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1. 发明专利

JPS5737969A Input-output head for information processor 失效
标题翻译：用于信息处理器的输入输出头
公开(公告)号：JPS5737969A
公开(公告)日：1982-03-02
申请号：JP11129480
申请日：1980-08-13
申请人： Ricoh Co Ltd
发明人： SAKURAI KOUICHI , TAKAMATSU YASUHIKO , YAMAGUCHI TAKAYUKI , SUGANO OSAMU , SONE KIYOSHI
IPC分类号： G06K7/10 , H01L27/146 , H04N1/024
CPC分类号： H04N1/024
摘要： PURPOSE:To contrive simplification and miniaturization of the structure, by constituting the input section with photodiodes and input elements and the output section with heating resistors and output elements, in input/output heads which perform input/output of information to facsimile equipment. CONSTITUTION:An output section 7 is constituted by arranging a layer 15 of a heating resistor formed with a film and plural output elements whose blocking diodes are formed with thin layers 17 and 18, on a substrate 14, and an input section 8 is constituted by arranging plural photodiodes formed by making hetero coupling on thin layers 22 and 23 and input elements whose controlling blocking diodes are formed with thin layers 25 and 26 on the substrate 14, and then this input/output head is formed by assembling the output section 7 and the input section 8. Because of this arrangement, the input/output equipment can easily be assembled. Moreover, the structure becomes firm and the durability is increased, and, in addi- tion to the above, the whole equipment can be miniaturized.
摘要翻译：目的：为了实现结构的简化和小型化，通过将输入部分与光电二极管和输入元件相结合，输出部分带有加热电阻和输出元件，在输入/输出头中输入/输出信息到传真设备。构成：输出部7通过在基板14上配置由膜形成的发热电阻体层15和阻挡二极管形成有薄层17,18的多个输出元件构成，输入部8由通过在薄层22和23上形成异质耦合形成的多个光电二极管和在基板14上形成有薄层25和26的控制阻挡二极管的输入元件，然后该输入/输出头通过组合输出部分7和输入部分8.由于这种布置，输入/输出设备可以容易地组装。此外，结构变得坚固，耐久性提高，除此之外，整个设备可以小型化。

2. 发明专利

JPS5929173A Thermal head 失效
标题翻译：热头
公开(公告)号：JPS5929173A
公开(公告)日：1984-02-16
申请号：JP13933582
申请日：1982-08-11
申请人： Ricoh Co Ltd
发明人： OOTA MASATOSHI , SUGANO OSAMU , TAKAMATSU YASUHIKO
IPC分类号： H01L49/00 , B41J2/335
CPC分类号： B41J2/335
摘要： PURPOSE:To obtain a thermal head made inexpensive by reducing the amount of gold to be used in high yield, by constituting the electrode of the thermal head from a laminate consisting of a chromium layer, a copper layer formed thereon by a vapor deposition method and a gold layer formed on said copper layer by a vapor deposition method. CONSTITUTION:A heat generating resistance layer 2 comprising a tantalum nitride layer 2 is formed on a ceramic substrate 1 having a glaze glass layer on the surface thereof in a pattern form and pattern electrode 10 is formed on the upper surface of the part of said heat generating resistance layer 2. This electrode 10 is formed of a three-layered structure consisting of a chromium layer with a thickness of 300-3,000Angstrom , a copper vapor deposition layer 12 with a thickness of 300Angstrom -3mum and a gold vapor deposition layer with a thickness of about 1,000Angstrom . In the next step, an oxidation inhibiting layer 7 comprising silicon dioxide or the like and an anti-wear layer 8 comprising tantalum peroxide or the like are applied to the exposed part of the heat generating resistance layer 2 and the end part of the electrode 10 adjacent thereto.
摘要翻译：目的：通过由铬层，通过气相沉积法形成的铜层和通过蒸镀法形成的铜层构成的层叠体构成热敏头的电极，得到以低成本降低黄金的成本的热敏头，通过气相沉积法在所述铜层上形成金层。构成：在其表面上具有釉料玻璃层的陶瓷基板1上形成有包含氮化钽层2的发热电阻层2，图案电极10形成在所述热量部分的上表面上该电极10由厚度为300〜300埃的铬层，厚度为300〜3微米的铜蒸镀层12和金蒸镀层构成的三层结构体形成，厚度约为1000安。在下一步骤中，将包含二氧化硅等的氧化抑制层7和包含过氧化钽等的抗磨层8施加到发热电阻层2的露出部分和电极10的端部相邻。

3. 发明专利

JPS5927539A Pad arranging method for ic chip 失效
标题翻译： IC芯片的贴片布置方法
公开(公告)号：JPS5927539A
公开(公告)日：1984-02-14
申请号：JP13694882
申请日：1982-08-05
申请人： Ricoh Co Ltd
发明人： SUGANO OSAMU , OOTA MASATOSHI , TAKAMATSU YASUHIKO
IPC分类号： H01L21/822 , H01L21/60 , H01L27/04
CPC分类号： H01L24/80 , H01L2924/14
摘要： PURPOSE:To readily mount an electronic device such as a thermal head or the like on an IC chip by continuously arranging driving and outputting pads along one side of the chip. CONSTITUTION:Driving and outputting pads O1-O32 are arranged in one row continuously along the up side of the surface of an IC chip 6, three ground pads GND1-GND3 are arranged along the left side, and three ground pads GND4- GND6 are arranged along the right side. The emitters of 32 output transistors are all connected to a common ground line in the IC chip, three pads are led out along the left side of the chip 6 from the common ground line, and three pads are led out along the right side from the common ground line, and the yield of bonding to the ground pads can be largely improved by employing the common ground.
摘要翻译：目的：通过沿着芯片的一侧连续布置驱动和输出焊盘，容易地将诸如热敏头等的电子设备安装在IC芯片上。构成：驱动和输出焊盘O1-O32沿着IC芯片6的表面的上侧连续排列成一行，沿着左侧布置三个接地焊盘GND1-GND3，并且布置三个接地焊盘GND4-GND6 沿着右边。 32个输出晶体管的发射极全部连接到IC芯片中的公共接地线，三个焊盘从芯片6的左侧从公共接地线引出，三个焊盘沿着右侧从公共地线，并且通过采用公共地，可以大大提高与接地焊盘的接合的产量。

4. 发明专利

JPS5927538A Arranging method for ic pad 失效
标题翻译： IC贴片安装方法
公开(公告)号：JPS5927538A
公开(公告)日：1984-02-14
申请号：JP13694782
申请日：1982-08-05
申请人： Ricoh Co Ltd
发明人： SUGANO OSAMU , OOTA MASATOSHI , YABUKI YOSHIROU
IPC分类号： H01L21/60
CPC分类号： H01L24/50 , H01L24/79 , H01L24/86 , H01L2924/01082 , H01L2924/14
摘要： PURPOSE:To improve the yield of an IC in bodning of a tape carrier system by disposing pads to be formed along opposite sides in not opposite positional relationship. CONSTITUTION:In an IC chip 10 having pads 11-1-11-4 and 12-1, 12-2 arranged along opposite upper and lower sides, the pads 11-1-11-4 of upside and the pads 12-1, 12-2 of downside are not disposed in an opposite positional relationship at all. In case that the state surrounded by IC chips 10-2-10-5 is assumed and inner lead bonding is formed for the IC chip 10-1 in this state, the inner lead 7 is, when the device hole 13 of a tape carrier and an inner lead 7 are shown on the IC chip, disposed only on a bump on the pad of the IC chip 10-1, and a bump on the pad of other IC chip is not disposed under the inner lead 7.
摘要翻译：目的：通过以不相反的位置关系设置沿着相对侧形成的焊盘来提高带载系统的焊接中的IC的产量。构成：在具有沿着相反的上侧和下侧布置的焊盘11-1-11-4和12-1,12-2的IC芯片10中，上侧的焊盘11-1-11-4和焊盘12-1,12- 12-2的下侧没有处于相反的位置关系。在这种情况下假设由IC芯片10-2-10-5包围的状态，并且在该状态下为IC芯片10-1形成内部引线接合的情况下，内引线7是当带载体的器件孔13 并且内部引线7被示出在IC芯片上，仅设置在IC芯片10-1的焊盘上的凸块上，并且其它IC芯片的焊盘上的凸块不设置在内引线7的下方。

5. 发明专利

JPS57116664A Thermal head device 失效
标题翻译：热头设备
公开(公告)号：JPS57116664A
公开(公告)日：1982-07-20
申请号：JP404681
申请日：1981-01-14
申请人： Ricoh Co Ltd
发明人： SUGANO OSAMU
IPC分类号： H01L49/00 , B41J2/335 , B41J2/345 , H01L27/01
CPC分类号： B41J2/345
摘要： PURPOSE:To prevent attachment of metal powder and dust and to prevent damages and the like due to the collision against other bodies by coating the bonding part between the IC chip and tape carrier on the thermal head device and the IC chip by a flexible resin, and further providing a protective cover. CONSTITUTION:On the thermal head device, heating resistors 4 on a ceramic substrate 2 and conducting wires 7 on the driving side on a glass epoxy substrate 3 are connected by tape carriers 8, and an IC chip 20 on which a driving transistor array and a shift register are incorporated are mounted on each tape carrier 8. Said tape carrier 8 is cut by a wire 15 which passes openings 10 and 12. A terminal part 13a is bonded to an electrode 5 on the substrate 2. Meanwhile a terminal part 14b is bonded to the conducting wires 7 on the substrate 3. Lead terminals 21 of the IC chip 20 are bonded to terminal parts 13b and 14a of the conducting wires 13 and 14 by the bonding parts 22. The IC chips 20 and the bonding parts 22 are coated by the flexible resin. A protecting cover 25 which covers the tape carrier 8 is further attached.
摘要翻译：目的：为了防止金属粉末和灰尘的附着，并且通过用柔性树脂将热敏头装置和IC芯片上的IC芯片和带载体之间的接合部分涂覆在与其它物体的碰撞上，防止损坏等，并进一步提供保护盖。构成：在热敏头装置上，陶瓷基板2上的加热电阻体4和玻璃环氧基板3的驱动侧的导线7由带状载体8和驱动晶体管阵列移位寄存器安装在每个载带8上。所述带载体8由通过开口10和12的导线15切割。端子部分13a接合到基板2上的电极5.同时端子部分14b是结合到基板3上的导线7.IC芯片20的引线端子21通过接合部22接合到导线13和14的端子部13b和14a。IC芯片20和接合部22 由柔性树脂涂覆。进一步安装覆盖载带架8的保护盖25。

6. 发明专利

JPS5929444A Carrier for tape 失效
标题翻译：手提带
公开(公告)号：JPS5929444A
公开(公告)日：1984-02-16
申请号：JP13953582
申请日：1982-08-10
申请人： Ricoh Co Ltd
发明人： OOTA MASATOSHI , YABUKI YOSHIROU , SUGANO OSAMU , NAKAMURA EIJI
IPC分类号： H05K3/00 , H01L21/60 , H01L23/498 , H05K1/02
CPC分类号： H01L23/49838 , H01L2924/0002 , H05K1/0263 , H01L2924/00
摘要： PURPOSE:To improve a radiation effect while stably operating an IC even against noises by forming at least one of a lead pattern for a gland, through which a large quantity of currents flow, and a power supply for an IC chip and a lead pattern for a gland terminal among lead patterns so that its area or width is made larger than other lead patterns. CONSTITUTION:The lead pattern 20 for the gland, the lead pattern 21 for a power supply terminal VSS and the lead pattern 22 for said terminal VDD on a tape base material 10 are formed so that their width is trebled approximately more than other lead patterns 23 and their areas are made larger than them. The width of these lead patterns 20-22 on the tape base material 10 is formed so as to be made the same as that of the outer leads of these leads. Accordingly, heat is hardly generated even when high currents flow through the gland, VSS and VDD, and the mixing of noises is reduce and the operation of the IC is stabilized. The lead patterns are designed easily because the pattern width of the gland, VSS and VDD is equal on the tape base material 10 and in outer lead sections.
摘要翻译：目的：通过形成大量电流流过的腺体的引线图案和用于IC芯片的电源以及引线图案中的至少一个来提高辐射效果，同时稳定地操作IC，甚至抵抗噪声，引线图案之间的腺体端子，使其面积或宽度大于其他引线图案。构成：压盖的引线图案20，电源端子VSS的引线图案21和带基材10上的端子VDD的引线图案22形成为使得它们的宽度比其他引线图案23大三倍他们的地区比他们大。这些引线图案20-22在带基材10上的宽度形成为与这些引线的外引线相同。因此，即使当大电流流过压盖VSS和VDD时也难以产生热量，并且噪声的混合减少并且IC的操作稳定。引线图案容易设计，因为压带基材10和外引线部分的压盖，VSS和VDD的图案宽度相等。

7. 发明专利

JPS5929172A Thermal head 失效
标题翻译：热头
公开(公告)号：JPS5929172A
公开(公告)日：1984-02-16
申请号：JP13933482
申请日：1982-08-11
申请人： Ricoh Co Ltd
发明人： TAKAMATSU YASUHIKO , SUGANO OSAMU , NAKAMURA EIJI
IPC分类号： H01L49/00 , B41J2/335
CPC分类号： B41J2/335
摘要： PURPOSE:To prevent the adhesion of gold to an unrequired part, by a method wherein a resin layer is applied to the protective layer and the electrode formed on a heat generating resistance layer over a range from the end part of said protective layer to the end part of said electrode in a desired pattern and used as a mask to apply gold plating onto the electrode. CONSTITUTION:Heat generating resistance layers 2, 10 comprising tantalum nitride layers are formed on a ceramic substrate 1 in a pattern form and a driving electrode 3 and a common electrode 4 each comprising a laminate consisting of a nichrome layer 11, a gold layer 12 and a gold plating layer 13 are formed on the parts of said heat generating resistance layers 2, 10 while a protective layer 5 consisting of an oxidation inhibiting layer 14 comprising silicon dioxide or the like and an anti-wear layer 15 are formed on the exposed parts 2 of the heat generating resistance layers 2, 10 and the end parts of the electrodes 3, 4 adjacent thereto as shown by the drawing (A). In the next step, a resin layer 20 comprising solder resist, epoxy resin or the like is formed over a range from the end part of the protective layer 5 to the parts of the electrodes 3, 4 adjacent thereto as shown by the drawing (B) and used as a mask to form a gold plating layer 16 on the residual surfaces of the electrodes 3, 4 as shown by the drawing (C). This structure is directly used as a thermal head while the resin layer 20 is left.
摘要翻译：目的：为了防止黄金粘附到不需要的部分，通过将树脂层施加到保护层和形成在发热电阻层上的电极在从保护层的端部到端部的范围内的方法所述电极的一部分为期望的图案，并用作掩模以在电极上施加镀金。构成：包含氮化钽层的发热电阻层2,10以图案形式形成在陶瓷基板1上，驱动电极3和公共电极4各自包括由镍铬合金层11，金层12和在所述发热电阻层2,10的部分上形成镀金层13，同时在暴露部分上形成由包含二氧化硅等的氧化抑制层14和耐磨层15构成的保护层5 2的发热电阻层2和与其相邻的电极3,4的端部，如图（A）所示。在下一步骤中，如图所示，在保护层5的端部与电极3,4的部分的范围内形成由阻焊剂，环氧树脂等构成的树脂层20。），并且用作掩模以在电极3,4的残余表面上形成镀金层16，如图（C）所示。该结构直接用作热敏头，同时留下树脂层20。

8. 发明专利

JPS5926277A Production of thermal head 失效
标题翻译：生产热头
公开(公告)号：JPS5926277A
公开(公告)日：1984-02-10
申请号：JP13593282
申请日：1982-08-04
申请人： Ricoh Co Ltd
发明人： TAKAMATSU YASUHIKO , SUGANO OSAMU , YAMAGUCHI TAKAYUKI
IPC分类号： H01L49/00 , B41J2/335
CPC分类号： B41J2/335
摘要： PURPOSE:To prevent a plated metal layer from being delaminated, by a method wherein a pattern of a photoresist layer is provided in a region including an abrasion-resistant layer and excepting a bonding part of an electrode, and the electrode is plated with gold by using the photoresist pattern as a mask. CONSTITUTION:A tantalum nitride layer 10, a nichrome layer 11, a gold layer 12 and the plated gold layer 13 are provided in four layers on a ceramic substrate 1 by appropriate means, thereafter the layers are patterned to produce a heating resistor and the electrode. Then, a silicon dioxide layer 14 as a protective layer and a tantalum pentoxide layer 15 as the abrasion-resistant layer are provided in two layers by a mask sputtering method. Subsequently, a photoresist is applied to the entire upper surface of the thermal head in this condition, is then exposed to light through a mask, and is developed so that the photoresist remains in the area of the pattern 20.
摘要翻译：目的：为了防止电镀金属层分层，通过在包括耐磨层的区域中设置光致抗蚀剂层的图案并且除了电极的接合部分之外的方法，并且电极通过使用光致抗蚀剂图案作为掩模。构成：通过适当的方式在陶瓷基板1上以四层设置氮化钽层10，镍铬合金层11，金层12和镀金层13，然后将这些层图案化以制造加热电阻器，并且电极。然后，通过掩模溅射法将作为保护层的二氧化硅层14和作为耐磨层的五氧化二钽层15分别设置在两层中。随后，在该状态下，将光致抗蚀剂施加到热敏头的整个上表面，然后通过掩模曝光，并显影，使得光致抗蚀剂保留在图案20的区域中。

9. 发明专利

JPS5926279A Thermal head 失效
标题翻译：热头
公开(公告)号：JPS5926279A
公开(公告)日：1984-02-10
申请号：JP13780882
申请日：1982-08-06
申请人： Ricoh Co Ltd
发明人： NAKAMURA EIJI , YAMAGUCHI TAKAYUKI , SUGANO OSAMU
IPC分类号： B41J2/355 , B41J2/35 , H04N1/032
CPC分类号： B41J2/35
摘要： PURPOSE:To unnecessitate complicated circuits such as a distributing circuit, by a method wherein driving circuits on both sides are connected in series with each other, and data are inputted through a single data input terminal, in a distributing-type thermal head. CONSTITUTION:Heating resistors 1 are so constructed that odd-numbered driving circuits C1-Cn-1 are placed on the upper side, while even-numbered driving circuits C2-Cn are placed on the lower side, and the circuits are connected in series with each other. When data are transferred serially through an input data wire 2 in the order of 1 n, the data are inputted first into the n-th driving circuit Cn, is then sequentially transferred into Cn-1, then into Cn-2 and so on, and when the first data reach the first driving circuit C1, each of the driving circuits C1-Cn is operated to drive the heating resistor 1, thereby developing a color at a corresponding part of a heat-sensitive recording paper. Accordingly, complicated circuits are unnecessitated, and the number of production steps can be reduced.
摘要翻译：目的：为了不需要诸如分配电路的复杂电路，通过其中两侧的驱动电路彼此串联连接的方法，并且通过单个数据输入端子在分配型热敏头中输入数据。构成：加热电阻器1被构造成使得奇数编号的驱动电路C1-Cn-1放置在上侧，而偶数驱动电路C2-Cn被放置在下侧，并且电路串联连接彼此。当数据通过输入数据线2以1n的顺序串行传送时，数据首先输入到第n个驱动电路Cn，然后被顺序地传送到Cn-1，然后被转换成Cn-2等等，并且当第一数据到达第一驱动电路C1时，驱动电路C1-Cn中的每一个驱动加热电阻器1，从而在热敏记录纸的对应部分显影。因此，不必要地复杂的电路，并且可以减少制造步骤的数量。

10. 发明专利

JPS58202538A Manufacture of resin sealed type semiconductor device 失效
标题翻译：树脂密封型半导体器件的制造
公开(公告)号：JPS58202538A
公开(公告)日：1983-11-25
申请号：JP8681482
申请日：1982-05-21
申请人： Ricoh Co Ltd
发明人： SUGANO OSAMU , ABE HIDEO , TAKAMATSU YASUHIKO
IPC分类号： H01L23/28 , H01L21/56 , H01L21/60
CPC分类号： H01L21/56 , H01L2224/50
摘要： PURPOSE:To prevent the generation of a finger touch phenomenon by a method wherein the process of dripping and solidifying resin solution of a low viscosity on the surface of a semiconductor pellet is added, and thus the resin is interposed between fingers and the semiconductor pellet. CONSTITUTION:The silicone resin solution 5 is dripped on the surface whereon the bonding of the semiconductor pellet 3 is formed. The solution 5 flows and covers the entire upper surface of the pellet 3, and then penetrates also into the clearance B between the fingers 2 and the pellet 3. When the pellet 3 is heated at 150 deg.C, the solution 5 is solidified in approx. 5min, and the solidified resin 6 covers the surface of the pellet 3 and is interposed between the clearance B. Thereby, the generation of finger touch phenomenon can be prevented.
摘要翻译：目的：通过添加在半导体颗粒表面上滴加和固化低粘度的树脂溶液的方法，从而将树脂插入在指状物和半导体颗粒之间的方法，防止产生手指触摸现象。构成：将硅树脂溶液5滴在形成半导体芯片3的接合面的表面上。溶液5流过并覆盖颗粒3的整个上表面，然后也渗透到指状物2和颗粒3之间的间隙B.当颗粒3在150℃下加热时，溶液5固化大约 5分钟，凝固树脂6覆盖颗粒3的表面，并且插入在间隙B之间。由此，可以防止手指触摸现象的产生。

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