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1. 发明专利

JP2002299749A SEMICONDUCTOR LASER DEVICE AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JP2002299749A
公开(公告)日：2002-10-11
申请号：JP2001104727
申请日：2001-04-03
申请人： SHARP KK
发明人： ICHIKAWA HIDEKI , FUJIYOSHI MIKI
IPC分类号： B41J2/01 , H01S5/022
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor laser device having superior productivity, without affecting adverse influence from reflection of a side beam in a header to various characteristics of an optical pickup, and to provide a method for manufacturing the same. SOLUTION: An ink jet ink 4 for reflecting a side beam Ls2 , feeding back toward a sub-mount 3 side of two side beams Ls1 , Ls2 generated by (the reflection ± primary beam) and feeding back through an optical system is coated on a region of the front surface 31 of the sub-mount 3 which mounts a laser chip 2 for emitting a laser beam L, an emitting end face 21 of a laser chip 2, or the region extending over both the front surface 31 of the sub-mount 3 and emitting end face 21 of the chip 2.

2. 发明专利

JPH084096B2 失效
公开(公告)号：JPH084096B2
公开(公告)日：1996-01-17
申请号：JP14304694
申请日：1994-06-24
申请人： SHARP KK
发明人： ICHIKAWA HIDEKI
IPC分类号： H01L21/52

3. 发明专利

JPS62136829A DIE BONDING METHOD FOR OPTICAL SEMICONDUCTOR ELEMENT 失效
公开(公告)号：JPS62136829A
公开(公告)日：1987-06-19
申请号：JP27879885
申请日：1985-12-10
申请人： SHARP KK
发明人： SHIOMOTO TAKEHIRO , ICHIKAWA HIDEKI
IPC分类号： H01L21/52 , H01L21/58
摘要： PURPOSE:To simplify a process by a method wherein a foil-shaped solder material is formed by an evaporation to a plate, the foil-shaped solder material is separated from the plate and stuck to a heat sink and an optical semiconductor element is die-bonded onto the foil-shaped solder material. CONSTITUTION:A foil-shaped solder material 11, such as In, Sn, etc. is shaped by an evaporation to a Teflon sheet 4. The foil-shaped solder material 11 is separated from the Teflon sheet 4, and stuck onto a die bonding surface for a heat sink 2, and an optical semiconductor element 3 is die-bonded onto the foil-shaped solder material 11. Accordingly, the foil-shaped solder material 11, which is hardly oxidized and has an excellent surface state and uniform thickness, can be acquired, and the size and position of die-bonding of the optical semiconductor element are changed easily, thus simplifying processes.

4. 发明专利

JPH09307180A SEMICONDUCTOR LASER DEVICE 失效
公开(公告)号：JPH09307180A
公开(公告)日：1997-11-28
申请号：JP12008496
申请日：1996-05-15
申请人： SHARP KK
发明人： ICHIKAWA HIDEKI , YAO KAZUYUKI
IPC分类号： H01S5/00 , H01S3/18
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor laser device capable of suppressing the stray light quantity by extremely reducing a reflection of laser beams inside a cap. SOLUTION: A semiconductor laser device 10 is structured that a semiconductor laser element 13 and a signal reading element for reading modulated lights from the outside are mounted onto a stem 11, and also a cap 19 is fitted on the stem 11 so as to cover this semiconductor laser element 13, etc. In this embodiment, a bonding wire tape 25 is arranged on a rear face side of the semiconductor laser element 13, and the stray light quantity of laser beams emitted from the rear face side of the semiconductor laser element 13 is suppressed by this bonding wire tape 25.

5. 发明专利

JP2001267674A SEMICONDUCTOR LASER DEVICE AND WIRE BONDING METHOD THEREOF 失效
公开(公告)号：JP2001267674A
公开(公告)日：2001-09-28
申请号：JP2000070223
申请日：2000-03-14
申请人： SHARP KK
发明人： ICHIKAWA HIDEKI , OKANISHI MAMORU , SANTO TERUMITSU , YOSHIDA TOMOHIKO
IPC分类号： H01L21/60 , H01S5/02 , H01S5/022 , H01S5/026 , H01S5/40
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor laser device and its wire bonding method where two semiconductor laser elements and a monitor PD are easily mounted in a mall package as well as a manufacturing process is simplified with a simple configuration. SOLUTION: There are provided a stem 100 comprising a plurality of lead 121-124, a sub-mount 160 die-bonded on the stem 100 with a monitor PD 140 integrally formed on its surface, and two semiconductor laser elements 131 and 132, die-bonded on the sub-mount 160 and mounting emitted light with the monitor PD 140. A first bonding surface (anode electrode 183) of the monitor PD 140 is wire-bonded to a second bonding surface (end surface 123a) of the lead pin 123 almost perpendicular to the first bonding surface.

6. 发明专利

JP2000113486A SEMICONDUCTOR LASER DEVICE 失效
公开(公告)号：JP2000113486A
公开(公告)日：2000-04-21
申请号：JP27677998
申请日：1998-09-30
申请人： SHARP KK
发明人： ICHIKAWA HIDEKI
IPC分类号： G11B7/125 , H01S5/022
摘要： PROBLEM TO BE SOLVED: To prolong the aging life of a laser chip by reflecting the laser beams emitted from both laser chips by a mirror which is formed to a triangular prism shape of a rectangular isosceles triangle and is arranged between both laser chips and maintaining the optical axes of both reflected light beams in nearly parallel. SOLUTION: A system having a block 17 mounted with the red laser chip 1 and a block 18 mounted with the IR laser chip 2 is used. A 45 deg. mirror 14 is arranged between the blocks 17 and 18. A contact probe is brought into contact with the IR laser chip 2 and a sub-mount 4-2 to emit the IR laser. The optical axis of the IR laser beam 15 which is reflected and bent by the reflection surface of the 45 deg. mirror 14 is determined by image processing with a CCD camera. The red laser chip 1 is die bonded with good accuracy to the flank of the block 18 in such a manner that the optical axis of the red laser beam 16 is made incident at the distance within 100 μm with respect to the optical axis of the IR laser beam 15. The heat of the laser chips is efficiently released by using the 45 deg. mirror.

7. 发明专利

JPH0818151A SEMICONDUCTOR LASER 失效
公开(公告)号：JPH0818151A
公开(公告)日：1996-01-19
申请号：JP14913794
申请日：1994-06-30
申请人： SHARP KK
发明人： OGAWA MASARU , YAO KAZUYUKI , ICHIKAWA HIDEKI , MASUI KATSUSHIGE
IPC分类号： H01S5/00 , H01S5/02 , H01S5/026 , H01S3/18
摘要： PURPOSE:To realize a semiconductor laser in which the operation for changing the approaching direction of a capillary is eliminated at the time of wire bonding work and the output of light receiving element is increased while reducing the overall size. CONSTITUTION:A monitor light emitted from a semiconductor laser chip 5 is received by a light receiving element 6 on the side face intersecting the carrier diffusion face perpendicularly. The semiconductor laser chip 5 is mounted on the same side as the light receiving element 6 and the carrier diffusion layer thereof is provided as deep as 10mum or more. The light receiving element is die bonded, on the carrier diffusion layer side thereof, to the mounting face. In this structure, the carrier diffusion layer of the light receiving element is provided deeper than the distance between the semiconductor laser chip mounting face and the emission point.

8. 发明专利

JPH07142813A SEMICONDUCTOR LASER DEVICE 失效
公开(公告)号：JPH07142813A
公开(公告)日：1995-06-02
申请号：JP28527393
申请日：1993-11-15
申请人： SHARP KK
发明人： MASUI KATSUSHIGE , YAO KAZUYUKI , ICHIKAWA HIDEKI
IPC分类号： G11B7/125 , H01S5/00 , H01S5/022 , H01S3/18
摘要： PURPOSE:To provide a semiconductor laser device such that the space in which a semiconductor laser chip is mounted is prevented from dewing. CONSTITUTION:A ventilation hole 1 is made in a stem base 21 which surrounds a space A in which a semiconductor laser chip 23 is mounted. Further, the space A inside a cap 26 communicates with an external space by the ventilation hole 1. Therefore, humidity in the space A is discharged to the outside through the hole 1.

9. 发明专利

JPH0722711A METHOD FOR COATING SEMICONDUCTOR LASER DEVICE WITH RESIN 失效
公开(公告)号：JPH0722711A
公开(公告)日：1995-01-24
申请号：JP16551993
申请日：1993-07-05
申请人： SHARP KK
发明人： ICHIKAWA HIDEKI , TAKEGAWA HIROSHI
IPC分类号： H01L21/56 , H01L31/0203 , H01L31/12 , H01S5/00 , H01S5/022 , H01S3/18
摘要： PURPOSE:To provide a method for resin coating which can thinly and uniformly coat the surface of a semiconductor laser chip with resin and a photodiode chip which can constitute a semiconductor laser device. CONSTITUTION:A semiconductor laser device 3 (stem 8) is mounted to a rotary stand 1 while a laser beam irradiation window 7A at the top of a cap 7 is directed upward. After resin 6 is dripped on chips 5, 4A, and 4B in the cap 7 through the window 7A, the rotary stand 1 is rotated around the shaft in nearly vertical direction, thus enabling a remaining part 6A out of the dripped resin 6 to flow along the inner wall of the cap 7.

10. 发明专利

JPH0714857A SEMICONDUCTOR CHIP MOUNTING METHOD 失效
公开(公告)号：JPH0714857A
公开(公告)日：1995-01-17
申请号：JP14304694
申请日：1994-06-24
申请人： SHARP KK
发明人： ICHIKAWA HIDEKI
IPC分类号： H01L21/52
摘要： PURPOSE:To provide a semiconductor chip mounting method with which the surface of bonding can be hardened completely and mounting operation can be conducted in a highly reliable manner when the semiconductor chip is fixed by adhesion using an ultraviolet ray hardening resin bonding agent. CONSTITUTION:The mounting method is composed of a process in which a semiconductor chip 6, on which an insulating supporting material 2 consisting of glass or polyethylene terephthalate is adhered to the bottom face, is provided in advance and the insulative supporting material 2 of the chip 6 is arranged opponsing to the surface of mounting, and a process in which an ultraviolet ray hardening resin bonding agent 4 is hardened by projecting ultraviolet rays from the circumference of the semiconductor chip 6.

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