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1. 发明专利

JP2014154632A Multilayer structure, capacitor element, and method of manufacturing the same 审中-公开
标题翻译：多层结构，电容元件及其制造方法
公开(公告)号：JP2014154632A
公开(公告)日：2014-08-25
申请号：JP2013021414
申请日：2013-02-06
申请人： Rohm Co Ltd , ローム株式会社
发明人： TSURUMI NAOAKI , KANETAKE YASUO
IPC分类号： H01G4/33
CPC分类号： H01G4/32 , F16B25/00 , H01G4/10 , H01G4/14 , H01G4/232 , H01G4/30 , H01G4/33 , H01G4/38 , H01G13/02 , H01L28/75 , H02M7/003 , Y02T10/7022
摘要： PROBLEM TO BE SOLVED: To provide a capacitor element excellent in high-temperature stability and to provide a method of manufacturing the same.SOLUTION: There is provided a capacitor element including: a multilayer structure having a substrate 10, a buffer layer 12 disposed on the substrate 10, a lower electrode 14 disposed on the buffer layer 12, and a dielectric layer 16 disposed on the lower electrode 14 and composed of nitride; an upper electrode 18 disposed on the dielectric layer 16; a first terminal electrode connected to the lower electrode 14; and a second terminal electrode connected to the upper electrode 18. Also, there is provided a method of manufacturing the capacitor element.
摘要翻译：要解决的问题：提供高温稳定性优异的电容器元件并提供其制造方法。提供一种电容器元件，其包括：多层结构，具有基板10，缓冲层12设置在衬底10，设置在缓冲层12上的下电极14和设置在下电极14上并由氮化物组成的电介质层16; 布置在电介质层16上的上电极18; 连接到下电极14的第一端子电极; 以及连接到上电极18的第二端子电极。另外，提供了一种制造电容器元件的方法。

2. 发明专利

JP2003086467A METHOD FOR FORMING DIELECTRIC LAYER IN CAPACITOR ELEMENT FOR SOLID ELECTROLYTIC CAPACITOR AND APPARATUS THEREOF 审中-公开
公开(公告)号：JP2003086467A
公开(公告)日：2003-03-20
申请号：JP2001276189
申请日：2001-09-12
申请人： ROHM CO LTD
发明人： KANETAKE YASUO
IPC分类号： C25D11/00 , C25D9/06 , C25D11/04 , C25D11/26 , C25D21/10 , H01G9/04 , H01G13/00
摘要： PROBLEM TO BE SOLVED: To make the thickness of a dielectric layer uniform, in forming the dielectric layers on the surfaces for all of a plurality of anodic bodies 2 by mounting the bodies 2 on a lateral bar 1 via anodic bars 3 extending from the top surfaces of the bodies 2, dipping the respective bodies 2 mounted on the bar 1 into a formation liquid B, and applying a DC current to the bar 1 and a cathode electrode C disposed below the bodies 2, to perform anodization processing. SOLUTION: The bar 1 is made to undergo reciprocative movement during the anodizing processing.

3. 发明专利

JP2001332446A CAPACITOR 失效
公开(公告)号：JP2001332446A
公开(公告)日：2001-11-30
申请号：JP2000148676
申请日：2000-05-19
申请人： ROHM CO LTD
发明人： KANETAKE YASUO
IPC分类号： H01G4/12 , H01G4/30 , H01G4/38 , H01G9/004 , H01G9/08 , H01G9/14 , H01G9/28
摘要： PROBLEM TO BE SOLVED: To provide a one-package-type capacitor, which is large in capacity and is low in impedance to high frequency small equivalent series resistance). SOLUTION: This capacitor is provided with a solid electrolytic capacitor 1, having an anode lead 11 and a cathode 12 formed on its outer circumference, and a laminated ceramic capacitor 2 provided with electrodes on its both ends. The anode lead 11 of the solid electrolytic capacitor 1 and one electrode of the ceramic capacitor 2 are respectively connected with a first outer lead 3 electrically. Then, the cathode of the solid electrolytic capacitor 1 and the other electrode of the ceramic capacitor 2 are respectively connected with a second outer lead 4 electrically. The solid electrolytic capacitor 1, laminated ceramic capacitor 2, and the periphery of the joint parts of the respective electrodes are covered with a package.

4. 发明专利

JPH07263284A ELECTRONIC COMPONENT 失效
公开(公告)号：JPH07263284A
公开(公告)日：1995-10-13
申请号：JP5044594
申请日：1994-03-22
申请人： ROHM CO LTD
发明人： MURAYAMA TOMOHIRO , KANETAKE YASUO
IPC分类号： H01G9/008 , H05K1/18 , H05K3/34
摘要： PURPOSE:To obtain an electronic component which has the total length of a lead terminal elongated to enhance heat-dissipating property in a soldering operation by a method wherein the lead terminal protrudes from a position near the surface of a resin molded part at a taper part and is guided downwards so as to be along the tape part and the edge of the molded part. CONSTITUTION:A capacitor element 1, an anode-side lead terminal 2 and cathode-side lead terminal 3 are packaged in such a way that they protrude from positions which are comparatively close to the surface 4c at taper parts 4a', 4b' from halfway parts of edges 4a, 4b of a resin molded part 4 toward the upper part over the surface 4c of the resin molded part 4. The lead terminals 2, 3 which protrude from the taper parts 4a', 4b' are extended along the taper parts 4a', 4b' and the edges 4a, 4b, and they are bent toward the inside at the bottom face of the resin molded part. Consequently, the total length of the lead terminals can be elongated, and the heat of molten solder or the like in a soldering and mounting operation can be dissipated by the lead terminals.

5. 发明专利

JPH0794372A PACKAGED SOLID ELECTROLYTIC CAPACITOR WITH SAFETY FUSE 失效
公开(公告)号：JPH0794372A
公开(公告)日：1995-04-07
申请号：JP23773993
申请日：1993-09-24
申请人： ROHM CO LTD
发明人： KANETAKE YASUO
IPC分类号： H01G9/08 , H01G9/12
摘要： PURPOSE:To provide a fused capacitor by enclosing a capacitor element and a safety fuse in a package with a cap having a transparent or translucent window. CONSTITUTION:A capacitor element 1 with leads 2 and 3 is placed in a recess 5a of a package body 5 made of heat-resisting material such as ceramic and is covered on top with a cap 6 made of heat-resisting material such as ceramic. The cap has a window 7 made of transparent or translucent glass or plastic. The cap 6 and the package body 5, with the capacitor element and a fuse enclosed, are joined integrally using solder glass 8.

6. 发明专利

JPH0794363A STRUCTURE OF SURFACE-MOUNT SOLID ELECTROLYTIC CAPACITOR 失效
公开(公告)号：JPH0794363A
公开(公告)日：1995-04-07
申请号：JP23774093
申请日：1993-09-24
申请人： ROHM CO LTD
发明人： KANETAKE YASUO
IPC分类号： H01G9/048 , H01G9/004 , H01G9/052
摘要： PURPOSE:To enable a solid electrolytic capacitor such as a tantalum solid electrolytic capacitor or the like to be lessened in equivalent series resistance (ESR) on high frequencies and manufacturing cost. CONSTITUTION:A lead terminal 4 is fixed to anode rods 3a and 3b which protrude from the end face 2a of a chip piece 2 of a capacitor device 1, a cathode side electrode film 5 is formed on the other end face 2b of the chip piece 2 opposed to the end face 2a provided with the anode rods 3a and 3b or on a base adjacent to the end face 2b, and the other surface of the chip piece 2 is covered with an insulating film 6, and moreover the chip piece 2 of the capacitor device 1 is so formed as to be recessed or protrudent in cross section.

7. 发明专利

JP2003142339A SOLID ELECTROLYTIC CAPACITOR STRUCTURE AND MANUFACTURING METHOD THEREFOR 审中-公开
公开(公告)号：JP2003142339A
公开(公告)日：2003-05-16
申请号：JP2001337488
申请日：2001-11-02
申请人： ROHM CO LTD
发明人： KANETAKE YASUO
IPC分类号： H01G9/012 , H01G9/00
摘要： PROBLEM TO BE SOLVED: To enable a solid electrolytic capacitor which is to be reduced in size and in fraction defective, when the electrolytic capacitor has such a structure where a capacitor element 1 is located between an anode lead terminal 8 and a cathode lead terminal 9, an anode wire 3 protruding from an anode 2 of the capacitor element 1 is welded and fixed to the anode lead terminal, and a cathode film 6, located on the surface of the anode, is connected to the cathode lead terminal. SOLUTION: A groove 3a extending in a spiral, is provided on the anode wire 3 of a capacitor element 1, a recess 3b which cuts off the spiral groove 3 is provided in a region, in between the anode lead terminal 8 of the anode wire 3 and the anode 2.

8. 发明专利

JPH10340828A STRUCTURE FOR PACKAGED SOLID ELECTROLYTIC CAPACITOR 失效
公开(公告)号：JPH10340828A
公开(公告)日：1998-12-22
申请号：JP14925297
申请日：1997-06-06
申请人： ROHM CO LTD
发明人： KANETAKE YASUO
IPC分类号： H01G9/00 , H01G9/004
摘要： PROBLEM TO BE SOLVED: To eliminate the identification of the direction of a polarity at the time of packaging on a printed board or the like in a solid electrolytic capacitor composed by tightly sealing the part of a capacitor element in a package body made of synthetic resin, so as to project an anode lead terminal and a cathode lead terminal to the capacitor element from the package body. SOLUTION: While the four anode lead terminals 3a, 3b, 3c and 3d are arranged with two each on respective left and right side faces 2a and 2b in the package body 2, two cathode lead terminals 4a and 4b are arranged between the two anode lead terminals in both the left and right side faces in the package body. Alternatively, the four cathode lead terminals are arranged with two each on the respective left and right side faces in the package body, the two anode lead terminals 3a and 3b are arranged between the two cathode lead terminals in both the left and right side faces in the package body.

9. 发明专利

JPH1055938A SOLID ELECTROLYTIC CAPACITOR 失效
公开(公告)号：JPH1055938A
公开(公告)日：1998-02-24
申请号：JP20864196
申请日：1996-08-07
申请人： ROHM CO LTD
发明人： TOMIYASU TOMOHIRO , KANETAKE YASUO
IPC分类号： H01G9/012 , H01G9/052 , H01G9/12
摘要： PROBLEM TO BE SOLVED: To obtain a solid electrolytic capacitor having a fuse wire, without changing the specified size by electrically connecting an exposed part of an anode chip piece formed on the surface of a capacitor element to an anode lead terminal and packaging the entire with a synthetic resin molding. SOLUTION: A cathode terminal film 11c and dielectric film 11b on a part of the top face of a capacitor element 11 are removed to expose a metal powder and anode terminal lid is formed thereon. The element 11 is disposed between a pair of right and left lead terminals 13, 14 to connect the element 11 to the terminal film 11c on the chip 11a of the element 11 or cathode lead terminal 14. A fuse wire 16 is disposed between the terminal 11d and lead terminal 13 to electrically connect it by the wire bonding. The entire of the element 11 and fuse wire 16 is packaged with a synthetic resin molding 18.

10. 发明专利

JPH09148187A STRUCTURE OF PACKAGED SOLID ELECTROLYTIC CAPACITOR AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH09148187A
公开(公告)日：1997-06-06
申请号：JP30318595
申请日：1995-11-21
申请人： ROHM CO LTD
发明人： TOMIYASU TOMOHIRO , KANETAKE YASUO
IPC分类号： H01G9/012 , H01G13/00
摘要： PROBLEM TO BE SOLVED: To position reliably a capacitor element to anode lead terminals by a method wherein an L-shaped pulled and raised piece is provided integrally with each anode lead terminal on the point of the anode lead terminal and the anode rod of the capacitor element is fitted in the inside of this pulled and raised piece to weld the rod to the piece. SOLUTION: Anode lead terminals 1 and cathode lead terminals 2, which oppose to each other, are shaped integrally with one pair of left and right side frames 7a and 7b of a lead frame 7 at a proper pitch in the longitudinal direction. At this time, a pulled and raised piece 1b formed into an L-shaped form is provided integrally with each anode lead terminal 1 on the point of the terminal 1. In the middle of transfer of the lead frame 7 in the longitudinal direction, a capacitor element 3 is fed between each lead terminal 1 and each lead terminal 2 so that an anode rod 5 of the element 3 is fitted in the inside of the L-shaped pulled and raised piece 1b. After the rod 5 is pinchingly attached to the piece 1b by one pair of electrodes 8 and 9, the rod 5 is secured to the piece 1b by performing a spot welding. Thereby, the yield of the manufacture of a packaged solid electrolytic capacitor can be reliably enhanced.

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