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    • 5. 发明专利
    • THIN MULTIPOLAR CONNECTOR
    • JP2001023736A
    • 2001-01-26
    • JP19331399
    • 1999-07-07
    • HOSIDEN CORP
    • MATSUMOTO KOJISAKAGUCHI SHINYANISHIYAMA HIDEKI
    • H01R24/00H01R13/46H01R12/16
    • PROBLEM TO BE SOLVED: To reduce a mounting space by making it easy to achieve further thinning and compacting of a thin multipolar connector comprising a combination of a jack and a plug and to promote thinning of a card fitted with the plug and compacting of its entire shape. SOLUTION: A plug P has a plurality of hole parts 31 in an armature retaining part 3 in the form of a rectangular flat plate, the hole parts 31 individually retaining a plurality of plug side armatures. A group of jack side armatures 2 are held against the base 1 of a jack J. The group of jack side armatures 2 is exposed to one side along the height direction Y of the jack J. A covering wall part 27 is provided on the other side of the group of jack side armatures 2 along the height direction Y1. A mating piece part 34 and a slide groove part 22 are provided respectively in the armature retaining part 3 and the base 1. A recessed streak 28 and a projecting rib 33 are provided respectively on the covering wall part 27 and the armature retaining part 3.
    • 6. 发明专利
    • DIRECTIONAL KEY MECHANISM
    • JPH09147683A
    • 1997-06-06
    • JP32362095
    • 1995-11-17
    • HOSIDEN CORP
    • SAKAGUCHI SHINYA
    • H01H25/04
    • PROBLEM TO BE SOLVED: To withstand the excessive force, and to prevent the generation of shrinkage by projecting a boss, which supports a key top at a central part of the back surface through a through hole of a board, in the condition that plural ribs are radially arranged in the boss with a plan view. SOLUTION: In a directional key mechanism A, a board 300 formed with a conductive member 400 and an electrode 320, which contact with each other with the tilting operation of a key top 100, is built in a main body 200 formed of an upper housing 210 having an opening 211, to which the key top 100 to be pushed for tilting is faced, and a lower housing 220 corresponding to the upper housing 210. A boss 222 for supporting the key top 100 through a through hole 310 of the board 300 at a central part of the back surface side is formed in the lower housing 220 by projecting the boss 222. Since plural ribs 222A are radially arranged in the boss 222 with a plane view, even in the case where the excessive force is applied to the key top 100, breakdown of the board 300 is prevented, and at the time of forming the boss, generation of shrinkage or the like is prevented.
    • 7. 发明专利
    • Mold apparatus for injection molding and injection molding method
    • 注塑成型和注塑成型方法的模具
    • JP2011152723A
    • 2011-08-11
    • JP2010016105
    • 2010-01-28
    • Hosiden Corpホシデン株式会社
    • ISHIZU SEIICHISAKAGUCHI SHINYACHIN SHINSO
    • B29C45/40
    • PROBLEM TO BE SOLVED: To provide a mold apparatus for injection molding and a molding method which reduce the possibility of occurrence of poor appearances in the periphery of hard-to-release parts during releasing the hard-to-release parts of an injection molding.
      SOLUTION: The mold apparatus includes a movable-side template 110b having a through-hole 113b and an outer concave portion 115b corresponding to the outside of the outer wall of a tubular portion 11 formed in the peripheral edge of the through-hole 113b, a fixed-side template 110a combined with the movable-side template 110b so as to form a cavity C, with the through-hole 113b communicating with between the movable-side template 110b and the cavity C, a movable insert 130b inserted into the through-hole 113b in a freely movable way and having, at the tip, an inner concave portion 131b corresponding to the inside of the outer wall of the tubular portion 11, a clamping device 400 positioning and fixing the movable insert with the outer concave portion 115b and an inner concave portion 131b in a combined state and a coil spring 140b releasing the movable insert 130b from the inside of the outer wall of the tubular portion 11 when the positioning and fixing operation is released.
      COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:提供一种用于注射成型的模具装置和模制方法,其在释放难以释放的部件期间减少在难以释放的部件周围出现差的外观的可能性 注塑成型。 解决方案:模具装置包括可移动侧模板110b,其具有通孔113b和对应于形成在通孔的周缘中的管状部分11的外壁的外侧的外凹部115b 113b,与可动侧模板110b组合以形成空腔C的固定侧模板110a,其中通孔113b与可移动侧模板110b和空腔C连通;可插入的插入件130b 贯通孔113b以可自由移动的方式具有与管状部分11的外壁相对应的内凹部分131b的夹紧装置400,该夹紧装置400将可移动插入件与外凹部 部分115b和组合状态的内凹部131b以及当定位和固定操作被释放时将可动插入件130b从管状部分11的外壁的内部释放的螺旋弹簧140b。 版权所有(C)2011,JPO&INPIT
    • 9. 发明专利
    • ELECTRONIC PART COOLING SYSTEM
    • JPH08148614A
    • 1996-06-07
    • JP31576694
    • 1994-11-24
    • HOSIDEN CORP
    • SAKAGUCHI SHINYA
    • H05K7/20H01L23/32H01L23/467H01R33/76
    • PURPOSE: To simplify assembling operation by providing a socket for an electronic part on which an IC is mounted and also providing a cooling unit connected to the socket to eliminate a lead wire for the power supply of a cooling unit, which requires its wiring. CONSTITUTION: This electronic part cooling system is provided with a socket 100 for an electronic part on which an IC 610 being an electronic part is mounted, a heat sink 300 on which the socket 100 for an electronic part is mounted and a fan 200 being a cooling unit on which the heat sink 300 is mounted. The socket 100 for an electronic part is provided with a body 110 having insulation property and a contact 120 for an electronic part provided in the body 110 in accordance with the lead part of the IC and also provided with a contact 130 for a cooling unit provided in the body 110 in accordance with the connecting pin 210 of the fan 200. Thereby, this electronic part cooling system dispenses with the wiring of a lead wire and eliminates its design and at the same time can contribute the miniaturization of electronic equipment.