专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2013048231A Laminated ceramic electronic component and manufacturing method therefor 审中-公开
标题翻译：层压陶瓷电子元件及其制造方法
公开(公告)号：JP2013048231A
公开(公告)日：2013-03-07
申请号：JP2012166685
申请日：2012-07-27
申请人： Samsung Electro-Mechanics Co Ltd , サムソンエレクトロ−メカニックスカンパニーリミテッド.
发明人： PARK MYUN-CHON , KWON SANG HOON , PARK JAE YOUNG , LEE KYU HA , JEON BYUNG JUN , CHE DA-YONG , GU HYUN-HEE , KIM CHANG HOON
IPC分类号： H01G4/232 , H01G4/12 , H01G4/228 , H01G4/252 , H01G4/30
CPC分类号： H01G4/228 , H01G4/005 , H01G4/12 , H01G4/30
摘要： PROBLEM TO BE SOLVED: To provide a laminated ceramic electronic component which improves sealing performance of chips and is superior in reliability.SOLUTION: The laminated ceramic electronic component includes: a ceramic main body 10 including a dielectric layer 1; first and second internal electrodes 21 and 22 oppositely arranged in the ceramic main body 10 through the dielectric layer 1; a first external electrode 31 which is electrically connected to the first internal electrode 21; and a second external electrode 32 which is electrically connected to the second internal electrode 22. The first and second external electrodes 31 and 32 contain conductive metal and glass. When at least one of the first and second external electrodes 31 and 32 is divided into three equal portions in a thickness direction, the glass occupies 35 to 80% by area with respect to the area of a center part region.
摘要翻译：要解决的问题：提供一种提高芯片的密封性能并且可靠性优异的层叠陶瓷电子部件。层叠陶瓷电子部件包括：陶瓷主体10，其包括电介质层1; 第一和第二内部电极21和22通过电介质层1相对布置在陶瓷主体10中; 电连接到第一内部电极21的第一外部电极31; 以及与第二内部电极22电连接的第二外部电极32.第一外部电极31和第二外部电极32包含导电金属和玻璃。当第一外部电极31和第二外部电极32中的至少一个在厚度方向上被分成三等份时，玻璃相对于中心部分区域的面积占面积的35至80％。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2013106035A Multilayer ceramic electronic component 有权
标题翻译：多层陶瓷电子元件
公开(公告)号：JP2013106035A
公开(公告)日：2013-05-30
申请号：JP2012164492
申请日：2012-07-25
申请人： Samsung Electro-Mechanics Co Ltd , サムソンエレクトロ−メカニックスカンパニーリミテッド.
发明人： PARK MYUN-CHON , KWON SANG HOON , KIM CHANG HOON , GU HYUN-HEE , PARK JAE YOUNG , CHE DA-YONG , LEE KYU HA , JEON BYUNG JUN
IPC分类号： H01G4/232 , H01G4/30
CPC分类号： H01B3/12 , H01G4/12 , H01G4/2325 , H01G4/30 , Y10T29/417
摘要： PROBLEM TO BE SOLVED: To provide a multilayer ceramic electronic component and a method of manufacturing the same.SOLUTION: There are provided a multilayer ceramic electronic component and a method of manufacturing the same. The multilayer ceramic electronic component includes: a ceramic body including a dielectric layer; first and second internal electrodes disposed within the ceramic body to face each other across the dielectric layer; and first external electrodes electrically connected to the first and second internal electrodes and second external electrodes formed on the first external electrodes. The first and second external electrodes include a conductive metal and a glass and, when the second external electrodes are divided into three equal parts in the thickness direction, the area of the glass is 30 to 80% of the area of the central parts. According to this invention, sealing properties of a chip is improved, and thereby a multilayer ceramic electronic component with improved reliability may be implemented.
摘要翻译：解决的问题：提供一种多层陶瓷电子部件及其制造方法。解决方案：提供了一种多层陶瓷电子部件及其制造方法。多层陶瓷电子部件包括：陶瓷体，其包括电介质层; 布置在陶瓷体内的第一和第二内部电极跨过电介质层彼此面对; 以及与第一和第二内部电极电连接的第一外部电极和形成在第一外部电极上的第二外部电极。第一和第二外部电极包括导电金属和玻璃，并且当第二外部电极在厚度方向上被分成三个相等的部分时，玻璃的面积为中心部分面积的30-80％。根据本发明，提高了芯片的密封性能，可以实现可靠性提高的多层陶瓷电子部件。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2014011450A Multilayer ceramic electronic component and manufacturing method therefor 审中-公开
标题翻译：多层陶瓷电子元件及其制造方法
公开(公告)号：JP2014011450A
公开(公告)日：2014-01-20
申请号：JP2012213706
申请日：2012-09-27
申请人： Samsung Electro-Mechanics Co Ltd , サムソンエレクトロ−メカニックスカンパニーリミテッド.
发明人： GU HYUN-HEE , PARK MYUN-CHON , LEE KYU HA , CHE DA-YONG , PARK JAE YOUNG , KWON SANG HOON , JEON BYUNG JUN
IPC分类号： H01G4/30 , H01G4/12 , H01G4/232
CPC分类号： H01G4/30 , H01G4/005 , H01G4/12 , Y10T29/435
摘要： PROBLEM TO BE SOLVED: To provide a multilayer ceramic electronic component, and a manufacturing method therefor.SOLUTION: The multilayer ceramic electronic component of the present invention includes a ceramic body having a dielectric layer, a plurality of internal electrodes arranged in the ceramic body to face each other via the dielectric layer, an external electrode coupled electrically with the internal electrodes. The ceramic body includes an active layer, i.e., a capacity formation part, and a cover layer C, i.e., a capacity non-formation part, formed on at least one of the upper and lower surfaces of the active layer. The length of the ceramic body cut at a central part in the width W direction thereof, and the average thickness td of the cover layer C in the cross section of the thickness direction L-T are 15 μm or less. The external electrode contains conductive metal and glass, and when an area occupied by the glass in the external electrode is A, and an area occupied by the conductive metal is B, the following relation is satisfied; 0.05≤A/B≤0.6. The manufacturing method for the multilayer ceramic electronic component is also provided.
摘要翻译：要解决的问题：提供一种多层陶瓷电子部件及其制造方法。本发明的多层陶瓷电子部件具有陶瓷体，该陶瓷体具有电介质层，多个内部电极配置在陶瓷体内，经由电介质层彼此面对，与内部电极电连接的外部电极。陶瓷体包括活性层，即电容形成部分，以及形成在有源层的上表面和下表面中的至少一个上的覆盖层C，即电容非形成部分。在宽度W方向上的中心部分切割的陶瓷体的长度和厚度方向L-T的截面中的覆盖层C的平均厚度td为15μm以下。外部电极含有导电性金属和玻璃，当外部电极中的玻璃占有面积为A，导电性金属占有的面积为B时，满足以下关系： 0.05≤A/B≤0.6。还提供了多层陶瓷电子部件的制造方法。

4. 发明专利

JP2013123024A Conductive paste for external electrode, multilayer ceramic electronic component using the same, and method of manufacturing the same 审中-公开
标题翻译：用于外部电极的导电胶，使用其的多层陶瓷电子元件及其制造方法
公开(公告)号：JP2013123024A
公开(公告)日：2013-06-20
申请号：JP2012043014
申请日：2012-02-29
申请人： Samsung Electro-Mechanics Co Ltd , サムソンエレクトロ−メカニックスカンパニーリミテッド.
发明人： KIM HYE SEONG , LEE KYU HA , JEON BYUNG JUN , GU HYUN-HEE , PARK JAE YOUNG , CHE DA-YONG , CHOI EUN JOO , PARK MYUN-CHON , KIM CHANG HOON
IPC分类号： H01G4/232 , H01B1/00 , H01B1/16 , H01B1/22 , H01G4/30
CPC分类号： H01B1/22 , H01G4/008 , H01G4/12
摘要： PROBLEM TO BE SOLVED: To provide a conductive paste for an external electrode, a multilayer ceramic electronic component using the same, and a method of manufacturing the same.SOLUTION: According to the present invention, there are provided a conductive paste for an external electrode including: a conductive metal powder; and a spherical glass frit having an average particle size of 0.05 to 3.0 μm, a multilayer ceramic electronic component using the same, and a method of manufacturing the same. According to the present invention, a spherical glass frit having fine particles is applied in manufacturing the conductive paste for an external electrode, by which it is possible to realize external electrodes having excellent compactness at a low temperature and to suppress the occurrence of cracks. Thus, a multilayer ceramic electronic component having excellent reliability can be implemented.
摘要翻译：要解决的问题：为了提供外部电极用导电性糊剂，使用其的多层陶瓷电子部件及其制造方法。解决方案：根据本发明，提供了一种用于外部电极的导电浆料，其包括：导电金属粉末; 以及平均粒径为0.05〜3.0μm的球状玻璃料，使用其的多层陶瓷电子部件及其制造方法。根据本发明，在制造用于外部电极的导电浆料时，应用具有细颗粒的球形玻璃料，由此可以实现在低温下具有优异的紧凑性的外部电极并抑制裂纹的发生。因此，可以实现具有优异的可靠性的多层陶瓷电子部件。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2013098540A Multilayer ceramic electronic component and manufacturing method for the same 有权
标题翻译：多层陶瓷电子元件及其制造方法
公开(公告)号：JP2013098540A
公开(公告)日：2013-05-20
申请号：JP2012189749
申请日：2012-08-30
申请人： Samsung Electro-Mechanics Co Ltd , サムソンエレクトロ−メカニックスカンパニーリミテッド.
发明人： GU HYUN-HEE , KWON SANG HOON , KIM SANG HUK , CHE DA-YONG , CHOI JI NA , PARK JAE YOUNG , LIU CHANG BO , PARK MYUN-CHON
IPC分类号： H01G4/232 , H01C7/00 , H01C7/10 , H01F27/29 , H01G4/12 , H01G4/30
摘要： PROBLEM TO BE SOLVED: To provide a multilayer ceramic electronic component with excellent reliability achieving less penetration of plating liquid, and a manufacturing method for the component.SOLUTION: A multilayer ceramic electronic component includes: a ceramic main body; an internal electrode stacked inside the ceramic main body; and an external electrode including a first external electrode layer formed on the ceramic main body, a second external electrode layer formed on the first external electrode layer, and a third external electrode layer formed on the second external electrode layer.
摘要翻译：要解决的问题：提供具有优异的可靠性的多层陶瓷电子部件，其电镀液的渗透性较差，以及该部件的制造方法。＆lt; P＆gt;解决方案：多层陶瓷电子部件包括：陶瓷主体; 堆叠在陶瓷主体内部的内部电极; 以及外部电极，其包括形成在陶瓷主体上的第一外部电极层，形成在第一外部电极层上的第二外部电极层和形成在第二外部电极层上的第三外部电极层。版权所有（C）2013，JPO＆INPIT

6. 发明专利

JP2014011449A Multilayer ceramic electronic component 审中-公开
标题翻译：多层陶瓷电子元件
公开(公告)号：JP2014011449A
公开(公告)日：2014-01-20
申请号：JP2012207858
申请日：2012-09-21
申请人： Samsung Electro-Mechanics Co Ltd , サムソンエレクトロ−メカニックスカンパニーリミテッド.
发明人： GU HYUN-HEE , PARK MYUN-CHON , LEE KYU HA , CHE DA-YONG , PARK JAE YOUNG , KWON SANG HOON , JEON BYUNG JUN
IPC分类号： H01G4/30 , H01G4/12 , H01G4/232
CPC分类号： H01G4/12
摘要： PROBLEM TO BE SOLVED: To provide a multilayer ceramic electronic component.SOLUTION: The multilayer ceramic electronic component of the present invention includes a ceramic body having a dielectric layer, a plurality of internal electrodes arranged in the ceramic body to face each other via the dielectric layer, and an external electrode coupled electrically with the plurality of internal electrodes. The ceramic body includes an active layer S, i.e., a capacity formation part, and a cover layer C, i.e., a capacity non-formation part, formed on at least one of the upper and lower surfaces of the active layer. The length of the ceramic body cut at a central part in the width W direction thereof, and the average thickness td of the cover layer C in the cross section of the thickness direction L-T are 15 μm or less. The external electrode contains conductive metal and glass, and the average length Ls of the glass in the length direction of the external electrode satisfies the following relation; Ls≤10 μm. A manufacturing method for the multilayer ceramic electronic component is also provided.
摘要翻译：要解决的问题：提供一种多层陶瓷电子部件。解决方案：本发明的多层陶瓷电子部件包括具有电介质层的陶瓷体，布置在陶瓷体中的多个内部电极，经由电介质彼此面对层和与多个内部电极电连接的外部电极。陶瓷体包括有源层S，即容量形成部分，以及形成在有源层的上表面和下表面中的至少一个上的覆盖层C，即容量非形成部分。在宽度W方向上的中心部分切割的陶瓷体的长度和厚度方向L-T的截面中的覆盖层C的平均厚度td为15μm以下。外部电极含有导电性金属和玻璃，玻璃的长度方向的平均长度Ls满足以下关系： Ls≤10μm。还提供了一种用于多层陶瓷电子部件的制造方法。

7. 发明专利

JP2013115426A Multilayer ceramic electronic component and fabrication method thereof 有权
标题翻译：多层陶瓷电子元件及其制造方法
公开(公告)号：JP2013115426A
公开(公告)日：2013-06-10
申请号：JP2012169574
申请日：2012-07-31
申请人： Samsung Electro-Mechanics Co Ltd , サムソンエレクトロ−メカニックスカンパニーリミテッド.
发明人： PARK MYUN-CHON , LEE KYU HA , CHE DA-YONG , KIM CHANG HOON , GU HYUN-HEE , PARK JAE YOUNG , KWON SANG HOON , JEON BYUNG JUN
IPC分类号： H01G4/30 , H01G4/232
CPC分类号： H01G4/30 , H01G4/12 , H01G4/232 , H01G4/2325
摘要： PROBLEM TO BE SOLVED: To provide a multilayer ceramic electronic component having improved reliability through enhanced chip sealability, and a fabrication method thereof.SOLUTION: A multilayer ceramic electronic component comprises: a ceramic main body including a dielectric layer and having first and second main faces opposed to each other in a lamination direction of the dielectric layer, third and fourth side faces connecting the first and second main faces and opposed to each other in a length direction, and fifth and sixth faces connecting the first and second main faces and opposed to each other in a width direction; first and second internal electrodes disposed to face each other, while having the dielectric layer interposed therebetween within the ceramic main body; and one or more first external electrodes formed on the fifth face and electrically connected to the first internal electrodes and one or more second external electrodes formed on the sixth face and electrically connected to the second internal electrodes. The first and second external electrodes include a conductive metal and glass and have an average thickness ranging from 3 to 30 μm. When at least one of the first and second external electrodes is divided into three equal parts in a thickness direction, an area of glass is 35% to 80% of a total area of a central portion thereof.
摘要翻译：要解决的问题：提供一种通过提高芯片密封性而提高可靠性的多层陶瓷电子部件及其制造方法。解决方案：多层陶瓷电子部件包括：陶瓷主体，其包括电介质层，并且在电介质层的层叠方向上具有彼此相对的第一和第二主面，连接第一和第二侧面的第三和第四侧面主面并且在长度方向上彼此相对，以及连接第一主面和第二主面并沿宽度方向彼此相对的第五和第六面; 第一和第二内部电极彼此相对设置，同时在陶瓷主体内部具有介电层; 以及形成在第五面上并电连接到第一内部电极的一个或多个第一外部电极和形成在第六面上并电连接到第二内部电极的一个或多个第二外部电极。第一外部电极和第二外部电极包括导电金属和玻璃，并且具有3至30μm的平均厚度。当第一外部电极和第二外部电极中的至少一个在厚度方向上被分成三个相等的部分时，玻璃的面积为其中心部分的总面积的35％至80％。版权所有（C）2013，JPO＆INPIT

8. 发明专利

JP2012244150A Multilayer ceramic electronic component 有权
标题翻译：多层陶瓷电子元件
公开(公告)号：JP2012244150A
公开(公告)日：2012-12-10
申请号：JP2012005880
申请日：2012-01-16
申请人： Samsung Electro-Mechanics Co Ltd , サムソンエレクトロ−メカニックスカンパニーリミテッド.
发明人： PARK MYUN-CHON , CHE DA-YONG , KIM BYEONG-GYUN , KIM JI-SOK , JEON BYUNG JUN , GU HYUN-HEE , LEE KYU HA , YOON GUN-JONG , NA EUN SANG
IPC分类号： H01G4/232 , H01F27/29 , H01G4/252 , H01G4/30
CPC分类号： C03C3/00 , B32B18/00 , C03C3/066 , C03C3/089 , C03C8/04 , C04B2237/346 , C04B2237/68 , C22C19/03
摘要： PROBLEM TO BE SOLVED: To provide a multilayer ceramic electronic component that can achieve high reliability (hermetic sealing) while forming a thin layer.SOLUTION: A multilayer ceramic electronic component is formed in a manner that an external electrode is formed using two layers with first and second layers having different glass compositions. Thus, the adhesion force between the external electrode and an internal electrode can be improved and glass elution can be prevented, thereby increasing the reliability.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式