltd.
    • KIM TE-HOONCHE SEUN-WANKIM YONG-ILLEE SEUN-JAEJANG TAE SUNGSONG JONG-LAKKIM BO-KYOUN
    • H01L33/10H01L33/22
    • H01L33/46H01L33/20H01L2224/32225H01L2224/48091H01L2224/48227H01L2224/49107H01L2224/73265H01L2224/83385H01L2924/00014H01L2924/00
    • PROBLEM TO BE SOLVED: To provide a semiconductor light emitting element and method of manufacturing the semiconductor light emitting element.SOLUTION: An aspect of the present invention is to provide a semiconductor light emitting element including: a translucent substrate having first and second main surfaces facing each other, the second main surface having an irregularity formed thereon; a light emitting part arranged on the first main surface side, and including first and second conductivity type semiconductor layers and an active layer formed therebetween; first and second electrodes electrically connected to the first and second conductivity type semiconductor layers, respectively; and a back face reflection part including a reflective metal layer arranged on the second main surface side, and a translucent dielectric layer arranged between the translucent substrate and the reflective metal layer. According to an embodiment of the present invention, a semiconductor light emitting element including a reflector structure excellent in light reflection performance, heat dissipation performance or the like on a back face side of a growth substrate can be obtained.
    • 解决的问题:提供一种半导体发光元件及其制造半导体发光元件的方法。 解决方案:本发明的一个方面是提供一种半导体发光元件,其包括:透光性基板,其具有彼此面对的第一主表面和第二主表面,所述第二主表面形成有凹凸; 布置在第一主表面侧上的发光部分,并且包括第一和第二导电类型半导体层以及在它们之间形成的有源层; 分别与第一和第二导电类型半导体层电连接的第一和第二电极; 以及背面反射部,其包括布置在第二主表面侧上的反射金属层,以及布置在透光性基板和反射金属层之间的透光性介电层。 根据本发明的实施例,可以获得包括在生长衬底的背面侧的光反射性能,散热性能等优异的反射器结构的半导体发光元件。 版权所有(C)2013,JPO&INPIT