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1. 发明专利

JP2002368480A Electromagnetic wave suppressor sheet 有权
标题翻译：电磁波抑制片
公开(公告)号：JP2002368480A
公开(公告)日：2002-12-20
申请号：JP2001177510
申请日：2001-06-12
申请人： Nitto Denko Corp , Sony Corp , ソニー株式会社 , 日東電工株式会社
发明人： IGARASHI KAZUMASA , TOYODA JUNICHI , OKAYAMA KATSUMI
IPC分类号： C08J5/18 , C08K9/02 , C08L101/00 , H01L23/552 , H05K9/00
CPC分类号： H01L23/552 , H01L24/45 , H01L24/48 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01079 , H01L2924/12042 , H01L2924/181 , H01L2924/3025 , Y10T428/32 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： PROBLEM TO BE SOLVED: To provide an electromagnetic wave suppressor sheet capable of reducing unnecessary radiative electromagnetic wave from an electronic apparatus and having a large imaginary part permeability μ" and an excellent electric insulating property. SOLUTION: This electromagnetic wave suppressor sheet is formed into a sheet shape from material made of synthetic resin into which powder of composite magnetic particles is dispersed, and its surface is treated by insulating inorganic material.
摘要翻译：要解决的问题：提供一种能够减少来自电子设备的不必要的辐射电磁波并具有大的虚部磁导率μ“和优异的电绝缘性的电磁波抑制片。解决方案：该电磁波抑制片被形成为由合成树脂制成的复合磁性颗粒粉末分散的片材形状，其表面用绝缘无机材料处理。

2. 发明专利

JP2002363383A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR SEALING EPOXY RESIN COMPOSITION TO BE USED THEREFOR 失效
公开(公告)号：JP2002363383A
公开(公告)日：2002-12-18
申请号：JP2001177509
申请日：2001-06-12
申请人： NITTO DENKO CORP , SONY CORP
发明人： IGARASHI KAZUMASA , TOYODA JUNICHI , OKAYAMA KATSUMI
IPC分类号： C08L63/00 , C08G59/08 , C08G59/62 , C08K9/02 , H01L23/29 , H01L23/31 , H01L23/552
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device having an electromagnetic wave shielding function which is resin-sealed with a sealing medium having excellent electrical insulating characteristics. SOLUTION: A semiconductor element 2 is mounted on a wiring circuit board 1 where a circuit 3 is formed, and this semiconductor element 2 is resin- sealed with a first sealing resin layer 4. And, a second sealing resin layer 5 is formed on the outer periphery of the above first sealing resin layer 4 with the use of an epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, and (D) at least one of (d1) electroconductive particles whose surfaces have been subjected to coating treatment with an insulating inorganic material and (d2) magnetic particles whose surfaces have been subjected to coating treatment with an insulating inorganic material.

3. 发明专利

JP2002363382A SEMICONDUCTOR SEALING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE USING THE SAME 失效
公开(公告)号：JP2002363382A
公开(公告)日：2002-12-18
申请号：JP2001173780
申请日：2001-06-08
申请人： SONY CORP , NITTO DENKO CORP
发明人： TOYODA JUNICHI , OKAYAMA KATSUMI , IGARASHI KAZUMASA
IPC分类号： C08L63/00 , C08G59/62 , C08K7/18 , H01L23/29 , H01L23/31 , H01L23/552
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor sealing resin composition whose cured product has an electromagnetic wave shielding function and insulating characteristics, simultaneously, the above composition having good moldability. SOLUTION: The semiconductor sealing resin composition is constituted by comprising a powder of a magnetic material and a silica powder having an average particle diameter smaller than that of this powder of a magnetic material, thereby the cured product of the semiconductor sealing resin composition has an electromagnetic wave shielding function by the magnetic powder, and the gaps of the powder of a magnetic material are filled with the silica powder having a smaller average particle diameter to improve the moldability of the semiconductor sealing resin composition and, simultaneously, the insulating characteristics are enhanced. The use of such a semiconductor sealing resin composition can produce a well molded and sealed semiconductor device which has an electromagnetic wave shielding function and, simultaneously, does not cause the malfunction by a leakage current from the semiconductor element.

4. 发明专利

JP2005156531A Pressure sensor and biological information processor 审中-公开
标题翻译：压力传感器和生物信息处理器
公开(公告)号：JP2005156531A
公开(公告)日：2005-06-16
申请号：JP2004185221
申请日：2004-06-23
申请人： Sony Corp , ソニー株式会社
发明人： NAOI TAKAYOSHI , TOYODA JUNICHI
IPC分类号： G01L1/16 , A61B5/0245 , A61B5/11
摘要： PROBLEM TO BE SOLVED: To provide a pressure sensor capable of increasing adhesion with a measured object for improvement in detection sensitiveness, and a biological information processor. SOLUTION: This pressure sensor is constructed so that an elastic part 4 is brought into contact with a sensor part 101 formed by covering a pressure sensing part 100, which is a piezoelectric film 1 having conductive films 2 and 2' formed on its front and back faces, with an insulation part 3. In this way, when the elastic part 4 is pressed, the sensor part 101 is pressed to be brought into close contact with the measured object, so that adhesion between the sensor part 101 and the measured object can be increased, and consequently, the pressure sensor with high detection sensitiveness can be realized. In measurement, shock and vibration applied to the piezoelectric film 1 can be reduced when the elastic part 4 is positioned between an installation part such as a belt and the sensor part 101, and effect of noise from the outside of the pressure sensing part can be lowered. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供能够增加与测量对象的粘附性以提高检测灵敏度的压力传感器和生物信息处理器。解决方案：该压力传感器被构造成使得弹性部件4与通过覆盖作为其上形成有导电膜2和2'的压电膜1的压力感测部件100形成的传感器部件101相接触具有绝缘部件3.这样，当按压弹性部件4时，传感器部件101被按压以与所测量的物体紧密接触，使得传感器部件101和可以提高测量对象，从而可以实现具有高检测灵敏度的压力传感器。在测量时，当弹性部分4位于诸如皮带的安装部分和传感器部分101之间时，施加到压电薄膜1上的冲击和振动可以减小，并且来自压力感测部分的外部的噪声的影响可以是降低。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2001085844A MULTILAYER PRINTED BOARD 失效
公开(公告)号：JP2001085844A
公开(公告)日：2001-03-30
申请号：JP26389599
申请日：1999-09-17
申请人： SONY CORP
发明人： TOYODA JUNICHI
IPC分类号： H05K9/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a multilayer printed board capable of suppressing electromagnetic interference. SOLUTION: At a multilayer printed board 20, a magnetic insulating layer 21 is formed by screen printing with a magnetic insulating material, where soft magnetic particles such as ferrite and epoxy resin material are mixed. Since a circuit element 8 is shielded electromagnetically by the magnetic insulating layer 21, electromagnetic interference to a wiring pattern layer 1 above it and the wiring pattern layer 1 itself is suppressed.

6. 发明专利

JP2001077585A ELECTROMAGNETIC WAVE ABSORBING PASTE 失效
公开(公告)号：JP2001077585A
公开(公告)日：2001-03-23
申请号：JP25195899
申请日：1999-09-06
申请人： SONY CORP
发明人： TOYODA JUNICHI
IPC分类号： H05K9/00 , H01Q17/00
摘要： PROBLEM TO BE SOLVED: To prevent warping of a board due to heat treatment and spurious radiation and leakage of electromagnetic waves from electronic components or the like by mixing low thermal expansion coefficient particles into a mixture obtained by kneading electromagnetic wave absorbing material and organic binder. SOLUTION: The gaps among electromagnetic wave absorbing material comprising magnetic material particles are filled with low-thermal expansion coefficient particles 7. The materials used for the electromagnetic wave absorbing materials include ferrite materials and metallic materials. Spherical silica or cordierite is used as the low-thermal expansion coefficient particles 7. For example, ferrite, a soft magnetic material, has substantially no effect on electromagnetic wave absorption when they are not more than 2 μm in grain size, but fine particles are also required for ensuring the shape of paste (e.g. viscosity, fluidity) and shape for formation in printing. So, silica, for example, in which its grain size is so adjusted that ferrite is most closely packed (grain size: not more than 2 μm) is mixed. Thus warping of a board after paste being cured can be prevented without degrading electromagnetic wave-absorbing characteristic.

7. 发明专利

JP2001015312A MANUFACTURE OF MAGNETIC ELECTROMAGNETIC WAVE ABSORBING PASTE, THE MAGNETIC ELECTROMAGNETIC WAVE ABSORBING PASTE, ELECTRONIC COMPONENT AND PRINTED BOARD 失效
公开(公告)号：JP2001015312A
公开(公告)日：2001-01-19
申请号：JP18302599
申请日：1999-06-29
申请人： SONY CORP
发明人： IWASHITA TAKESHI , ISHII MASAMI , TOYODA JUNICHI
IPC分类号： H01F1/00 , H01F1/34 , H05K9/00
摘要： PROBLEM TO BE SOLVED: To obtain magnetic electromagnetic wave absorbing paste, having high absorption coefficient at high frequency and over a wide band. SOLUTION: FeO 11, MnO 12, ZnO 13 and a binder 10 are mixed, thereby forming a mixed solution 14 (a). The mixed solution 14 is spread on a base film 16, which is drawn out by a roll 15a and wound up by a roll 15b (b). The mixed solution 14 dropped on the base film 16 is subjected to coating of at most 2 μm thickness. After coating, the mixed solution 14 is heated and dried. From above the base film 16, a flat ferrite 17 which is turned into a sheet type is peeled, thereby formation of the flat ferrite 17 is finished (c). The formed flat ferrite 17 is ground and baked at 900-1,250 deg.C, thereby obtaining ferrite powder. The ferrite powder is mixed with a material for paste, and a magnetic electromagnetic absorbing paste is made.

8. 发明专利

JP2000334381A FAN DEVICE AND ITS USAGE 失效
公开(公告)号：JP2000334381A
公开(公告)日：2000-12-05
申请号：JP15326699
申请日：1999-06-01
申请人： SONY CORP
发明人： TOYODA JUNICHI
IPC分类号： B06B1/06 , F04D25/08 , H01L41/083
摘要： PROBLEM TO BE SOLVED: To enable sure drive even when a drive voltage is low, and to prevent the increase in processing man-hour and in the number of parts. SOLUTION: A fan device 12 is provided with a pair of piezoelectric element laminated bodies 14, 15 formed by laminating plural thin-layered piezoelectric elements, an elastic metal plate 17 of which the base end part 17a is put between a pair of the piezoelectric element laminated bodies 14, 15 and of which the forward end is oscillatingly mounted without being restricted, and an alternating-current power supply 21 capable of impressing AC voltage on the external electrodes of a pair of the piezoelectric element laminated bodies. Internal electrodes between the piezoelectric elements of the piezoelectric element laminated bodies are mounted on the both side surfaces of the piezoelectric element laminated bodies and are alternately connected to side electrodes which are respectively connected to the external electrodes on the upper and lower surfaces. Notches 17c, 17d are formed in a manner to prevent the contact of the elastic metal plate with the side electrodes.

9. 发明专利

JP2000286581A HEAT TRANSFER UNIT AND ELECTRONIC APPARATUS 失效
公开(公告)号：JP2000286581A
公开(公告)日：2000-10-13
申请号：JP8906599
申请日：1999-03-30
申请人： SONY CORP
发明人： YAZAWA KAZUAKI , TOYODA JUNICHI
IPC分类号： H05K7/20 , F28D11/06 , H01L23/473
摘要： PROBLEM TO BE SOLVED: To transmit heat from a heating part silently and forcibly by driving a piezoelectric means from an ultrasonic signal supply means to flow a fluid in a specified direction through an endless loop hollow section and transmitting heat. SOLUTION: An ultrasonic signal is fed between an electrode 5A and an outer surface part 10C from an ultrasonic signal generating source 6A and an ultrasonic signal is fed between an electrode 5B and the outer surface part 10C. Vibration of Csin ωt is generated in piezoelectric elements 4A, 4B located between the electrode 5A and the outer surface part 10C of a carrier member 10 and vibration of Ccos ωt is generated in piezoelectric elements 4C, 4D located between the electrode 5B and the outer surface part 10C of the carrier member 10. By the frictional resistance between a fluid filling a ring-like hollow section with no gap and the inner surface part of a ring-like member 10, the fluid is imparted with a motion for flowing through the ring-like hollow section clockwise from a wave traveling on the outer surface part 10C counterclockwise thus bringing out a state where the fluid is circulated forcibly through the ring-like hollow section.

10. 发明专利

JP2000277959A COOLING DEVICE AND ELECTRONIC UNIT 失效
公开(公告)号：JP2000277959A
公开(公告)日：2000-10-06
申请号：JP8655099
申请日：1999-03-29
申请人： SONY CORP
发明人： YAZAWA KAZUAKI , TOYODA JUNICHI
IPC分类号： H05K7/20 , H01L23/44 , H01L23/467 , H01L41/09
摘要： PROBLEM TO BE SOLVED: To efficiently cool a specified heat generating part with a cooling mechanism that an electronic unit has. SOLUTION: In this cooling device, a jet generating device 1 jetting cooling fluid is arranged in response to the heat generating face-side of a heat generating device 11. A piezoelectric element 12 is stuck/fixed to the heat generating device 11, voltage which changes in a random pulse form is supplied from a voltage supply circuit 13 and is driven to vibrate in random pulse from. The cooling device is cooled by a cooling fluid, which is jet from the jet generating device 1 while the heat generation device 11 is vibrated at random.

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