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1. 发明专利

JP2010261632A Method of manufacturing heat transport device 审中-公开
标题翻译：制造热交换装置的方法
公开(公告)号：JP2010261632A
公开(公告)日：2010-11-18
申请号：JP2009111846
申请日：2009-05-01
申请人： Sony Corp , ソニー株式会社
发明人： HIRATA TAKASHI , YAJIMA TAKASHI , GOTO KAZUO
IPC分类号： F28D15/02
CPC分类号： F28D15/0233 , F28F2275/067
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a heat transport device improved in airtightness inside of the heat transport device. SOLUTION: The airtightness of an acting area 8 in a housing 12 is secured before a welding process by temporarily sealing an injection passage 2c before the welding process under vacuum. Further a plate material 40 is disposed so that a part of laser beam 15 is applied to a peripheral region 1d through, for example, one through-hole 41, and the remaining is applied to the circumference of the through-hole 41 in applying the laser beam 15 to the housing 12. The plate material 40 and the peripheral region 1d are melted by the irradiation of the laser beam 15, and contact parts of the peripheral region 1d and an inner face of the injection passage 2c are welded. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：提供一种制造传热装置内部的气密性改善的方法。解决方案：在焊接过程之前，通过在真空下进行焊接过程之前临时密封注入通道2c，在壳体12内的作用区域8的气密性被固定。此外，板材40设置成使得激光束15的一部分通过例如一个通孔41被施加到周边区域1d，并且剩余的施加到通孔41的周边，激光束15到壳体12.板材40和周边区域1d通过激光束15的照射而熔化，并且周边区域1d和喷射通道2c的内表面的接触部分被焊接。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2010243077A Method of manufacturing heat transport device, heat transport device, electronic apparatus, and caulking pin 审中-公开
标题翻译：制造热输送装置的方法，热传输装置，电子装置和密封件
公开(公告)号：JP2010243077A
公开(公告)日：2010-10-28
申请号：JP2009092782
申请日：2009-04-07
申请人： Sony Corp , ソニー株式会社
发明人： YAJIMA TAKASHI , GOTO KAZUO , YAMASHITA KEITARO , SAKAMOTO KAZUYA
IPC分类号： F28D15/02 , H01L23/427 , H05K7/20
CPC分类号： F28D15/0233 , F28D15/0283 , H01L23/427 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a heat transport device capable of improving airtightness inside the heat transport device, the heat transport device, and an electronic apparatus mounted with this. SOLUTION: An area surrounding an injection opening 1a of a casing 12 is crushed (caulked) by a caulking pin 20 having a circular blade 21, which means, the injection opening 1a is surrounded by the blade 21, and the caulking pin 20 is pushed to crush the surrounding area of the injection opening 1a. As the result, a temporary sealing groove 1b is formed, which blocks communication between an injection passage 2c and an action area 8 so as to temporarily seal the injection passage 2c. After the temporary sealing, the injection opening is crushed by another caulking pin, and the crushed part is welded by a laser to seal the injection opening. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决问题的方案：提供一种能够提高传热装置，热输送装置以及与此相配的电子装置内的气密性的热输送装置的制造方法。解决方案：通过具有圆形刀片21的铆接销20将围绕壳体12的注射开口1a的区域压碎（铆接），这意味着注射开口1a被刀片21包围，并且铆接销 20被推压以粉碎注射开口1a的周围区域。结果，形成临时密封槽1b，其阻止注入通道2c和作用区域8之间的连通，以便暂时密封注射通道2c。在临时密封之后，由另一个铆接销挤压注射开口，用激光焊接被压碎的部分以密封注射开口。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2010014292A Heat transport device, electronic device, and laminated structure 审中-公开
标题翻译：热输送装置，电子装置和层压结构
公开(公告)号：JP2010014292A
公开(公告)日：2010-01-21
申请号：JP2008172654
申请日：2008-07-01
申请人： Sony Corp , ソニー株式会社
发明人： GOTO KAZUO , YAJIMA TAKASHI
IPC分类号： F28D15/02 , H01L23/427
摘要： PROBLEM TO BE SOLVED: To provide technology of a heat transport device and the like capable of reducing flow channel resistance and exerting large capillary force in the heat transporting direction.
SOLUTION: This heat transport device 100 has a laminated structure 20 inside. The laminated structure 20 is formed by laminating a plurality of bases 1. The bases 1 have grooves 2 along the longitudinal direction (Y direction), and a plurality of openings 4 are formed on bottom surfaces 2a of the grooves 2. The steam moves to an upper part of the laminated structure 30 through the openings 4. The liquid moves from a radiating section 50 to a heat absorbing section 40 along side faces 2b by capillary force of the grooves 2. As the grooves 2 are respectively formed on the bases along the heat transporting direction, a liquid-phase flow channel is not formed in the direction except for the heat transporting direction. Thus, the flow channel resistance can be reduced, and the large capillary force can be exerted in the heat transporting direction. Further, this technology can cope with miniaturization and thinning of the heat transport device.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供能够降低流动通道阻力并在热传输方向施加大的毛细管力的热传输装置等的技术。解决方案：该热输送装置100内部具有层压结构20。层叠结构体20通过层叠多个基体1而形成。基部1沿着长度方向（Y方向）具有槽2，在槽2的底面2a上形成有多个开口部4.蒸汽移动到通过开口4的层叠结构30的上部。液体通过槽2的毛细力沿着侧面2b从散热部50移动到吸热部40.由于槽2分别形成在基部上热传送方向，除了热传输方向以外的方向上不形成液相流路。因此，能够减小流路阻力，能够在热传输方向上产生较大的毛细作用力。此外，该技术可以应对热输送装置的小型化和变薄。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2010007905A Heat transport device and electronic equipment 有权
标题翻译：热输送设备和电子设备
公开(公告)号：JP2010007905A
公开(公告)日：2010-01-14
申请号：JP2008165352
申请日：2008-06-25
申请人： Sony Corp , ソニー株式会社
发明人： YOSHITAKA HIROYUKI , YAJIMA TAKASHI , HASHIMOTO MITSUO , OTA TOSHIRO , SHIGEMOTO TATSUHIKO , GOTO KAZUO
IPC分类号： F28D15/02 , H01L23/427
CPC分类号： F28D15/046 , F28D15/0233 , G06F1/203 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a heat transport device permitting easy processing and stable mass production and electronic equipment mounted with the heat transport device.
SOLUTION: The heat transport device includes: a sealed container; working fluid sealed within the sealed container; and a plurality of plate-shaped members 21-25 each of which has both first holes having a first opening area and second holes having a second opening area smaller than the first opening area. The plurality of plate-shaped members 21-25 are laminated within the sealed container so that the inside of the first holes of the first plate-shaped member out of the plurality of plate-shaped members 21-25 is communicated with the inside of the first holes of the second plate-shaped member adjacent to the first plate-shaped member to hold the working fluid by applying capillary force to the working fluid in the liquid phase, and so that the opening faces of the second holes of the second plate-shaped member are arranged within the opening faces of the first holes of the first plate-shaped member to make the working fluid in the evaporated phase flow to the laminated direction.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供允许容易加工和稳定批量生产的热输送装置以及安装有热传输装置的电子设备。热交换装置包括：密封容器; 工作流体密封在密封容器内; 以及多个板状构件21-25，其各自具有第一开口面积的第一孔和具有比第一开口面积小的第二开口面积的第二孔。多个板状构件21-25层叠在密封容器内，使得多个板状构件21-25中的第一板状构件的第一孔的内部与所述第二板状构件的与所述第一板状构件相邻的第一孔，用于通过向所述液相中的所述工作流体施加毛细管力来保持所述工作流体，并且使得所述第二板状构件的所述第二板状构件的所述第二孔的开口面，在所述第一板状部件的第一孔的开口面内配置有成形体，使蒸发相的工作流体向层叠方向流动。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2007231763A Pump device and cooling apparatus 审中-公开
标题翻译：泵装置和冷却装置
公开(公告)号：JP2007231763A
公开(公告)日：2007-09-13
申请号：JP2006051917
申请日：2006-02-28
申请人： Sony Corp , ソニー株式会社
发明人： YAJIMA TAKASHI , HASHIMOTO MITSUO , KOMAMI TAKUYA , GOTO KAZUO , YOSHITAKA HIROYUKI
IPC分类号： F04B43/08 , F04B9/00 , F25D17/00 , F25D17/02 , F28D15/02
摘要： PROBLEM TO BE SOLVED: To provide a pump device capable of keeping airtightness high and stably and efficiently pressure-feeding fluid and to provide a cooling apparatus equipped with the pump device. SOLUTION: The pump device 10 has, in a housing 1 connected to a pipe 20 through which the fluid can flow, a check valve 6, a movable body 2, a bellows supported at opposite ends by check valve 6 and the movable body 2, and a coil spring 5 supporting the movable body 2 and the bellows 8 on an inner wall of the housing 1. The movable body 2 is provided with a magnet 4 and a check valve 7. A coil 3 is provided on an outer periphery of the housing 1 for reciprocating the movable body 2 including the magnet 4 in a flow direction of the fluid. When the bellows 8 is expanded through reciprocation of the movable body 2, pressure in the bellows is decreased and the fluid flows in from the pipe 20 through an opening portion 1b and the check valve 6. When the bellows is constricted, the pressure in the bellows 8 is increased and the fluid flows out through the check valve 7 and an opening portion 1d. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够高密度地保持气密性并且稳定有效地进行加压的泵装置，并提供配备有该泵装置的冷却装置。解决方案：泵装置10在连接到流体可以流过的管20的壳体1中具有止回阀6，可移动体2，在止动阀6的相对端处支撑的波纹管和可移动的主体2和支撑在壳体1的内壁上的可移动体2和波纹管8的螺旋弹簧5.可移动体2设置有磁体4和止回阀7.线圈3设置在外部壳体1的周边，用于沿着流体的流动方向使包括磁体4的可移动体2往复运动。当波纹管8通过可移动体2的往复运动而膨胀时，波纹管中的压力降低，并且流体通过开口部分1b和止回阀6从管道20流入。当波纹管收缩时，波纹管8增加，流体通过止回阀7和开口部分1d流出。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2006275302A Heat transportation device and electronic device 审中-公开
标题翻译：热运输设备和电子设备
公开(公告)号：JP2006275302A
公开(公告)日：2006-10-12
申请号：JP2005090511
申请日：2005-03-28
申请人： Sony Corp , ソニー株式会社
发明人： HASHIMOTO MITSUO , OMI MOTOSUKE , YAJIMA TAKASHI , NAGAI HIROYUKI , KATOU GOUSAKU
IPC分类号： F28D15/02 , H01L23/427
摘要： PROBLEM TO BE SOLVED: To provide desired heat transportation capability even at any attitude. SOLUTION: Even when an evaporator is arranged below a condenser and heat load is not applied to the evaporator, working fluid 19 is held by capillary tube force of a channel 14a in the condenser as shown in Fig. 6 (B) to prevent the working fluid 19 from flowing out onto an evaporator side. Consequently, only liquid phase working fluid exists in a liquid phase tube always. As a result, it is possible to prevent running-out of liquid or drying-out when the heat transportation device operates to obtain desired heat transportation capability. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：即使在任何姿态下也能提供期望的热输送能力。解决方案：即使当蒸发器布置在冷凝器下方并且热负荷未被施加到蒸发器时，如图1所示，工作流体19通过冷凝器中的通道14a的毛细管力保持。 6（B）以防止工作流体19流出到蒸发器侧。因此，只有液相工作流体总是存在于液相管中。结果，当热运输装置工作以获得期望的热运输能力时，可以防止液体流出或干燥。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2005259747A Heat transport apparatus and electronic device 审中-公开
标题翻译：热运输设备和电子设备
公开(公告)号：JP2005259747A
公开(公告)日：2005-09-22
申请号：JP2004065267
申请日：2004-03-09
申请人： Sony Corp , ソニー株式会社
发明人： OMI MOTOSUKE , SOTOZAKI MINEHIRO , KATOU GOUSAKU , YAJIMA TAKASHI
IPC分类号： F28D15/02 , H01L23/473
摘要： PROBLEM TO BE SOLVED: To provide a heat transport apparatus capable of maintaining desired performance of the heat transport apparatus and an electronic device with the apparatus mounted.
SOLUTION: The heat transport apparatus 1 includes bellows 6 for suppressing an increase in pressure of flow paths P1-P4. Thus, when the heat transport apparatus 1 is used for a long time for example and the pressure in the flow paths P1-P4 increases, the bellows 6 are activated to reduce the pressure in the flow paths P1-P4 to suppress the increase in pressure of the flow paths P1-P4. Therefore, the heat transport apparatus 1 can be stably operated for a long time.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够保持热输送装置的期望性能的热输送装置和安装有该装置的电子装置。解决方案：传热装置1包括用于抑制流路P1-P4的压力增加的波纹管6。因此，当长时间使用传热装置1并且流路P1-P4中的压力增加时，波纹管6被启动以减小流路P1-P4中的压力以抑制压力的增加的流路P1-P4。因此，热输送装置1能够长时间稳定地运转。版权所有（C）2005，JPO＆NCIPI

8. 发明专利

JP2010169379A Method of manufacturing thermal transport device, and thermal transport device 审中-公开
标题翻译：制造热运输装置的方法和热运输装置
公开(公告)号：JP2010169379A
公开(公告)日：2010-08-05
申请号：JP2009127374
申请日：2009-05-27
申请人： Sony Chemical & Information Device Corp , Sony Corp , ソニーケミカル&インフォメーションデバイス株式会社 , ソニー株式会社
发明人： YOSHITAKA HIROYUKI , YAJIMA TAKASHI , ONIKI KAZUNAO , KASAI HIROTO , HIRATA TAKASHI , HASHIMOTO MITSUO
IPC分类号： F28D15/02 , B23K20/00 , B23K20/26 , B23K101/14 , H01L23/427
CPC分类号： F28D15/046 , B23K20/02 , B23K20/16 , B23K2201/14 , F28D15/0233 , F28D15/0283 , H01L2924/0002 , Y10T29/49393 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing an inexpensive thermal transport device which is efficiently manufactured in the small number of processes. SOLUTION: In the method of manufacturing the thermal transport device, a capillary member 5 with its thickness thicker than that of a frame member 2 is placed on an inner surface 11 of a lower plate member 1. Then, the frame member 2 is placed on the inner surface 11 of the lower plate member 1, and an upper plate member 3 is placed on the capillary member 5. A crushing amount G is provided between the frame member 2 and the upper plate member 3 based on difference between thickness of the capillary member 5 and thickness of the frame member 2. The lower plate member 1 is diffusion-joined to the frame member 2, and the upper plate member 3 is diffusion-joined to the frame member 2. Then, the capillary member 5 is compressed by the crushing amount G. As the capillary member 5 has elasticity, a part of pressure P is absorbed, and pressure P' smaller than the pressure P is applied on the lower plate member 1 from the capillary member 5. The inner surface 11 of the lower plate member 1 and the capillary member 5 are diffusion-joined by the pressure P'. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造廉价的热输送装置的方法，该方法以少量的工艺被有效地制造。解决方案：在制造热传输装置的方法中，将厚度比框架构件2的厚度的毛细管构件5放置在下板构件1的内表面11上。然后，框架构件2 被放置在下板构件1的内表面11上，并且上板构件3被放置在毛细构件5上。基于厚度之间的差异，在框架构件2和上板构件3之间设置破碎量G 毛细构件5的厚度和框架构件2的厚度。下板构件1扩散接合到框架构件2，并且上板构件3被扩散接合到框架构件2.然后，毛细构件5 通过粉碎量G被压缩。由于毛细管构件5具有弹性，吸收一部分压力P，并且从毛细管构件5向下板构件1施加小于压力P的压力P'。内表面 11的下板构件1 并且毛细管构件5通过压力P'扩散接合。版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2010151353A Heat transport device, electronic apparatus, and method of manufacturing heat transport device 有权
标题翻译：热输送装置，电子装置及制造热输送装置的方法
公开(公告)号：JP2010151353A
公开(公告)日：2010-07-08
申请号：JP2008328870
申请日：2008-12-24
申请人： Sony Corp , ソニー株式会社
发明人： ONIKI KAZUNAO , YAJIMA TAKASHI , GOTO KAZUO
IPC分类号： F28D15/02 , H01L23/427 , H05K7/20
CPC分类号： H05K7/20336 , B21D53/02 , F28D15/046 , H01L23/427 , H01L2924/0002 , Y10T29/49353 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a technology of a heat transport device or the like having high heat transport performance. SOLUTION: The heat transport device 10 has a container 1, and a gas phase passage 11 and a liquid phase passage 12 provided in the container 1. The liquid phase passage 12 is formed by laminating an upper layer mesh member 21 and a lower layer mesh member 22. A first wire 16 forming the upper layer mesh member is arranged in a direction inclined by a predetermined angle θ with respect to a y-axis, and a second wire 17 is arranged in a direction inclined by a predetermined angle θ with respect to an x-axis. A third wire 18 forming the lower layer mesh member 22 is arranged in the y-axis direction, and a fourth wire 19 is arranged in the x-axis direction. The respective mesh members 21, 22 can thereby be prevented from overlapping each other to secure a sufficient passage for an operating fluid to flow through. The heat transport performance of the heat transport device 10 can thereby improved. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供具有高传热性能的传热装置等的技术。解决方案：传热装置10具有容器1和设置在容器1中的气相通道11和液相通道12.液相通道12通过层叠上层网状构件21和形成上层网状构件的第一线16相对于y轴倾斜规定角度θ的方向配置，第二线17沿倾斜规定角度的方向配置 θ相对于x轴。形成下层网状构件22的第三线18沿y轴方向配置，在x轴方向上配置第四线19。因此可以防止各网眼构件21,22彼此重叠以确保工作流体流过的足够的通道。因此，能够提高热输送装置10的热输送性能。版权所有（C）2010，JPO＆INPIT

10. 发明专利

JP2010019495A Heat transport device, electronic apparatus, sealing apparatus, sealing method and method of manufacturing heat transport device 有权
标题翻译：热输送装置，电子装置，密封装置，密封方法及制造热交换装置的方法
公开(公告)号：JP2010019495A
公开(公告)日：2010-01-28
申请号：JP2008180763
申请日：2008-07-10
申请人： Sony Corp , ソニー株式会社
发明人： YAJIMA TAKASHI , YOSHITAKA HIROYUKI , GOTO KAZUO
IPC分类号： F28D15/02 , H01L23/427 , H05K7/20
CPC分类号： F16J15/0881 , F28D15/0233 , F28D15/0283 , F28D15/046 , G06F1/203 , G06F2200/201 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a cooling device capable of preventing projections when an inlet to which working fluid is injected is sealed and of improving reliability of inside airtightness and a technique related to the cooling device.
SOLUTION: The cooling device 100 is formed by joining a plurality of substrates 1-6 by e.g. diffusion joining. An end of the upper substrate 1 has the inlet 11 to which the working fluid is injected, and the solid substrate 3 has an abutment part 15 arranged below the inlet 11. After the working fluid is injected to the inlet 11, the inlet 11 is pressed by a tip of an ejecting member 60 of an injecting device 400 and is sealed by abutment of the abutment member 15. Thus, this structure prevents projections. Since thermoplastic metal such as solder is not used for sealing the inlet 11, for example, this structure prevents melting of thermoplastic metal due to heat in a reflow process etc., so as to improve reliability with respect to the airtightness inside the cooling device 100.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种当注入工作流体的入口被密封并且提高内部气密性的可靠性以及与冷却装置有关的技术时能够防止突起的冷却装置。解决方案：冷却装置100通过例如连接多个基板1-6而形成。扩散接合。上基板1的端部具有注入工作流体的入口11，并且固体基板3具有布置在入口11下方的抵接部15.在将工作流体注入入口11之后，入口11为被喷射装置400的喷射构件60的尖端挤压，并且通过邻接构件15的邻接而被密封。因此，该结构防止突起。由于诸如焊料的热塑性金属不用于密封入口11，例如，这种结构防止了回流工艺等中的热量引起的热塑性金属的熔化，从而提高了与冷却装置100内部的气密性相关的可靠性。版权所有（C）2010，JPO＆INPIT

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