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1. 发明专利

JP2002294359A METAL-MATRIX CARBON-FIBER-REINFORCED COMPOSITE MATERIAL AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JP2002294359A
公开(公告)日：2002-10-09
申请号：JP2001135551
申请日：2001-03-29
申请人： AM TECHNOLOGY KK , JAPAN SCIENCE & TECH CORP , OCHIAI SHOJIRO , SENTAN ZAIRYO KK
发明人： SUZUKI NOBUYUKI , TSUSHIMA EIKI , OCHIAI SHOJIRO
IPC分类号： B22D19/00 , B22D19/14 , C22C1/10 , C22C47/06 , C22C49/02 , C22C49/04 , C22C49/06 , C22C49/14 , C22C101/04 , C22C101/06 , C22C101/10 , C22C101/14 , C22C101/18
摘要： PROBLEM TO BE SOLVED: To solve the conventional problem that direct reaction between metal and carbon fiber in a metal-matrix carbon-fiber-reinforced composite material causes the deterioration of the carbon fiber and the expected characteristics, such as strength, Young's modulus, high thermal conductivity and low thermal expansion, cannot be exhibited and to find the various characteristics of the metal-matrix carbon-fiber-reinforced composite material and to provide the material having excellent weatherability and heat resistance by suppressing the above reaction. SOLUTION: In manufacturing the carbon-fiber compact, an organic precursor which remains in the form of carbon on firing in a nonoxidizing atmosphere is used as a binder so that the resultant residual carbon can be interposed later between the molten metal and the carbon fiber to prevent the direct reaction. Deterioration in strength of the carbon fiber can be prevented. In the method for manufacturing the metal-matrix carbon-fiber-reinforced composite material, composing with the metal is performed by pressing the molten metal into the carbon compact under high pressure.

2. 发明专利

JP2000203973A CARBON-BASE METAL COMPOSITE MATERIAL AND ITS PRODUCTION 失效
公开(公告)号：JP2000203973A
公开(公告)日：2000-07-25
申请号：JP32182899
申请日：1999-11-11
申请人： SENTAN ZAIRYO KK , AM TECHNOLOGY KK
发明人： KAWAMURA NORIAKI , TSUSHIMA EIKI , SUZUKI NOBUYUKI
IPC分类号： C04B41/88
摘要： PROBLEM TO BE SOLVED: To improve defects of a carbon material such as brittleness, insufficient strength, easy oxidizability, inferior scuffing resistance and low surface workability and to obtain a carbon material having an enhanced heat conductivity and a coefficient of thermal expansion adjusted according to the purpose of use. SOLUTION: A molten metal is pressurized and impregnated into a carbon molding with the pressing member of a pressure device to produce the objective carbon-base metal composite material. The temperature of the molten metal is higher than the melting point of the metal by 50-250 deg.C and pressure applied to the molten metal is >=200 kg/cm2 per unit cross-sectional area of the pressing member. The carbon-base metal composite material consists of a carbonaceous matrix and the metal dispersed in the matrix, >=90 vol.% of the pores in the matrix have been substituted by the metal and the metal content of the composite material is

3. 发明专利

JP2001118960A CARBON-BASED METAL COMPOSITE MATERIAL BOARD WITH ELECTRIC INSULATING FILM 失效
公开(公告)号：JP2001118960A
公开(公告)日：2001-04-27
申请号：JP29355399
申请日：1999-10-15
申请人： SENTAN ZAIRYO KK
发明人： KAWAMURA NORIAKI , TSUSHIMA EIKI
IPC分类号： B05D5/12 , C01B31/00 , C22C1/05 , H01L23/14 , H01L23/373
摘要： PROBLEM TO BE SOLVED: To obtain an electronic board device which is high in thermal conductivity by a method wherein an electric insulating film of ceramic or plastic is formed on a carbon-based metal composite material board, and an electronic circuit is provided to the electric insulating film, where the carbon-based metal composite material board is nearly equal to metal in thermal condcutivity and electrically conductive and whose thermal expansion coefficient is as small as that of a ceramic and Young's modulus is small, a ceramic insulating board is bonded to the carbon-based metal composite material board with metal brazing material to serve as a board device in a usual method, but the above board device is low in thermal condcutivity due to the fact that the ceramic insulating board and metal brazing material are high in thermal resistance. SOLUTION: An electric insulating film of ceramic or plastic is formed direct on a carbon-based metal composite material board taking advantage of the fact that Young's modulus of the composite material board is low. An electronic circuit is provided on the electric insulating film, by which an electronic board device of high thermal conductivity can be manufactured.

4. 发明专利

JP2001007265A SUBSTRATE WITH COOLING DEVICE AND PREPARATION THEREOF 失效
公开(公告)号：JP2001007265A
公开(公告)日：2001-01-12
申请号：JP17489599
申请日：1999-06-22
申请人： SENTAN ZAIRYO KK
发明人： KAWAMURA NORIAKI , TSUSHIMA EIKI
IPC分类号： B22D19/00 , B22D19/14 , H01L23/373 , H01L23/473 , H05K7/20
摘要： PROBLEM TO BE SOLVED: To improve cooling capacity by integrating a composite material substrate, consisting of ceramic with a low thermal coefficient of expansion and metal, or a carbon material and metal, and a cooling device with metal. SOLUTION: Two substrates of a preform 5 made of a composite material are manufactured, and a semicircular groove is cut to each preform substrate. A stainless steel pipe 7, that is shaped to the groove in advance is pinched by the two preform substrates for tentative locking which is installed in a mold and aluminum molten metal, is poured for casting, subjected to cooling, then cutting machining is made to form parts, thus completely filling aluminum in the gap of a preform 5, filling the area between the stainless steel pipe 7 and the substrate with aluminum without gaps for integration. Therefore, the thermal coefficient of expansion of a substrate surface is 5×10-6/ deg.C, which is close to that of silicon, alumina, and aluminum nitride to be jointed to the substrate surface. The substrate has a thermal conductivity of 200 W/m.K and can be used as a substrate.

5. 发明专利

JP2001058255A CARBON BASE METAL COMPOSITE MATERIAL FORMED BOARD AND PRODUCTION THEREOF 失效
公开(公告)号：JP2001058255A
公开(公告)日：2001-03-06
申请号：JP2000149848
申请日：2000-05-17
申请人： SENTAN ZAIRYO KK
发明人： KAWAMURA NORIAKI , TSUSHIMA EIKI
IPC分类号： B22D18/02 , B22D19/00 , B22D19/14 , B22D27/09 , C22C1/10 , C22C47/12 , H01L23/14 , H01L23/373 , H05K1/05
摘要： PROBLEM TO BE SOLVED: To provide a carbon base metal composite material formed board having >=150 W/(m.K) thermal conductivity, 4×10-6/ deg.C-12×10-6/ deg.C thermal expansion coefficient and

6. 发明专利

JPH10233475A COMPOSITE MATERIAL CONSISTING OF SILICON WAFER AND CARBON MATERIAL 失效
公开(公告)号：JPH10233475A
公开(公告)日：1998-09-02
申请号：JP36367997
申请日：1997-12-16
申请人： SENTAN ZAIRYO KK
发明人： KAWAMURA NORIAKI , TSUSHIMA EIKI
IPC分类号： C04B37/00 , C04B37/02 , H01L21/02 , H01L23/373
摘要： PROBLEM TO BE SOLVED: To prevent a defect, such as peeling and a crack, from being generated in a composite material to a thermal shock or the like in a semiconductor package manufacturing process and at the time of the use of a semiconductor package by a method wherein the composite material is formed into a structure wherein a flat plate consisting of a thermal stress relaxation carbon material is provided on the surface on one side of the surfaces of a silicon wafer or a compound semiconductor wafer via an adhesion layer. SOLUTION: A composite material is formed into a structure wherein a flat plate 3, which is sliced and is made of a thermal stress relaxation carbon material consisting of a carbon material, is bonded to the rear of a silicon wafer or a compound semiconductor wafer 1 prior to a pelletizing process via an adhesion layer. It is preferable that the thickness of the relaxation carbon material is 0.1 to 1.0mm so that the relaxation carbon material can fulfill the thermal stress relaxation function from the viewpoint of heat conductivity. Thereby, the thermal stress generated in the composite material, which consists of the silicon wafer 1 and the flat plate 3 consisting of the carbon material, is so low that it can be ignored even if a temperature rise due to the heat generation of a semiconductor element is generated and the composite material is never broken. Moreover, as the composite material rapidly dissipates heat, which is generated from the element, the flat plate 3 consisting of the relaxation carbon material and the element function, so to speak, as one body.

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