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1. 发明专利

JP2012238601A Bulb-type light source for illumination 有权
标题翻译： BULB型光源用于照明
公开(公告)号：JP2012238601A
公开(公告)日：2012-12-06
申请号：JP2012158607
申请日：2012-07-17
申请人： Panasonic Corp , パナソニック株式会社
发明人： SHIDA SATOSHI , UEMOTO TAKAARI
IPC分类号： F21S2/00 , F21V3/02 , F21V19/00 , F21V23/00 , F21V29/00 , F21Y101/02 , H01L33/50 , H01L33/64
CPC分类号： F21V3/02 , F21K9/23 , F21K9/233 , F21V3/0418 , F21V3/0436 , F21V23/002 , F21V29/713 , F21V29/74 , F21V29/89 , F21Y2115/10
摘要： PROBLEM TO BE SOLVED: To provide a bulb-type light source for illumination, with further excellent heat discharge characteristics than a conventional one, and using a light-emitting element.SOLUTION: The bulb-type light source for illumination is provided with a bowl-shaped case, a first heat conduction member, a mounting substrate, a light-emitting part, a globe, and a second heat conduction member. The first heat conduction member includes a top surface and a bottom surface and closes an opening of the bowl-shaped case with the bottom surface. The mounting substrate is arranged in surface contact with the top surface of the first heat conduction member. The light-emitting part includes light-emitting elements mounted on the top surface of the mounting substrate to emit light with supply of power from a power source circuit, and a wavelength conversion member for converting wavelengths of light emitted from the light-emitting elements. The second heat conduction member includes a first part which is in surface contact with an area where the light-emitting part is not arranged on the top surface of the mounting substrate, and a second part which is in surface contact with an area where the mounting substrate is not arranged on the top surface of the first heat conduction member. Here, a caving part is formed on the top surface of the first heat conduction member, and the mounting substrate is placed in the caving part of the top surface of the first heat conduction member.
摘要翻译：要解决的问题：提供一种用于照明的灯泡型光源，具有比常规的更好的散热特性，并且使用发光元件。解决方案：用于照明的灯泡型光源设置有碗状壳体，第一导热构件，安装基板，发光部件，球形体和第二导热构件。第一导热构件包括顶表面和底表面，并且封闭具有底表面的碗形壳体的开口。安装基板被布置成与第一导热构件的顶表面表面接触。发光部分包括安装在安装基板的顶表面上的发光元件，以从电源电路提供电力发光，以及用于转换从发光元件发射的光的波长的波长转换部件。第二导热构件包括与安装基板的上表面上未配置发光部的区域表面接触的第一部分和与安装基板的表面接触的区域的第二部分衬底不布置在第一导热构件的顶表面上。这里，在第一导热构件的顶面形成有开口部，将安装基板配置在第一导热构件的顶面的开口部。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2011138750A Lamp 有权
公开(公告)号：JP2011138750A
公开(公告)日：2011-07-14
申请号：JP2010224097
申请日：2010-10-01
申请人： Panasonic Corp , パナソニック株式会社
发明人： TAKAHASHI KENJI , TOMIYOSHI YASUNARI , SHIDA SATOSHI , SETOMOTO TATSUMI , YANAI AKIRA , UEMOTO TAKAARI , NAGAI HIDEO
IPC分类号： F21S2/00 , F21V19/00 , F21Y101/02
CPC分类号： F21V23/009 , F21K9/23 , F21K9/232 , F21K9/238 , F21S8/026 , F21V3/00 , F21V23/002 , F21V23/006 , F21V29/507 , F21V29/70 , F21Y2115/10
摘要： PROBLEM TO BE SOLVED: To provide a bulb-shaped lamp capable of reducing weight of a case and excellent in handleability. SOLUTION: The LED bulb 1 includes: an LED module 3 with LEDs mounted thereon; a cylindrical case 7 having openings on both ends thereof; a mounting member 5 mounted in one end of the case 7, closing the opening and moreover mounting the LED module 3 on its surface; and a base 91 installed on the other end side of the case 7. The case 7 has an outer and an inner diameters smaller at the one end than at the other end, and at least a part region from the one end through the other end is made thinner as it goes from the one end side to the other end side. COPYRIGHT: (C)2011,JPO&INPIT

3. 发明专利

JP2010016223A Lamp 有权
标题翻译：灯
公开(公告)号：JP2010016223A
公开(公告)日：2010-01-21
申请号：JP2008175579
申请日：2008-07-04
申请人： Panasonic Corp , パナソニック株式会社
发明人： OGATA TOSHIBUMI , ABE MASUMI , OSHIO SHOZO , SHIDA SATOSHI
IPC分类号： H01L33/48 , F21S2/00 , F21S8/04 , F21V29/00 , F21Y101/02
CPC分类号： F21K9/23 , F21V3/0409 , F21Y2115/10 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a lamp that efficiently dissipates heat from a semiconductor light-emitting element such as an LED element being a light source. SOLUTION: The lamp 1 includes a heat sink 5, a substrate 15 mounted on the heat sink 5, the LED element Dnm mounted on a principal surface of the substrate 15 on the opposite side from the heat sink 5, and a glass-made bulb 9 mounted on the heat sink 5 and covering the substrate 15 including the LED element Dnm. On an internal surface of the bulb 9, a light transparent layer 35 is formed of a light transparent material having higher thermal conductivity than the bulb 9, and part 35a of the light transparent layer 35 is connected to the heat sink 5 through a thermal conduction portion 37 made of a thermal conductive material having thermal conductivity equal to or higher than the thermal conductivity of the light transparent layer 35. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种有效地散发来自诸如作为光源的LED元件的半导体发光元件的热量的灯。解决方案：灯1包括散热器5，安装在散热器5上的基板15，安装在基板15的与散热片5相反的一侧的主表面上的LED元件Dnm，以及玻璃该灯泡9安装在散热器5上并覆盖包括LED元件Dnm的基板15。在灯泡9的内表面上，光透明层35由具有比灯泡9更高的导热性的透光材料形成，透光层35的部分35a通过热传导连接到散热器5 部分37由具有等于或高于透光层35的热导率的导热性的导热材料制成。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2013058490A Led and lighting device 有权
标题翻译： LED和照明设备
公开(公告)号：JP2013058490A
公开(公告)日：2013-03-28
申请号：JP2012245700
申请日：2012-11-07
申请人： Panasonic Corp , パナソニック株式会社
发明人： SHIDA SATOSHI , TAKAHASHI KENJI , SHUTO MITSUKO , MIKI MASAHIRO , NAGAI HIDEO , UEMOTO TAKAARI
IPC分类号： F21S2/00 , F21V29/00 , F21Y101/02 , H01L33/48
CPC分类号： F21K9/23 , F21K9/60 , F21V3/02 , F21V3/0418 , F21V3/0436 , F21V7/0016 , F21V13/02 , F21V17/101 , F21V23/002 , F21V23/006 , F21V29/15 , F21V29/506 , F21V29/85 , F21Y2115/10
摘要： PROBLEM TO BE SOLVED: To provide a lamp or the like capable of alleviating a thermal load on a circuit in a simple structure.SOLUTION: The LED lamp has an inside of an envelope consisting of a globe 30 and a case 50 divided into two by a pedestal 20 blocking an end opening of the globe 30, with LEDs 12 housed in a globe 30 side space and a circuit unit for making the LEDs 12 emit light housed in a case 50 side space, respectively. The LEDs 12 are thermally connected with the pedestal 20, and the pedestal 20 and the case 50 are jointed to the globe 30 in a state in which a heat transfer volume from the pedestal 20 to the globe 30 is larger than that from the pedestal 20 to the case 50.
摘要翻译：要解决的问题：提供能够以简单的结构减轻电路上的热负荷的灯等。解决方案：LED灯具有由球体30和壳体50组成的外壳内部，壳体50被阻挡球体30的端部开口的基座20分成两部分，其中LED 12容纳在球形30的侧面空间中，用于使LED12分别发射容纳在壳体50侧空间中的光的电路单元。 LED12与基座20热连接，并且基座20和壳体50在从基座20到球形体30的传热量大于基座20的传热量的状态下接合到球形器30 案例50.版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2011138785A Lamp 有权
标题翻译：灯
公开(公告)号：JP2011138785A
公开(公告)日：2011-07-14
申请号：JP2011022584
申请日：2011-02-04
申请人： Panasonic Corp , パナソニック株式会社
发明人： TAKAHASHI KENJI , TOMIYOSHI YASUNARI , SHIDA SATOSHI , SETOMOTO TATSUMI , YANAI AKIRA , UEMOTO TAKAARI , NAGAI HIDEO
IPC分类号： F21S2/00 , F21V23/00 , F21Y101/02 , H01L33/48
CPC分类号： F21V23/009 , F21K9/23 , F21K9/232 , F21K9/238 , F21S8/026 , F21V3/00 , F21V23/002 , F21V23/006 , F21V29/507 , F21V29/70 , F21Y2115/10
摘要： PROBLEM TO BE SOLVED: To provide a bulb-shaped lamp capable of reducing weight of a case and excellent in handleability. SOLUTION: The LED bulb 1 includes: an LED module 3 with LEDs mounted thereon; a cylindrical case 7 having openings on both ends thereof; a mounting member 5 mounted in one end of the case 7, closing the opening and moreover mounting the LED module 3 on its surface; and a base 91 installed on the other end side of the case 7. The case 7 has an outer and an inner diameters smaller at the one end than at the other end, and at least a part region from the one end through the other end is made thinner as it goes from the one end side to the other end side. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够减轻壳体重量并且操作性优异的灯泡状灯。解决方案：LED灯泡1包括：安装有LED的LED模块3; 在其两端具有开口的圆柱形壳体7; 安装在壳体7的一端的安装构件5，闭合开口，并且将LED模块3安装在其表面上; 以及安装在壳体7的另一端侧的基部91.壳体7的一端的外径和内径比另一端小，并且从一端到另一端的至少一部分区域从一端侧到另一端侧变薄。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2011129358A Bulb-shaped illumination light source 审中-公开
标题翻译： BULB型照明光源
公开(公告)号：JP2011129358A
公开(公告)日：2011-06-30
申请号：JP2009286410
申请日：2009-12-17
申请人： Panasonic Corp , パナソニック株式会社
发明人： TAMURA TETSUSHI , SHIDA SATOSHI
IPC分类号： F21S2/00 , F21S8/02 , F21V19/00 , F21V19/02 , F21V23/00 , F21Y101/02
CPC分类号： F21S8/02 , F21V23/02
摘要： PROBLEM TO BE SOLVED: To provide a bulb-shaped illumination light source capable of being fitted to a downlight lighting fixture.
SOLUTION: The LED lamp 5 is fitted to a downlight illumination fixture 3 having a bowl-type fixture body 9 and a socket 11. The LED lamp 5 comprises a body 19 having a base mounted to the socket 11, a light emitting part 17 having a plurality of LED elements emitting light by receiving power through the socket, and a connection part 23 detachably connecting the body 19 with the light emitting part 17. The body 19 has a size permissible to be mounted to the socket 11 in the fixture body 9, and the light emitting part 17 is detachable by the connection part 23 with respect to the body 19 mounted to the socket 11.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够装配到筒灯照明器具的灯泡形照明光源。解决方案：LED灯5装配到具有碗形固定器本体9和插座11的筒灯照明器具3上.LED灯5包括主体19，主体19具有安装到插座11的基座，发光具有通过插座接收电力而发光的多个LED元件的部分17以及将本体19与发光部17可拆卸地连接的连接部23.主体19具有允许安装在插座11中的尺寸夹具本体9和发光部17相对于安装在插座11上的主体19可由连接部23拆卸。（C）2011，JPO＆INPIT

7. 发明专利

JP2011129357A Bulb-shaped illumination light source 审中-公开
标题翻译： BULB型照明光源
公开(公告)号：JP2011129357A
公开(公告)日：2011-06-30
申请号：JP2009286409
申请日：2009-12-17
申请人： Panasonic Corp , パナソニック株式会社
发明人： TAMURA TETSUSHI , SHIDA SATOSHI
IPC分类号： F21V23/06 , F21S2/00 , F21V21/28 , F21V23/00 , F21Y101/02
摘要： PROBLEM TO BE SOLVED: To provide a bulb-shaped illumination light source capable of being fitted to a downlight lighting fixture.
SOLUTION: An LED lamp 5 can be fitted to a downlight lighting fixture 3 having a bowl-shaped fixture body 9 and a socket 11. The LED lamp 5 has a light emitting portion 17 having a plurality of LED elements, a main body 19 having a base mounted on the socket 11, a circuit unit making the LED elements emit light, and a connection part 20 for connecting the light emitting portion 17 to the main body 19. The connection part 20 mounts the main body 19 and the light emitting portion 17 in free bending, and moreover, connects, in a state that the light emitting portion 17 keeps a bent posture against the main body 19, the light emitting portion 17 and the main body 19 in free rotation around a rotation axis of the base with the main body 19 independent against the light emitting portion 17.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够装配到筒灯照明器具的灯泡形照明光源。解决方案：LED灯5可以装配到具有碗形固定器体9和插座11的筒灯照明器具3上.LED灯5具有发光部分17，其具有多个LED元件，主体主体19具有安装在插座11上的基座，使LED元件发光的电路单元以及用于将发光部17连接到主体19的连接部20.连接部20安装主体19和发光部分17自由弯曲，并且在发光部分17保持弯曲姿态抵抗主体19的状态下，发光部分17和主体19围绕旋转轴线自由转动底座与主体19独立于发光部分17.版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2010206232A Plate storing body for component supplying and component supplying apparatus 有权
标题翻译：组件供应和组件供应装置的板材储存体
公开(公告)号：JP2010206232A
公开(公告)日：2010-09-16
申请号：JP2010143006
申请日：2010-06-23
申请人： Panasonic Corp , パナソニック株式会社
发明人： NARITA MASACHIKA , ISHIDA KENICHI , HIRATA SHUICHI , SHIDA SATOSHI
IPC分类号： H05K13/02 , B65D85/38 , H01L21/00 , H01L21/673 , H01L21/677 , H01L21/68 , H01L21/687
CPC分类号： H01L21/67778 , H01L21/67271 , H01L21/6732 , H01L21/67383 , H01L21/67766 , H01L21/68785
摘要： PROBLEM TO BE SOLVED: To surely and efficiently extract respective stored plates, in a plate storing body for component supplying to stack and store a plurality of plates for component supplying where a plurality of components have been disposed. SOLUTION: The plate storing body includes a plurality of posture guides for guiding horizontal supporting postures in the plate supplying directions of respective plates by being disposed between respective pairs of supporting guides and engaged with respective plates. Owing to this, plate postures in the plate storing body can be held in the normal state, and storing and extracting the respective plates in/from the plate storing body can be executed smoothly. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了确保和有效地提取各个存储的板，在用于组件供应的板存储体中堆叠并存储已经设置多个部件的多个用于部件供应的板。解决方案：板存储体包括多个姿势引导件，用于通过设置在各对支撑引导件之间并与相应的板接合来引导各板的板供给方向上的水平支撑姿势。由此，能够将板材收纳体的板状姿势保持为正常状态，能够平滑地进行从板材收纳体的各板的收纳。版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2010103241A lamp 审中-公开
标题翻译：灯
公开(公告)号：JP2010103241A
公开(公告)日：2010-05-06
申请号：JP2008272139
申请日：2008-10-22
申请人： Panasonic Corp , パナソニック株式会社
发明人： SHIDA SATOSHI , MIYAZAKI MITSUHITO , TAKAHASHI KENJI
IPC分类号： H01L33/48 , H01L33/00
摘要： PROBLEM TO BE SOLVED: To provide a lamp which save on energy by including a semiconductor light-emitting device as a light source, and assures an appropriate heat dissipation path to provide high luminous efficiency and a long lifetime characteristic. SOLUTION: This lamp 1 is provided with: an LED unit 10 including an LED element in a structure; and a burning circuit unit 15 for supplying electric power to an LED chip in the LED unit 10 for burning. The LED unit 10 is attached to a bottom wall outer face 13a of a heat sink 13, and the burning circuit unit 15 is attached to a bottom wall inner face 14a of a case 14 for a circuit. The case 14 for a circuit is internally inserted into a cylinder of the cylindrical heat sink 13 in a state that sidewalls are opposed to each other, and a gap 13d is formed between the sidewall of the heat sink 13 and the sidewall of the case 14 for a circuit. The air exists in the gap 13d to function as a heat insulating barrier. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过包括半导体发光器件作为光源来节省能量的灯，并且确保适当的散热路径以提供高发光效率和长寿命特性。解决方案：该灯1设置有：包括结构中的LED元件的LED单元10; 以及用于向用于燃烧的LED单元10中的LED芯片提供电力的燃烧电路单元15。 LED单元10附接到散热器13的底壁外表面13a，并且燃烧电路单元15附接到用于电路的壳体14的底壁内表面14a。在侧壁彼此相对的状态下，用于电路的壳体14内部插入到圆柱形散热器13的圆筒中，并且在散热器13的侧壁和壳体14的侧壁之间形成间隙13d 为电路。在间隙13d中存在空气，作为隔热屏障。版权所有（C）2010，JPO＆INPIT

10. 发明专利

JP2009239314A Component mounting method 有权
标题翻译：组件安装方法
公开(公告)号：JP2009239314A
公开(公告)日：2009-10-15
申请号：JP2009168611
申请日：2009-07-17
申请人： Panasonic Corp , パナソニック株式会社
发明人： MORIKAWA MAKOTO , NAITO HIROYUKI , SHIDA SATOSHI
IPC分类号： H01L21/60
CPC分类号： H01L2224/11
摘要： PROBLEM TO BE SOLVED: To provide a method of mounting a component having improved quality in the junction between a component and a substrate.
SOLUTION: A method of mounting a component having improved quality in the junction between a component 20 and a substrate 10 comprises the processes of detecting a position of a bump b on the substrate 10 (step S100), arranging the component 20 and the substrate 10 (step S110) at the location such that an electrode 23 of the component 20 faces against the position detected by the position-detecting process, and pressing either one of the component 20 and the substrate 10 to the other side (step S112) while maintaining the condition of arrangement made by the arrangement process.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种在组件和基板之间的接合处安装具有改进的质量的部件的方法。解决方案：在部件20和基板10之间的接合处安装具有改进质量的部件的方法包括检测基板10上的凸块b的位置的处理（步骤S100），将部件20和在该位置处的基板10（步骤S110），使得部件20的电极23面对由位置检测处理检测到的位置，并将部件20和基板10中的任一个按压到另一侧（步骤S112 ），同时保持安排过程的安排条件。版权所有（C）2010，JPO＆INPIT

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