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    • 8. 发明专利
    • SEPARATING METHOD FOR TOP TAPE FOR CARRIER TAPE
    • JPH09207964A
    • 1997-08-12
    • JP1355196
    • 1996-01-30
    • SHINETSU POLYMER CO
    • MIYAUCHI TSUTOMUSHIMOKOSHI TSUTOMU
    • B65D73/02B65B15/04
    • PROBLEM TO BE SOLVED: To prevent a carrier tape from being cut or delaminated even when the peeling strength of the sealed part is increased, and perform a stable peeling by a method wherein in front of a peeling utensil to peel a top tape, a slit is put at both internal sides of a both-edge sealed part, and only the central part of the top tape being divided into three, is taken up. SOLUTION: Before a top tape 2 is separated from an embossed carrier tape 1, in front of a utensil 12 for peeling, slits are put in parallel with the feeding direction of the carrier tape 1 by a slit blade 13 being provided inside of a sealed part 3 of both edges of the carrier tape 1 to place the top tape 2 under a state wherein the width can be divided into three, and the carrier tape 1 is advanced. By taking up only the central part of the top tape 2 which are divided into three in the feeding direction at the leading end of the utensil 12 for peeling, by a top tape taking up part 6, only the inside of the slits on both edges is peeled, and the sealed part 3 on both edges of the sealed part 3 are carried together with the carrier tape 1 without trouble by a pin roll 5 while not being broken or peeled.
    • 10. 发明专利
    • SURFACE MOUNTED ELECTRONIC COMPONENT CARRIER
    • JP2002104501A
    • 2002-04-10
    • JP2000299813
    • 2000-09-29
    • SHINETSU POLYMER CO
    • MIYAUCHI TSUTOMU
    • B65D73/02B65D85/86H01L23/00
    • PROBLEM TO BE SOLVED: To provide a surface mounted electronic component carrier which can prevent an electronic component received in an emboss by a contact-bonding region of a top cover tape from deforming, laterally rolling or rotating, by suppressing a deflection occurring after the top cover tape is thermally contact- bonded or contact-bonded with pressure applied to prevent failures in suction when taking out the component. SOLUTION: The carrier includes a carrier tape having a plurality of embosses for receiving electronic components and a top cover tape for sealing the components received in the embosses by thermal contact-bonding or contact- bonding with pressure applied to a surface of the carrier tape. Contact-bonding portions 6 of the top cover tape 4 are provided in the direction of the carrier tape 2 flowing along an opening rim 5 of the emboss. More preferably, they are provided intermittently between the adjacent embosses 13. Thus, top cover tapes 4 and 14 are thermally contact-bonded or contact-bonded with pressure applied to opening rims 5 and 15 of the embosses whereby the electronic components received in embosses 3 and 13 can be stably carried.