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1. 发明专利

JP2003115560A SEMICONDUCTOR DEVICE, LAMINATED SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF LAMINATED SEMICONDUCTOR DEVICE 审中-公开
公开(公告)号：JP2003115560A
公开(公告)日：2003-04-18
申请号：JP2002005836
申请日：2002-01-15
申请人： SONY CORP
发明人： KOIKE TOSHIHIKO , HONDA MANABU , KATO MASUO
IPC分类号： H01L23/12 , H01B1/22 , H01L21/56 , H01L23/31 , H01L23/498 , H01L25/065 , H01L25/10 , H01L25/11 , H01L25/18 , H05K1/09 , H05K3/40
摘要： PROBLEM TO BE SOLVED: To make thin a semiconductor device and a laminated semiconductor device. SOLUTION: A semiconductor device 1 is equipped with a substrate 2 having electrodes 7 and 8 for connecting substrates that are formed on both the front and back and are connected by a through hole 9, a semiconductor chip 3 where an electrode that is connected to a wiring pattern formed on the substrate is provided and a surface opposite to a surface where the electrode is formed is cut flat, a bump 4 for connecting substrates that is provided on the electrode for connecting substrates of the substrates and has a surface that is opposite to the substrate and is cut flat, and resin 5 for sealing that is provided on the substrate seals the semiconductor chip and the bump for connecting substrates, and at the same time, has the surface that is opposite to the substrate and is cut flat. In this case, a cutting plane 3a of the semiconductor chip, a cutting plane 4a of the bump for connecting the substrates, and a cutting plane 5a of the resin for sealing are made to be positioned in the same plane, and the semiconductor chip and the bump for connecting substrates are sealed in the resin for sealing those other than the cutting plane.

2. 发明专利

JP2003008178A Manufacturing method of printed wiring board 审中-公开
标题翻译：印刷线路板的制造方法
公开(公告)号：JP2003008178A
公开(公告)日：2003-01-10
申请号：JP2001190933
申请日：2001-06-25
申请人： Sony Corp , ソニー株式会社
发明人： NISHIMOTO KAZUTO , NAKADA MASAKAZU , HONDA MANABU
IPC分类号： H05K1/11 , H05K3/10 , H05K3/12 , H05K3/22 , H05K3/40
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed wiring board with high reliability at low cost by making a clear pattern transfer on an insulating layer on the board an filling the precessed circuit form, which indicates the transferred wiring, with conductive paste without using injection molding or transfer molding.
SOLUTION: Insulating layers 4 and 5 are formed on both faces of a board 3, and convex boards 1 and 2 with a projected circuit form according to the printed wiring are prepared. The convex boards onto the insulating layers 4 and 5 to form a recessed circuit form 6 for forming a printed wiring. The circuit form (groove) 6 and a through hole 7 penetrating the board are formed and filled with conductive paste 8, and the conductive paste 8 is hardened. Then, the hardened conductive paste 8 on both faces of the board 3 and on the projected circuit form 6 is ground in a grinding step to expose the surface of the insulating layer.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：通过在板上的绝缘层上形成透明图案转印来提供具有高可靠性的印刷电路板的制造方法，该电路板用导电浆料填充表示转移布线的进给电路形式而不使用注塑或传递模塑。解决方案：制备绝缘层4和5，形成在板3的两个面上，并且制备具有根据印刷布线的投影电路形式的凸板1和2。凸形板到绝缘层4和5上，以形成用于形成印刷线路的凹陷电路形式6。形成电路形式（沟槽）6和穿透基板的通孔7，并填充有导电膏8，导电膏8硬化。然后，在研磨步骤中研磨板3的两面和突出的电路形式6的硬化的导电浆料8，以露出绝缘层的表面。

3. 发明专利

JP2002373916A Mounting method for semiconductor device 有权
标题翻译：半导体器件的安装方法
公开(公告)号：JP2002373916A
公开(公告)日：2002-12-26
申请号：JP2001178262
申请日：2001-06-13
申请人： Sony Corp , ソニー株式会社
发明人： NAKADA MASAKAZU , HONDA MANABU , NISHIMOTO KAZUTO
IPC分类号： H01L21/60 , H01L21/56
CPC分类号： H01L2224/1134 , H01L2224/16 , H01L2224/16237 , H01L2224/45144 , H01L2924/01078 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device mounting method for connecting a semiconductor device to wiring on a substrate.
SOLUTION: This mounting method is provided with the process of providing a hole 7 on the wiring 4 formed on the substrate 2, the process of filling conductive paste 5 in the hole 7, and the process of inserting the bump electrode 3 of the semiconductor device 1 to the hole 7 filled with the paste 5 and connecting it. In the mounting method, since the conductive paste 5 is filled in the hole 7 formed on the substrate wiring 4 without directly transferring the conductive paste to the bump electrode 3, the conductive paste 5 is inserted to the hole 7 for a more appropriate amount. Also, since the conductive paste 5 wraps the electrode 3, the possibility of the connection defect of the electrode (bump electrode 3) of the semiconductor device 1 and the wiring 4 on the substrate 2 is accurately suppressed.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供一种用于将半导体器件连接到衬底上的布线的高可靠性的半导体器件安装方法。解决方案：该安装方法具有在形成在基板2上的布线4上设置孔7的过程，将导电浆料5填充到孔7中的过程以及将半导体器件的凸起电极3插入 1到填充有浆料5的孔7并将其连接。在安装方法中，由于导电浆料5填充在形成于基板配线4上的孔7中，而是不将导电膏直接转印到凸块电极3，所以导电浆料5以更适当的量插入到孔7中。此外，由于导电膏5包裹电极3，所以可以准确地抑制半导体器件1的电极（凸块电极3）和基板2上的布线4的连接缺陷的可能性。

4. 发明专利

JP2001005815A DATA BASE 失效
公开(公告)号：JP2001005815A
公开(公告)日：2001-01-12
申请号：JP17100799
申请日：1999-06-17
申请人： SONY CORP
发明人： MORITA YUKI , HONDA MANABU
IPC分类号： G06F17/30
摘要： PROBLEM TO BE SOLVED: To reduce an entire data amount corresponding to the number of pieces of data to be handled and to shorten time for retrieval or to reduce a maintenance work quantity. SOLUTION: Concerning this data base, a section name table 120A stores respective section names corresponding to a first divided main key composed of leading five digits of each job code. A charged job table 120B stores respective charged jobs corresponding to a second divided main key composed of middle three digits of each job code. A detailed job table 120C stores respective detailed jobs corresponding to a third divided main key composed of following three digits of each job code. When retrieving data, the main key of 11 digits inputted by an operator is divided into the divided main keys of leading five digits, middle three digits and following three digits and retrieval is performed for each of respective tables 120A, 120B and 120C while using the respective divided main keys. Then, data retrieved from the respective tables 120A, 120B and 120C are coupled and outputted as the retrieved result.

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