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    • 6. 发明专利
    • INK-JET HEAD STRUCTURE
    • JP2000052551A
    • 2000-02-22
    • JP22468798
    • 1998-08-07
    • RICOH KK
    • KATO SEIICHI
    • B41J2/045B41J2/055B41J2/14B41J2/16B81B3/00B81C1/00
    • PROBLEM TO BE SOLVED: To improve a driving frequency by obtaining a sufficient shift of a diaphragm to discharge ink even when a gap defined by the diaphragm and an individual counter electrode is narrowed so as to lower a driving voltage and driving the diaphragm without being in touch with the individual counter electrode. SOLUTION: When a voltage is not impressed, an individual counter electrode 2 and a diaphragm 11 are in a state (A). When a driving voltage is impressed between the individual counter electrode 2 and the diaphragm 11, the diaphragm 11 is shifted by a static electricity and a thick part 11a of the diaphragm 11 comes in touch with an upper face 7 of a step 5 as shown in (B). The thick part 11a of the diaphragm 11 faces the counter electrode 2 via a gap, i.e., a height L of the step. The thick part 11a of the diaphragm and the counter electrode 2 are equivalently in a state (C). In driving the diaphragm electrostatically, the diaphragm is instable to reach 1/3 the gap and collides with the counter electrode 2. For avoiding the collision, the diaphragm 11 is displaced in a range higher than 2/3 the height L of the step.
    • 7. 发明专利
    • INK-JET HEAD
    • JPH11320873A
    • 1999-11-24
    • JP11513098
    • 1998-04-24
    • RICOH KK
    • KATO SEIICHIOTAKA KOICHIKOMAI HIROMICHIAZUMI JUNICHI
    • B41J2/045B41J2/055B41J2/14B41J2/16
    • PROBLEM TO BE SOLVED: To eliminate a wiring board such as a flexible substrate or the like and eventually eliminate an extra space for a supporting body to be set at the wiring board by constituting an ink-jet head so that an opposite electrode at the side of a front face of an electrode substrate is taken out at the side of a rear face of the electrode substrate. SOLUTION: When a lead wiring from an opposite electrode 7 is taken out to a rear face through a conductor bury through hole 3b of a glass substrate 1, a metal wiring pattern 14 is formed at the rear face of the glass substrate 1 and a bump-like conductor 6' is formed at a position of the metal wiring pattern appropriate to be connected to a device. Finally an Si substrate 8 is anodically united, and a nozzle plate 9 with a nozzle hole formed by Ni electrocasting or the like manner is bonded to the Si substrate 8 with the use of an epoxy adhesive. This ink-jet head is thus formed. In the constitution, the ink-jet head of an electrostatic type can be mounted easily without specially using a flexible substrate or the like, and mount costs can be reduced.
    • 9. 发明专利
    • PHYSICAL QUANTITY MEASURING DEVICE IN VACUUM DEVICE
    • JPH08306665A
    • 1996-11-22
    • JP12936695
    • 1995-04-28
    • RICOH KK
    • KATO SEIICHI
    • H05H1/46H01L21/302H01L21/3065H01L31/12
    • PURPOSE: To make it possible to measure the physical quantity of temperature and the others in a vacuum device without adding any alteration to the vacuum device and to make it possible to start the intrinsic work of the vacuum device immediately after the measurement. CONSTITUTION: A sampling circuit, a control pulse waveform formation circuit, a drive part, a demodulation part and a control part are formed in a silicon wafer 30 as an integrated circuit 26 according to the process of a CMOS device. Photocells 24, a liquid crystal optical switching module 4 and temperature detecting parts 2a, which are respectively formed using a platinum resistor, are formed on the wafer 30 via an interlayer insulating film consisting of a silicon nitride film. A quartz spacer is bonded on the photocells 24, the switching module 4 and the detecting parts 2a, a quartz plate 32, which is formed into the same plane form as that of the wafer 30 and has a thickness of 0.3mm, is laminated on the quartz spacer with an epoxy bonding agent and a sapphire thin film 34 is formed on the plate 32 as an etching-resisting film by a sputtering method.