会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 5. 发明专利
    • ELECTROSTATIC LATENT IMAGE CARRYING MEMBER
    • JPH03223871A
    • 1991-10-02
    • JP2075890
    • 1990-01-30
    • SANYO ELECTRIC CO
    • NAGASHIMA TOMOMICHIMINAMI KOJIYAMAOKI TOSHIHIKOHIRATANI TOSHIHIKO
    • G03G5/08
    • PURPOSE:To obtain sharp images by providing an amorphous semiconductor layer of a p or n type between a transparent and a photoconductive layer and erasing a residual potential by the photovoltaic force generated at the junction of the photoconductive layer and the amorphous semiconductor layer of the p or n type. CONSTITUTION:Light transmits a transparent base 11 and the transparent electrode 12 and arrives at the photoconductive layer 14 constituting the photosensitive part when a light image is projected from the transparent base 11 side. Electrons and holes are formed in the photoconductive layer 14 by this light energy, by which the electrons and holes and electrified electric charges are negated and the electrostatic latent image is formed. Since this electrostatic latent image carrying member is small in bias potential and has the residual potential smaller than the residual potential of an ordinary photographic process, the photovoltaic force by the projected light is generated by the semiconductor junction of the photoconductive layer 14 and the amorphous semiconductor layer 13 of the p or n type. The residual potential is thus negated. The good image is obtd. in this way.
    • 7. 发明专利
    • PHOTOVOLTAIC DEVICE
    • JPH03125481A
    • 1991-05-28
    • JP26328289
    • 1989-10-09
    • SANYO ELECTRIC CO
    • MINAMI KOJIYAMACHI TOSHIHIKOIWAMOTO MASAYUKI
    • H01L31/04
    • PURPOSE:To utilize all incident light on a transparent substrate irrespective of wavelength by providing a photovoltaic structure in which the substrate is coated sequentially with a first layer having a relatively large average grain size and a second layer having a relatively small average grain size. CONSTITUTION:A transparent electrode 2 is composed of a first layer 21 of a large average grain size, and a second layer 22 of a small average grain size. Long-wavelength components and short-wavelength components of light are refracted and scattered by the first and second layers 21 and 22, respectively, and they travel long way in a photoelectric section 3. Therefore, most part of the light is absorbed in the photoelectric section, and therefore an improved efficiency of conversion is obtained. The transparent electrode 2, composed of SnO2, is formed in this way. A transparent substrate 1 is cleaned sufficiently and placed in a CVD device heated at a predetermined temperature. SnCl4.5H2O and HF are sprayed on the substrate 1 so that the transparent electrode is formed. The conditions may be the substrate temperature of 550 deg.C, the film thickness of 1.0mum, and grain size of 0.9mum for the first layer 21; the substrate temperature of 500 deg.C, the film thickness of 0.2mum, and grain size of 0.1mum for the second layer 22.
    • 9. 发明专利
    • METHOD OF FORMING SEMICONDUCTOR FILM
    • JPH02303119A
    • 1990-12-17
    • JP12490289
    • 1989-05-18
    • SANYO ELECTRIC CO
    • IWAMOTO MASAYUKIMINAMI KOJIWATANABE KANEO
    • H01L21/302H01L21/205H01L21/3065H01L31/04
    • PURPOSE:To simply and inexpensively form a thin semiconductor film of a large area by exposing a substrate formed with a metal layer of melted state with a plasma atmosphere of material gas containing a semiconductor material, and growing a semiconductor film on the substrate simultaneously upon removing the melted metal film by etching. CONSTITUTION:A substrate 1 deposited with Sn 2 is heated to 250 deg.C in a plasma reactor to the melted state of Sn 2, then evacuated in vacuum, SiH 4 is then introduced, a plasma is generated, and a film and an etching radical are generated. The film radical forms a plurality of insular Si fine crystals 3 on the melted Sn 2, the etching radical removes the amorphous component on the Si fine crystal 3 and a small amount of melted Sn 2 to reduce the melted Sn 2 in thickness. The grain size of the Si crystal 4 is gradually increased, the thickness of the Sn 2 is gradually decreased, the melted layer of the Sn 2 is entirely eliminated, the Si crystal layer 4 is stopped in the grain size simultaneously upon eliminating of the Sn 2 to be brought into contact with adjacent crystal. Thus, an Si polycrystal 5 of large grain size is formed.