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    • 1. 发明专利
    • Modifier for resin and resin composition including the modifier
    • 用于树脂和树脂组合物的改性剂,包括改性剂
    • JP2013108097A
    • 2013-06-06
    • JP2013048043
    • 2013-03-11
    • Osaka Gas Co Ltd大阪瓦斯株式会社
    • SAKAMOTO KANAFUJIKI TAKESHIYAMADA MASAHIROSAKAMOTO HIRONORITANAKA AKIRATOKUMITSU KATSUHISA
    • C08L23/06C08K5/54C08L83/16
    • PROBLEM TO BE SOLVED: To enhance or improve flowability in melt molding of resins, such as engineering plastics.SOLUTION: A modifier composed of a polysilane compound is added to a resin (for example, a thermoplastic resin, such as a polyamide-based resin, a polyester-based resin, a polyacetal resin, a polycarbonate resin, a poly(thio)ether-based resin, a polysulfone-based resin, a polyketone-based resin, a polyimide-based resin, an ultrahigh molecular weight polyolefin-based resin, and a fluorine-based resin). The polysilane compound may be, for example, polyalkylarylsilane (such as polymethylphenylsilane), polydiarylsilane (such as polydiphenylsilane), etc. The modifier can be added to the resin, for example, in such an amount of 0.1-50 pts.wt. based on 100 pts.wt. of the resin.
    • 要解决的问题:提高或提高树脂(如工程塑料)的熔融成型流动性。 解决方案:将由聚硅烷化合物组成的改性剂加入到树脂中(例如,聚酰胺类树脂,聚酯类树脂,聚缩醛树脂,聚碳酸酯树脂,聚( 硫醚)醚系树脂,聚砜系树脂,聚酮系树脂,聚酰亚胺系树脂,超高分子量聚烯烃系树脂,氟系树脂等)。 聚硅烷化合物可以是例如聚烷基芳基硅烷(例如聚甲基苯基硅烷),聚二芳基硅烷(例如聚二苯基硅烷)等。可以将改性剂加入树脂中,例如以0.1-50重量份的量加入到树脂中。 基于100重量 的树脂。 版权所有(C)2013,JPO&INPIT
    • 4. 发明专利
    • Polysilane resin composition
    • 多晶树脂组合物
    • JP2009235358A
    • 2009-10-15
    • JP2008086892
    • 2008-03-28
    • Osaka Gas Co Ltd大阪瓦斯株式会社
    • FUJIKI TAKESHIOSAWA SHINGOYAMADA MASAHIRO
    • C08L83/16C08K5/1515C08K5/54G02F1/1337
    • PROBLEM TO BE SOLVED: To provide a resin composition high in water repellency, heat resistance, and transparency.
      SOLUTION: The resin composition includes a polysilane and a hydrophobic alkyl compound. The polysilane may contain at least one selected from polymonoaryl silane units, polydiaryl silane units, and polyalkyl aryl silane units. Further, the polysilane may contain at least one selected from mono 6-20C arylsilane units, and 1-6C alkyl 6-20C aryl saline units. The hydrophobic alkyl compound may contain a 6-24C alkyl group and at least one selected from a polymeric unsaturated group, a hydrolytically condensable group, a hydroxyl group, an alkoxy group, a mercapto group, an alkylthio group, a halogen atom, a carboxyl group, an alkoxycarbonyl group, a carbonyl halide group, an epoxy group and an isocyanate group.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供具有高斥水性,耐热性和透明性的树脂组合物。 解决方案:树脂组合物包括聚硅烷和疏水性烷基化合物。 聚硅烷可以含有选自多元芳基硅烷单元,聚二芳基硅烷单元和聚烷基芳基硅烷单元中的至少一种。 此外,聚硅烷可以含有选自单6-20C芳基硅烷单元和1-6C烷基6-20C芳基盐单元中的至少一种。 疏水性烷基化合物可以含有6-24C烷基和选自聚合不饱和基团,水解缩合基团,羟基,烷氧基,巯基,烷硫基,卤原子,羧基中的至少一种 烷氧基羰基,羰基卤基,环氧基和异氰酸酯基。 版权所有(C)2010,JPO&INPIT
    • 5. 发明专利
    • Polysilane and its manufacturing method
    • 多晶硅及其制造方法
    • JP2008266433A
    • 2008-11-06
    • JP2007110128
    • 2007-04-19
    • Osaka Gas Co Ltd大阪瓦斯株式会社
    • OSAWA SHINGOSAKAMOTO HIRONORIFUJIKI TAKESHI
    • C08G77/60C08L63/00C08L83/16
    • PROBLEM TO BE SOLVED: To provide a polysilane which excels in curability, can independently cure even in the absence of a curing agent, and is useful as a curing agent for thermosetting resins such as an epoxy resin. SOLUTION: The polysilane is constituted of a structural unit represented by formula (1a) (wherein R 1a is an aryl group which may have a substituent) and a structural unit represented by formula (1b) [wherein R 1b is an alkyl group which may have a substituent, and when R 1a in the above formula (1a) is a phenyl group, R 1b in the formula (1b) may be a methyl group]. COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:提供固化性优异的聚硅烷,即使在不存在固化剂的情况下也可以独立地固化,并且可用作热固性树脂如环氧树脂的固化剂。 解决方案:聚硅烷由式(1a)表示的结构单元(其中R 1a 是可具有取代基的芳基)和由式(1b)表示的结构单元构成, [其中R“SP”是可以具有取代基的烷基,并且当上述式(1a)中的R“1”是苯基时,R“ 式(1b)中的/ SP>可以是甲基]。 版权所有(C)2009,JPO&INPIT
    • 9. 发明专利
    • Composition for forming metal particulate and metal particulate
    • 用于形成金属颗粒和金属颗粒的组合物
    • JP2005314712A
    • 2005-11-10
    • JP2004130750
    • 2004-04-27
    • Osaka CityOsaka Gas Co Ltd大阪市大阪瓦斯株式会社
    • FUJIKI TAKESHIKAWASAKI SHINICHIMURASE HIROAKISAKAMOTO HIRONORITANAKA MASASHIMATSUKAWA KOYOMATSUURA YUKITO
    • B01J19/12B22F1/00B22F9/24C08K3/10C08L83/16C09D5/24C09D7/12C09D183/14C09D183/16
    • PROBLEM TO BE SOLVED: To provide a composition with which metal particulate (particularly, metal nanoparticle) can be easily and efficiently formed at high reducibility. SOLUTION: The composition is composed of: a polysilane compound; and a metal compound (e.g., a noble metal compound) capable of forming the metal particulate by reduction. The polysilane compound may be a copolymer of polysilane and a vinyl monomer comprising a unit having affinity for the metal compound and/or metal particulate. The ratio of the metal compound may be, e.g., about 1 to 40 pts.wt. to 100 pts.wt. of the polysilane compound. By allowing active energy rays to act on the composition, the polysilane compound is decomposed, thus the metal particulate (particularly, nanoparticle) can be formed. The method can be applied to various methods, and, e.g., it is also possible that the composition is applied to a substrate, so as to be exposed to form metal particulate, and further, development is performed, thus a metal particulate-containing pattern is formed. COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:提供可以以高还原性容易且有效地形成金属颗粒(特别是金属纳米颗粒)的组合物。 该组合物由聚硅烷化合物组成; 以及能够通过还原形成金属颗粒的金属化合物(例如,贵金属化合物)。 聚硅烷化合物可以是聚硅烷和乙烯基单体的共聚物,其包含对金属化合物和/或金属颗粒具有亲和性的单元。 金属化合物的比例可以是例如约1至40重量份。 到100磅 的聚硅烷化合物。 通过允许活性能量射线作用于组合物,聚硅烷化合物被分解,因此可以形成金属颗粒(特别是纳米颗粒)。 该方法可以应用于各种方法,例如,也可以将组合物施加到基材上,以暴露于形成金属颗粒,进一步进行显影,从而形成含金属颗粒的图案 形成了。 版权所有(C)2006,JPO&NCIPI
    • 10. 发明专利
    • Photo-polymerizable resin composition and its cured product
    • 光聚合树脂组合物及其固化产品
    • JP2005314692A
    • 2005-11-10
    • JP2005104051
    • 2005-03-31
    • Osaka CityOsaka Gas Co Ltd大阪市大阪瓦斯株式会社
    • MURASE HIROAKIKAWASAKI SHINICHIFUJIKI TAKESHIYAMADA MITSUAKIMATSUKAWA KOYOMATSUURA YUKITOMOTOKAWA TAKUYA
    • C08G59/24
    • PROBLEM TO BE SOLVED: To provide a photo-polymerizable resin composition which has high adhesiveness to substrates and can produce cured products having excellent mechanical characteristics (hardness, heat resistance, and the like) and excellent optical characteristics such as high transparency and a high refractive index. SOLUTION: This photo-polymerizable resin composition comprises a fluorene skeleton-having epoxy resin [for example, a 9,9-bis(monohydroxyphenyl)fluorene diglycidyl ether, a 9,9-bis(monohydroxyphenyl)fluorene 2-4C alkylene oxide diglycidyl ether, or the like], an alkoxysilane and a photo acid generator. The alkoxysilane may be an aryltrialkoxysilane, an epoxy group-having trialkoxysilane, a tetraalkoxysilane, an alkoxysilane condensation product, or the like. COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:提供一种对基材具有高粘合性并且可以生产具有优异的机械特性(硬度,耐热性等)的固化产物和优异的光学特性(如高透明度和高透光性)的光聚合性树脂组合物, 高折射率。 解决方案:该可光聚合树脂组合物包含具有芴骨架的环氧树脂[例如9,9-双(一羟基苯基)芴二缩水甘油醚,9,9-双(一羟基苯基)芴2-4C亚烷基 氧化二缩水甘油醚等],烷氧基硅烷和光酸发生剂。 烷氧基硅烷可以是芳基三烷氧基硅烷,具有三烷氧基硅烷的环氧基,四烷氧基硅烷,烷氧基硅烷缩合产物等。 版权所有(C)2006,JPO&NCIPI