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1. 发明专利

JP2009043808A Thermoelectric device and manufacturing method of thermoelectric device 审中-公开
标题翻译：热电装置的热电装置及其制造方法
公开(公告)号：JP2009043808A
公开(公告)日：2009-02-26
申请号：JP2007205176
申请日：2007-08-07
申请人： Sony Corp , ソニー株式会社
发明人： SOTOZAKI MINEHIRO , MURAOKA YOSHIO , YAJIMA SHOICHI , ISHIDA YUICHI
IPC分类号： H01L35/32 , H01L35/34 , H02N11/00
摘要： PROBLEM TO BE SOLVED: To provide a thermoelectric device which has fine electrodes larger than a certain height, and to provide a method of manufacturing the same. SOLUTION: On respective internal surfaces 5c of substrates 5, a plurality of grooves 6 are provide, and the electrodes 4 are formed in the plurality of grooves 6. Namely, the electrodes 4 of the thermoelectric device 10 are formed in the substrates 5. Consequently, the electrodes 4 can be formed in the substrates 5 at the level higher than a predetermined height. The electrodes 4 can, therefore, be decreased in resistance value and the thermoelectric performance of the thermoelectric device 10 increases. When the height of thermoelectric materials 3 is made small, the electrodes 4 have larger resistance values that no one can ignore compared with the thermoelectric materials 3, which is especially effective. Further, the electrodes 4 are provided in the substrates 5 and then the height of the thermoelectric device 10 can be made small. Further the width of the thermoelectric materials 3 is optimized to further improve the thermoelectric performance of the thermoelectric device. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有大于一定高度的细电极的热电装置，并提供其制造方法。解决方案：在基板5的各个内表面5c上，提供多个槽6，并且电极4形成在多个槽6中。即，热电装置10的电极4形成在基板因此，电极4可以以高于预定高度的水平形成在基板5中。因此，电极4的电阻值可以降低，并且热电装置10的热电性能增加。当热电材料3的高度变小时，电极4具有比热电材料3更高的电阻值，这是特别有效的。此外，电极4设置在基板5中，然后可以使热电装置10的高度变小。此外，热电材料3的宽度被优化以进一步提高热电装置的热电性能。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2009021410A Manufacturing method of thermoelectric device 有权
标题翻译：热电装置的制造方法
公开(公告)号：JP2009021410A
公开(公告)日：2009-01-29
申请号：JP2007183104
申请日：2007-07-12
申请人： Sony Corp , ソニー株式会社
发明人： SOTOZAKI MINEHIRO , ISHIDA YUICHI
IPC分类号： H01L35/34 , H01L35/32
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a thermoelectric device in which neither a thermoelectric material nor an electrode is damaged.
SOLUTION: The (p) or (n) type thermoelectric material 3 is molded using a silicon pattern 51. The silicon pattern 51 including the thermoelectric material 3 having electrodes 4a formed is stuck on a silicon substrate 5. At this time, electrodes 4b formed on the silicon substrate 51 and the electrodes 4a on the reverse surface of the thermoelectric material 3 are joined together. A protective film 7a is formed on the electrodes 4b. The silicon pattern 51 is etched using resist 8a as a mask and the protective film 7a on the electrodes 4b as a stop layer. Consequently, even when etching processing is carried out for a long time, the electrodes 4b below the protective film 7a are not damaged since the protective film 7a functions as the stop layer.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供热电装置的制造方法，其中热电材料和电极都不损坏。
解决方案：使用硅图案51模制（p）或（n）型热电材料3.将包含形成有电极4a的热电材料3的硅图案51粘贴在硅衬底5上。此时，形成在硅基板51上的电极4b和热电材料3的背面上的电极4a接合在一起。在电极4b上形成保护膜7a。使用抗蚀剂8a作为掩模蚀刻硅图案51，并将电极4b上的保护膜7a作为停止层进行蚀刻。因此，即使长时间进行蚀刻处理，由于保护膜7a用作停止层，所以保护膜7a下方的电极4b不被损坏。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2005326133A Cooling device, manufacturing method of cooling device, manufacturing device of cooling device, and electronic equipment 审中-公开
标题翻译：冷却装置，冷却装置的制造方法，冷却装置的制造装置和电子装置
公开(公告)号：JP2005326133A
公开(公告)日：2005-11-24
申请号：JP2004370466
申请日：2004-12-22
申请人： Sony Corp , ソニー株式会社
发明人： OMI MOTOSUKE , SOTOZAKI MINEHIRO , KATOU GOUSAKU , NAGAI HIROYUKI
IPC分类号： F25D9/00 , F28D15/02 , H05K7/20
CPC分类号： F28D15/0266
摘要： PROBLEM TO BE SOLVED: To provide a cooling device capable of ensuring desired cooling performance while suppressing the dispersion of the performance among products, a manufacturing method of cooling device, a manufacturing device of cooling device, and electronic equipment.
SOLUTION: A refrigerant is injected into a condensation substrate 5 through an injection port 24a, and the quantity of the injected refrigerant is adjusted. An O-ring 17 is installed to a lid member 12 attachable to and detachable from the condensation substrate 5. Since the quantity of the refrigerant can be adjusted, desired cooling performance can be obtained, and the dispersion of the cooling performance among products can be suppressed.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够确保期望的冷却性能同时抑制产品之间的性能分散，冷却装置的制造方法，冷却装置的制造装置和电子设备的冷却装置。解决方案：制冷剂通过注入口24a注入冷凝基板5，并且调节喷射的制冷剂的量。 O形圈17安装在可冷凝基板5上可拆卸的盖部件12上。由于可以调节制冷剂的量，因此可以获得期望的冷却性能，并且可以使产品之间的冷却性能的分散抑制。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2005259747A Heat transport apparatus and electronic device 审中-公开
标题翻译：热运输设备和电子设备
公开(公告)号：JP2005259747A
公开(公告)日：2005-09-22
申请号：JP2004065267
申请日：2004-03-09
申请人： Sony Corp , ソニー株式会社
发明人： OMI MOTOSUKE , SOTOZAKI MINEHIRO , KATOU GOUSAKU , YAJIMA TAKASHI
IPC分类号： F28D15/02 , H01L23/473
摘要： PROBLEM TO BE SOLVED: To provide a heat transport apparatus capable of maintaining desired performance of the heat transport apparatus and an electronic device with the apparatus mounted.
SOLUTION: The heat transport apparatus 1 includes bellows 6 for suppressing an increase in pressure of flow paths P1-P4. Thus, when the heat transport apparatus 1 is used for a long time for example and the pressure in the flow paths P1-P4 increases, the bellows 6 are activated to reduce the pressure in the flow paths P1-P4 to suppress the increase in pressure of the flow paths P1-P4. Therefore, the heat transport apparatus 1 can be stably operated for a long time.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够保持热输送装置的期望性能的热输送装置和安装有该装置的电子装置。解决方案：传热装置1包括用于抑制流路P1-P4的压力增加的波纹管6。因此，当长时间使用传热装置1并且流路P1-P4中的压力增加时，波纹管6被启动以减小流路P1-P4中的压力以抑制压力的增加的流路P1-P4。因此，热输送装置1能够长时间稳定地运转。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2005142513A Cooling device and electronic equipment 审中-公开
标题翻译：冷却装置和电子设备
公开(公告)号：JP2005142513A
公开(公告)日：2005-06-02
申请号：JP2003380392
申请日：2003-11-10
申请人： Sony Corp , ソニー株式会社
发明人： SOTOZAKI MINEHIRO
IPC分类号： F25D17/00 , F25D9/00 , F28D15/02 , H05K7/20
CPC分类号： F28D15/0266
摘要： PROBLEM TO BE SOLVED: To provide a cooling device, capable of securely preventing a dryout by improving the efficiency of heat transport, and to provide electronic equipment mounted with the cooling device.
SOLUTION: The cooling device 1 can surely make a cooling medium circulate, because of a provided diaphragm type pump 20 which positively generates a pump force by the vibrations of films 17A to 17C. Namely, the pump force which is different from a capillary force is generated in combination with the capillary force, so that the pump force is made larger than normal, to circulate the cooling medium. Consequently, the efficiency of heat transport is improved to surely prevent dryout.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够通过提高热输送效率可靠地防止干燥的冷却装置，并提供安装有冷却装置的电子设备。解决方案：由于提供的隔膜式泵20通过膜17A至17C的振动而积极地产生泵浦力，冷却装置1可以确实地使冷却介质循环。也就是说，与毛细管力不同的泵力与毛细管力结合产生，使得泵力大于正常，使循环冷却介质。因此，提高了热输送的效率，从而可以防止干燥。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2003185369A COOLING DEVICE, ELECTRONIC APPARATUS AND METHOD OF MANUFACTURING COOLING DEVICE 审中-公开
公开(公告)号：JP2003185369A
公开(公告)日：2003-07-03
申请号：JP2001380601
申请日：2001-12-13
申请人： SONY CORP
发明人： SOTOZAKI MINEHIRO , KATOU GOUSAKU , SANO NAOKI , KITAGAWA KOJI
IPC分类号： F25D9/00 , F28D15/02 , H01L23/427 , H05K7/20
摘要： PROBLEM TO BE SOLVED: To provide a compact and thin cooling device having high cooling performance, an electronic apparatus and a method of manufacturing the cooling device. SOLUTION: This cooling device 1 is formed by joining a pair of rectangular first and second glass bases 2, 3 composed of, for example, glass as a low heat diffusive material, through a silicone member 4. The joining faces of the bases 2, 3 are provided with grooves 5, 6. The grooves 5, 6 are formed to function as a looped heat pipe when the bases 2, 3 are joined. COPYRIGHT: (C)2003,JPO

7. 发明专利

JP2003019716A Mold for holding composite lens and method for molding composite lens by using the mold 审中-公开
标题翻译：用于保持复合透镜的模具和通过使用模具来模制复合透镜的方法
公开(公告)号：JP2003019716A
公开(公告)日：2003-01-21
申请号：JP2001205981
申请日：2001-07-06
申请人： Sony Corp , ソニー株式会社
发明人： ANDO MASAKI , SOTOZAKI MINEHIRO
IPC分类号： B29C33/38 , B29C39/26 , B29L11/00 , G02B3/00 , G02B3/02 , G02B1/10
摘要： PROBLEM TO BE SOLVED: To inexpensively provide a precision composite lens by improving the release properties of a mold for molding the lens. SOLUTION: In a method for molding the composite lens, in the mold 1 for molding the composite lens, a mold main body 11 has a mold surface 11a on which a transfer shape for constituting the shape of a resin lens is formed. At least a photocatalyst effect film 12 is formed on the mold surface 11a. An ultraviolet curable resin is arranged between the mold surface 11a and a lens to be a base material. After that, the ultraviolet curable resin and the mold surface 11a are irradiated with ultraviolet rays so that the resin is hardened to form the resin lens. The resin lens, which has acquired the photocatalyst effect of the film 12 on the mold surface 11a, is peeled off from the mold surface 11a.
摘要翻译：要解决的问题：通过改善用于模制透镜的模具的剥离性能来廉价地提供精密复合透镜。解决方案：在复合透镜成型方法中，在用于模制复合透镜的模具1中，模具主体11具有形成用于构成树脂透镜形状的转印形状的模具表面11a。在模具表面11a上形成至少一种光催化剂效果膜12。在模具表面11a和作为基材的透镜之间设置紫外线固化树脂。之后，用紫外线照射紫外线固化树脂和模具表面11a，使树脂硬化以形成树脂透镜。已经获得膜12在模具表面11a上的光催化作用的树脂透镜从模具表面11a剥离。

8. 发明专利

JP2002349975A HEAT TRANSPORT SYSTEM 审中-公开
公开(公告)号：JP2002349975A
公开(公告)日：2002-12-04
申请号：JP2002039656
申请日：2002-02-18
申请人： SONY CORP
发明人： SOTOZAKI MINEHIRO , KITAGAWA KOJI , ISHIKAWA HIROKAZU , HORI KAZUHITO
IPC分类号： B81B7/00 , F25B1/00 , F28F1/10 , H01L23/473
摘要： PROBLEM TO BE SOLVED: To enhance heat transfer characteristics by reducing the thickness in a heat transport system which uses a microchannels and micropumps. SOLUTION: The heat transport system 1 employs a structure, constituted by integrating the microchannels for allowing a refrigerant to flow through with the micropump for transporting the refrigerant. For example, a multilayer structure is constituted, by laminating a channel layer 2 having a microchannel 2a formed therein, on a pump layer 4 having a micropump 4a formed therein, or a large number of unit structures, each being constituted by integrating the microchannel with the micropump are arrayed. Then, by having the microchannels and the micropumps formed on a resin substrate made of a flexible material flexibility is imparted.

9. 发明专利

JP2002074767A DEVICE FOR SURFACE TREATMENT AND METHOD FOR SURFACE TREATMENT 失效
公开(公告)号：JP2002074767A
公开(公告)日：2002-03-15
申请号：JP2000268841
申请日：2000-09-05
申请人： SONY CORP
发明人： SOTOZAKI MINEHIRO , KITAGAWA KOJI , KOBAYASHI MASATO
IPC分类号： G11B7/26
摘要： PROBLEM TO BE SOLVED: To provide a device and a method for surface treatment by which the period required for the surface treatment of the object body made of an insulating material can be decreased and the treatment cost can be reduced. SOLUTION: A grid-like electrode body 10 is disposed to face a disk 9 (object to be treated) in a vacuum chamber 1. The electrode body 10 has a form to surround the substantially whole surface of the disk 9, and for example, it consists of two plate electrodes disposed on both sides of the disk 9. The electrode body 10 is made of a black conductive material (graphite), on which a voltage containing positive and negative pulses is applied from a pulse power supply 6. Plasma containing ions is generated from an ion source 3, and the positive ions in the plasma are accelerated to pass through the electrode body 10 and injected into the disk 9. The radiation energy generated by the ion injection into the disk 9 is absorbed by the black electrode body 10, and as a result, temperature increase in the disk 9 is suppressed.

10. 发明专利

JP2001267314A SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR 失效
公开(公告)号：JP2001267314A
公开(公告)日：2001-09-28
申请号：JP2000076258
申请日：2000-03-17
申请人： SONY CORP
发明人： KOBAYASHI MASATO , SOTOZAKI MINEHIRO
IPC分类号： H01L29/78 , H01L21/316
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device, where a surface protective film having a good surface protection operation is formed instead of a multiple layer structure including a silicon nitride surface protective film, and to provide its manufacturing method. SOLUTION: A semiconductor device 25, where a surface protective film 23 constituted of a silicon oxide insulating film, is installed on a semiconductor substrate 16 and at least the surface area of the surface protection film 23 is improved by ion implantation 37 and the manufacturing method are arranged.

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