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1. 发明专利

JP2010075911A Double surface treatment method of substrate and surface-treated substrate by the method 有权
标题翻译：基板和表面处理基板的双面表面处理方法
公开(公告)号：JP2010075911A
公开(公告)日：2010-04-08
申请号：JP2009136471
申请日：2009-06-05
申请人： Samsung Electro-Mechanics Co Ltd , 三星電機株式会社
发明人： SONG YOUNG-AH , SERGEY REMIZOV , JUNG HYUN-CHUL
IPC分类号： B05D7/00 , H05K3/10 , H05K3/12
摘要： PROBLEM TO BE SOLVED: To provide a double surface treatment method of a substrate increasing adhesive strength between metal ink and the substrate and forming a micro-wiring pattern of high density by reducing spread of ink, and to provide a surface-treated substrate by the method.
SOLUTION: The double surface treatment method of the substrate includes processes of: preparing the substrate; coating the substrate with an adhesive layer by applying an adhesive; coating the substrate, coated with the adhesive layer, with a water-repellent layer; printing conductive ink on the substrate coated with the adhesive layer and water-repellent layer; and sintering the printed conductive ink and curing the adhesive layer.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种提高金属油墨和基材之间的粘合强度的基材的双重表面处理方法，并通过减少油墨的扩散形成高密度的微布线图案，并提供表面处理底物的方法。解决方案：基板的双面处理方法包括以下工序：准备基板; 通过施加粘合剂用粘合剂层涂覆基材; 用拒水层涂覆涂覆有粘合剂层的基材; 在涂覆有粘合剂层和防水层的基材上印刷导电油墨; 并烧结印刷的导电油墨并固化粘合剂层。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2010183059A Hybrid supercapacitor 有权
标题翻译：混合超级
公开(公告)号：JP2010183059A
公开(公告)日：2010-08-19
申请号：JP2009208445
申请日：2009-09-09
申请人： Samsung Electro-Mechanics Co Ltd , 三星電機株式会社
发明人： KIM HAK-KWAN , RA SEUNG HYUN , BAE JUN-HEE , JUNG HYUN-CHUL
IPC分类号： H01G11/22 , H01G11/02 , H01G11/04 , H01G11/24 , H01G11/30 , H01G11/34 , H01G11/42 , H01G11/46
CPC分类号： H01G11/32 , H01G11/46 , Y02E60/13 , Y10T29/417
摘要： PROBLEM TO BE SOLVED: To provide a hybrid supercapacitor capable of minimizing electrode internal resistance and ESR by using an integrated type electrode including neither a current collector nor a binder while maintaining advantages of increases in energy and output density by an increase in total cell potential that a hybrid type supercapapcitor has. SOLUTION: The hybrid supercapacitor includes a carbon aerogel anode and a surface-oxidized transition metal nitride aerogel cathode. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种混合超级电容器，其能够通过使用不包括集电器或粘合剂的集成型电极来最小化电极内部电阻和ESR，同时保持能量和输出密度增加的优点，总共增加混合型超级电容器具有的电池电位。解决方案：混合超级电容器包括碳气凝胶阳极和表面氧化的过渡金属氮化物气凝胶阴极。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2010074139A Surface processing method of printed circuit board resin and printed circuit board resin 审中-公开
标题翻译：印刷电路板树脂和印刷电路板树脂的表面处理方法
公开(公告)号：JP2010074139A
公开(公告)日：2010-04-02
申请号：JP2009128406
申请日：2009-05-28
申请人： Samsung Electro-Mechanics Co Ltd , 三星電機株式会社
发明人： SONG YOUNG-AH , TEI ZAIYU , JUNG HYUN-CHUL , KIM IN-YOUNG
IPC分类号： H05K3/38 , H05K3/10
CPC分类号： H05K3/38 , H05K3/1208 , H05K3/1241 , H05K3/381 , H05K2201/2072 , H05K2203/1173 , H05K2203/308 , Y10T428/24612
摘要： PROBLEM TO BE SOLVED: To provide a surface processing method of printed circuit board for forming a fine circuit pattern and enhancing adhesive force between a circuit pattern and printed circuit board resin, and provide printed circuit board resin processed by this method. SOLUTION: The surface processing method of printed circuit board resin includes: a process of providing printed circuit board resin; a process of forming a concave and a convex part on the surface by roughening the surface of the printed circuit board resin; a process of filling a filling agent in the concave part; a process of forming a coated layer by coating with a repellent material the surface of the printed circuit board resin where the concave part is filled with the filling agent; and a process of removing layer the filling agent filled in the concave part and the coated layer corresponding to the filling agent filled in the concave part. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种印刷电路板的表面处理方法，用于形成精细电路图案并增强电路图案和印刷电路板树脂之间的粘合力，并提供通过该方法处理的印刷电路板树脂。解决方案：印刷电路板树脂的表面处理方法包括：提供印刷电路板树脂的工艺; 通过使印刷电路板树脂的表面粗糙化，在表面上形成凹部和凸部的工序; 将填充剂填充到凹部中的工序; 通过用驱避剂涂覆印刷电路板树脂的表面，其中凹部填充有填充剂，形成涂层的工艺; 以及将填充在凹部中的填充剂和与填充在凹部中的填充剂相对应的涂层去除层的工序。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2010206171A Supercapacitor using ion-exchanger 审中-公开
标题翻译：超级电容器使用离子交换器
公开(公告)号：JP2010206171A
公开(公告)日：2010-09-16
申请号：JP2009291075
申请日：2009-12-22
申请人： Samsung Electro-Mechanics Co Ltd , 三星電機株式会社
发明人： BAE JUN-HEE , RA SEUNG HYUN , KIM HAK-KWAN , JUNG HYUN-CHUL
IPC分类号： H01G11/22 , H01G11/06 , H01G11/42
CPC分类号： H01G9/058 , H01G9/016 , H01G9/038 , H01G9/155 , H01G11/38 , H01G11/86 , Y02E60/13
摘要： PROBLEM TO BE SOLVED: To provide a supercapacitor electrode capable of maximizing the surface area of an active material while eliminating interruption of ion transfer caused by a binder by selectively transferring ions moving through the active material, and improving the electric capacity of a supercapacitor, and the supercapacitor having the electrode.
SOLUTION: The supercapacitor electrode is characterized in employing an ion-exchanger instead of a binder used for an ordinary supercapacitor.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够使活性物质的表面积最大化的超级电容器电极，同时通过选择性地转移通过活性物质移动的离子而消除由粘合剂引起的离子转移的中断，并且提高电容超级电容器和具有电极的超级电容器。解决方案：超级电容器电极的特征在于使用离子交换器代替用于普通超级电容器的粘合剂。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2010183063A Hybrid supercapacitor 有权
标题翻译：混合超级
公开(公告)号：JP2010183063A
公开(公告)日：2010-08-19
申请号：JP2009282839
申请日：2009-12-14
申请人： Samsung Electro-Mechanics Co Ltd , 三星電機株式会社
发明人： KIM HAK-KWAN , RA SEUNG HYUN , BAE JUN-HEE , JUNG HYUN-CHUL
IPC分类号： H01G11/02 , H01G11/04 , H01G11/22 , H01G11/24 , H01G11/30 , H01G11/32 , H01G11/34 , H01G11/46 , H01G11/52 , H01G11/56 , H01G11/58
CPC分类号： H01G9/058 , H01G9/155 , H01G11/46 , Y02E60/13 , Y10T29/417
摘要： PROBLEM TO BE SOLVED: To provide a hybrid supercapacitor capable of minimizing electrode internal resistance and ESR by using an integrated type electrode including neither a current collector nor a binder while maintaining advantages of increases in energy and output density by an increase in total cell potential that a hybrid type supercapacitor has. SOLUTION: The hybrid supercapacitor includes a carbon aerogel anode and a transition metal nitride aerogel cathode. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种混合超级电容器，其能够通过使用不包括集电器或粘合剂的集成型电极来最小化电极内部电阻和ESR，同时保持能量和输出密度增加的优点，总共增加混合型超级电容器具有的电池电位。解决方案：混合超级电容器包括碳气凝胶阳极和过渡金属氮化物气凝胶阴极。版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP2011014864A Chip-type electric double layer capacitor and method of manufacturing the same 有权
标题翻译：芯片型双电层电容器及其制造方法
公开(公告)号：JP2011014864A
公开(公告)日：2011-01-20
申请号：JP2010002220
申请日：2010-01-07
申请人： Samsung Electro-Mechanics Co Ltd , サムソンエレクトロ−メカニックスカンパニーリミテッド.
发明人： LEE SANG-KYUN , JUNG CHANG-RYUL , LEE SUNG HO , PARK DONG SUP , CHO YEONG SU , JUNG HYUN-CHUL
IPC分类号： H01G2/10 , H01G4/224 , H01G4/252 , H01G9/08 , H01G11/00 , H01G11/74 , H01G11/78 , H01G11/82 , H01G11/84
CPC分类号： H01G9/155 , H01G9/016 , H01G9/10 , H01G11/74 , H01G11/80 , H01G11/82 , H01G11/84 , Y02E60/13 , Y02T10/7022 , Y10T29/417
摘要： PROBLEM TO BE SOLVED: To provide a chip-type electric double layer capacitor.SOLUTION: The chip-type electric double layer capacitor includes: an exterior case including a housing space formed therein and formed of an insulation resin; first and second external terminals buried in the exterior case and including a first surface exposed to the housing space and a second surface exposed to the outside of the exterior case, respectively; and an electric double layer capacitor cell disposed in the housing space so as to be electrically connected to first surfaces of the first and second external terminals. Since the chip-type electric double layer capacitor is integrated with the exterior case and the external terminal, space efficiency is increased. Miniaturization, light-weight and large-capacity of the electric double layer capacitor become possible. Moreover, the chip-type electric double layer capacitor can be surface-mounted by the capacitor itself without adding a structure.
摘要翻译：要解决的问题：提供一种片式双电层电容器。解决方案：芯片型双电层电容器包括：外壳，其包括形成在其中并由绝缘树脂形成的容纳空间; 第一外部端子和第二外部端子被埋在外部壳体中并且包括暴露于壳体空间的第一表面和暴露于外部壳体的外部的第二表面; 以及设置在所述容纳空间中以与所述第一和第二外部端子的第一表面电连接的双电层电容器单元。由于芯片式双电层电容器与外壳和外部端子集成，因此空间效率提高。双电层电容器的小型化，轻量化和大容量成为可能。此外，芯片式双电层电容器可以通过电容器本身进行表面安装，而不增加结构。

7. 发明专利

JP2007027689A Method for forming fine wiring, and conductive substrate 有权
标题翻译：形成精细接线和导电衬底的方法
公开(公告)号：JP2007027689A
公开(公告)日：2007-02-01
申请号：JP2006147202
申请日：2006-05-26
申请人： Samsung Electro-Mechanics Co Ltd , サムソンエレクトロ−メカニックスカンパニーリミテッド.
发明人： KO YOUNG-GUN , JUNG HYUN-CHUL , PARK JAE-CHAN , SEO SHANG-HOON , JANG MYUNG-JOON , BAIK YOON-AH
IPC分类号： H05K3/10
CPC分类号： H05K3/1208 , H05K3/1241 , H05K2203/0793 , H05K2203/1173
摘要： PROBLEM TO BE SOLVED: To provide a method for economically and simply forming fine wiring.
SOLUTION: A method is provided for economically and simply forming fine wiring by alleviating the spread of ink, and for forming the wiring with excellent electric conductivity by having even height of the formed ink. Further, a conductive board is provided with excellent high-dense electric conductivity including fine wiring. This method for forming the fine wiring comprises a step of (a) treating at least one side of a wiring pattern to be formed on a base substrate with alkali metal hydroxide solution, and (b) treating hydrophobic ink in accordance to the wiring pattern to be formed.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于经济地和简单地形成精细布线的方法。解决方案：提供了一种通过减少油墨扩散来经济地简单地形成精细布线的方法，并且通过具有均匀的形成的油墨的高度来形成具有优异导电性的布线。此外，导电板具有优异的高密度导电性，包括精细布线。用于形成精细布线的方法包括以下步骤：（a）用碱金属氢氧化物溶液处理待形成在基底上的布线图案的至少一面，和（b）根据布线图案处理疏水性墨水形成。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2010067947A Printed circuit board and method for manufacturing the same 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：JP2010067947A
公开(公告)日：2010-03-25
申请号：JP2009114950
申请日：2009-05-11
申请人： Samsung Electro-Mechanics Co Ltd , サムソンエレクトロ−メカニックスカンパニーリミテッド.
发明人： REMIZOV SERGEY , JOUNG JAE-WOO , JUNG HYUN-CHUL , SONG YOUNG-AH
IPC分类号： H05K3/10 , H05K3/22 , H05K3/38
CPC分类号： H05K3/107 , H05K3/125 , H05K3/386 , H05K2201/0129 , H05K2203/013 , H05K2203/0278 , H05K2203/1131
摘要： PROBLEM TO BE SOLVED: To provide a printed circuit board and a method for manufacturing the same, in which a fine circuit pattern is formed by an inkjet method and the adhesive strength between the circuit pattern and a base substrate is improved.
SOLUTION: The method for manufacturing the printed circuit board includes: a process of providing a base substrate in which a thermoplastic resin layer is formed; a process of forming a circuit pattern on the thermoplastic resin layer by discharging conductive ink by an inkjet method; a process of drying the circuit pattern through heating at a temperature that is lower than a melting point of the thermoplastic resin layer; a process of heating and sintering the circuit pattern; and a process of burying at least a part of the circuit pattern in the thermoplastic resin layer by heating the thermoplastic resin layer and compressing the circuit pattern toward the thermoplastic resin layer.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：提供一种印刷电路板及其制造方法，其中通过喷墨法形成精细电路图案，并提高了电路图案和基底基板之间的粘合强度。解决方案：印刷电路板的制造方法包括：提供形成有热塑性树脂层的基底的工序; 通过喷墨法排出导电油墨而在热塑性树脂层上形成电路图案的工序; 通过在低于热塑性树脂层的熔点的温度下加热干燥电路图案的工序; 加热和烧结电路图案的过程; 以及通过加热热塑性树脂层并将电路图案压向热塑性树脂层而将热塑性树脂层中的电路图案的至少一部分埋入的工艺。版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2010067946A Method of manufacturing printed circuit board 审中-公开
标题翻译：制造印刷电路板的方法
公开(公告)号：JP2010067946A
公开(公告)日：2010-03-25
申请号：JP2009112212
申请日：2009-05-01
申请人： Samsung Electro-Mechanics Co Ltd , サムソンエレクトロ−メカニックスカンパニーリミテッド.
发明人： REMIZOV SERGEY , JOUNG JAE-WOO , JUNG HYUN-CHUL , SONG YOUNG-AH
IPC分类号： H05K3/10 , H05K3/12 , H05K3/20
CPC分类号： H05K3/207 , H05K3/125 , H05K3/383 , H05K3/385 , H05K3/389 , H05K2201/015 , H05K2203/013 , H05K2203/095 , H05K2203/1173 , Y10T29/49155
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed circuit board that can form a minute and precise circuit pattern through inkjet printing and improve adhesion between the circuit pattern and an insulation layer. SOLUTION: The method of manufacturing a printed circuit board includes: a process of forming a circuit pattern by discharging conductive ink on a carrier through inkjet printing; a process of heating and sintering the circuit pattern; and a process of transferring the circuit pattern by stacking the carrier on an insulation layer such that the circuit pattern is buried in the insulation layer. COPYRIGHT: (C)2010,JPO&INPIT

10. 发明专利

JP2006287217A Substrate surface treatment method, wiring forming method, wiring forming apparatus, and wiring board 有权
标题翻译：基板表面处理方法，接线方法，接线形成装置和接线板
公开(公告)号：JP2006287217A
公开(公告)日：2006-10-19
申请号：JP2006066742
申请日：2006-03-10
申请人： Samsung Electro-Mechanics Co Ltd , サムソンエレクトロ−メカニックスカンパニーリミテッド.
发明人： BAIK YOON-AH , JUNG HYUN-CHUL
IPC分类号： H05K3/10 , H01L21/28 , H01L21/288 , H01L21/3205 , H05K3/38
CPC分类号： H05K3/125 , H05K3/1208 , H05K3/381 , H05K2203/013 , H05K2203/0793 , H05K2203/1157 , Y10T29/49124
摘要： PROBLEM TO BE SOLVED: To provide a substrate surface treatment method, a wiring forming method, and a wiring forming apparatus which can form fine circuit wiring simply, quickly, and economically and a wiring board. SOLUTION: A method of forming wiring on a substrate of the present invention comprises: a substrate surface treatment step of selectively discharging a surface treatment solution including an alkali metal compound according to the wiring pattern on a base film by a discharging method; a conductive ink discharging step of discharging a conductive ink including metal nanoparticles according to the surface-treated wiring pattern; and a baking step of baking the base film, on which the conductive ink was discharged, in a reduction atmosphere. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种简单，快速且经济地形成精细电路布线的布线基板表面处理方法，布线形成方法和布线形成装置。解决方案：在本发明的基板上形成布线的方法包括：基板表面处理步骤，通过放电方法将基于布线图案的包含碱金属化合物的表面处理溶液选择性地排放到基膜上; 导电油墨排出步骤，根据表面处理的布线图案排出包含金属纳米颗粒的导电油墨; 以及在还原气氛中烘烤导电油墨排出的基膜的烘烤步骤。版权所有（C）2007，JPO＆INPIT

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