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1. 发明专利

JPS60165267A MANUFACTURE OF THERMAL HEAD 失效
公开(公告)号：JPS60165267A
公开(公告)日：1985-08-28
申请号：JP2050584
申请日：1984-02-07
申请人： OKI ELECTRIC IND CO LTD , NIPPON TELEGRAPH & TELEPHONE
发明人： ARAKI KENICHI , SHIBATA SUSUMU , NIHEI MASAYUKI , SUZUKI TOSHIO
IPC分类号： H01L49/00 , B41J2/335 , H01L49/02
摘要： PURPOSE:To prevent a sharp oxidization at the contact part between an Au layer and Zr-N thin film by keeping this part from directly contacting an oxidizing atmosphere in a thermal treatment for thermal head having the Zr-N thin film as a heat generating body and the Au layer as a conductive layer. CONSTITUTION:A high temperature thermal treatment is implemented in such a manner that at least the direct contact part between an Au layer 4 and a Zr-N resistor thin film 2 is kept from directly contacting an oxidizing atmosphere. In order words, the atmosphere at the high temperature thermal treatment is made non-oxidizing, for example, vacuum, an inert gas such as Ar or a reducing gas such as H2. With such an arrangement, since the contact part between the Au layer 4 and the Zr-N thin layer 2 will not contact the oxidizing atmosphere, no sharp oxidization occurs at this part at all during the thermal treatment thereby eliminating poor conduction as in the past. This enables a stable manufacture of a thermal head using the Zr-N thin film as a resistor, namely, a heat generating body with a high yield.

2. 发明专利

JPS60225314A METHOD OF FORMING ZR-O TRANSPARENT FILM 失效
公开(公告)号：JPS60225314A
公开(公告)日：1985-11-09
申请号：JP8123784
申请日：1984-04-24
申请人： OKI ELECTRIC IND CO LTD , NIPPON TELEGRAPH & TELEPHONE
发明人： ARAKI KENICHI , SHIBATA SUSUMU , NIHEI MASAYUKI , SUZUKI TOSHIO
IPC分类号： H01B19/00 , B41J2/335 , C23C14/04 , C23C14/06 , C23C14/58 , H01B17/62 , H01L21/31 , H01L21/316

3. 发明专利

JPS60165265A THERMAL HEAD 失效
公开(公告)号：JPS60165265A
公开(公告)日：1985-08-28
申请号：JP2050684
申请日：1984-02-07
申请人： OKI ELECTRIC IND CO LTD , NIPPON TELEGRAPH & TELEPHONE
发明人： ARAKI KENICHI , SHIBATA SUSUMU , NIHEI MASAYUKI , NOZAWA TOSHINORI
IPC分类号： H01L49/00 , B41J2/335 , H01L49/02
摘要： PURPOSE:To enable the manufacture simply with a greater yield by arranging a conductive layer in an Al single-layer structure or a multi-layer structure comprising an Al single layer and a conductive ground layer in a thermal head having a heat generating body made of a Zr-N thin film and a conductive layer. CONSTITUTION:This thermal head has a single-layer structure of an Al single layer 8 as a conductive layer electrically contacting a heat generating body 2, being a Zr-N resistor thin film. Because of such a layer structure of the thermal head, there is no Au layer such as electrically contacting the Zr-N resistor thin film 2, hence causing no sharp oxidation at the contact part between the Al layer and the resistor thin layer 2 during the high temperature heat treatment. Thus, this contact part will not be electrically defective in the conduction thereby providing a thermal head with a required conductive characteristic along with a greater yield in the manufacture.

4. 发明专利

JPH0318834B2 失效
公开(公告)号：JPH0318834B2
公开(公告)日：1991-03-13
申请号：JP12368484
申请日：1984-06-18
申请人： OKI ELECTRIC IND CO LTD
发明人： KANAMORI TAKASHI , SAWAI HIDEO , SHIBATA SUSUMU , NIHEI MASAYUKI
IPC分类号： H01L49/00 , B41J2/335 , H01L49/02

5. 发明专利

JPH037750B2 失效
公开(公告)号：JPH037750B2
公开(公告)日：1991-02-04
申请号：JP19780882
申请日：1982-11-12
申请人： OKI ELECTRIC IND CO LTD
发明人： SHIBATA ISAO , IGUCHI YASUO , NIHEI MASAYUKI , OONO SEIGO
IPC分类号： C22F1/18

6. 发明专利

JPS6346146B2 失效
公开(公告)号：JPS6346146B2
公开(公告)日：1988-09-13
申请号：JP49880
申请日：1980-01-09
申请人： OKI ELECTRIC IND CO LTD
发明人： SHIBATA ISAO , OONO SEIGO , NIHEI MASAYUKI
IPC分类号： C23C14/06 , C21D6/00 , C23C14/00 , C23C14/02 , C23F17/00

7. 发明专利

JPS613758A THERMAL HEAD 失效
公开(公告)号：JPS613758A
公开(公告)日：1986-01-09
申请号：JP12368484
申请日：1984-06-18
申请人： OKI ELECTRIC IND CO LTD
发明人： KANAMORI TAKASHI , SAWAI HIDEO , SHIBATA SUSUMU , NIHEI MASAYUKI
IPC分类号： H01L49/00 , B41J2/335 , H01L49/02
摘要： PURPOSE:To improve the tightness between a heating resistor layer and a wearresistant layer by constituting the protective film for a heating resistor layer of two layers, one of which is a tight bond layer composed of a heat-resisting organic resin and the other is a wear-resistant layer. CONSTITUTION:In a thermal head a protective film is constituted of two layers one of which is a tight bond layer 4 composed of heat-resisting organic resin or a filler-inclusive heat-resisting organic resin and the other is a wear-resistant layer 5 fromed by spattering or vapor-coating one of Ta2O5, SiC and Si3N4. For a tight bond layer 4 is used one of the heat-resisting organic resins, such as polyimide resin, polyimide dielectric and epoxy resin. According to the constitution of the above-mentioned protective film the tight bond layer not only improves the tightness between a heating resistor layer 2 and a wear-resistant layer 5 but also upgrades the voltage resistance and the continuous printing life imparting adverse effect to a printing characteristic.

8. 发明专利

JPS55100241A METAL OXIDE FILM ETCHING METHOD 失效
公开(公告)号：JPS55100241A
公开(公告)日：1980-07-31
申请号：JP338479
申请日：1979-01-18
申请人： OKI ELECTRIC IND CO LTD
发明人： SAWAI HIDEO , ARAO YOSHINORI , KANAMORI TAKASHI , NIHEI MASAYUKI
IPC分类号： C01B13/14 , C03C17/23
摘要： PURPOSE:To safely perform etching of a metal oxide film at a high and stable etching speed while reducing contamination of an etching soln. and improving accuracy and uniformity by applying hydrogen generated by electrolysis to metal oxide on the surface of a substrate. CONSTITUTION:Metal oxide on the surface of a substrate such as glass is etched with hydrogen generated by electrolysis. For example, 6H HCl as an etching soln., a carbon anode and a platinum cathode are used. The temp. of the soln. is adjusted to 40 deg.C, and etching time to 10sec. The cathode and the sample to be etched are pref. made equal in size so that hydrogen generated from the cathode is uniformly applied to the sample.

9. 发明专利

JPS6013566A THERMAL HEAD 失效
公开(公告)号：JPS6013566A
公开(公告)日：1985-01-24
申请号：JP12108783
申请日：1983-07-05
申请人： OKI ELECTRIC IND CO LTD
发明人： KANAMORI TAKASHI , SHIBATA SUSUMU , SAWAI HIDEO , NIHEI MASAYUKI
IPC分类号： H01C7/00 , B41J2/335 , H01L49/00 , B41J3/20
摘要： PURPOSE:To contrive to prolong the life of a thermal head, by forming the protective film of a heat generating layer from two predetermined layers consisting of an oxidation resistant layer and an anti-wear layer. CONSTITUTION:A protective film covering the heat generator 2 of a thermal head is formed of two layers consisting of an oxidation resistant layer 6 comprising a polyimide resin or a polyimide resin containing a filler such as SiC and an anti-wear layer 7 comprising an epoxy resin containing a filler such as CrO3 or SiC. The layer 6 comprising the same polyimide resin as a base board well follows the expansion and contraction of the heat generator 2 and prevented from rupture due to stress to effectively prevent the oxidation of said heat generator 2 while anti-wear property is enhanced by the layer 7 using the hard filler-containing epoxy resin to make it possible to attain to prolong the life of the thermal head.

10. 发明专利

JPS57185173A THERMAL HEAD 失效
公开(公告)号：JPS57185173A
公开(公告)日：1982-11-15
申请号：JP6931581
申请日：1981-05-11
申请人： OKI ELECTRIC IND CO LTD
发明人： SAWAI HIDEO , KANAMORI TAKASHI , NAKAZAWA HITOSHI , NIHEI MASAYUKI
IPC分类号： B41J2/335
摘要： PURPOSE:To improve the transfer rate of heat to thermal paper by using a system in which a polyimide film insulation plate is laminated on a cooling plate having a convexed portion in its portion touched by the thermal paper in such a way as to project the convexed portion on the surface of the thermal head. CONSTITUTION:A polyimide film insulation base plate 7 and a resistor heating body 8 are orderly provided on the surface of a cooling plate 6 made of aluminum plate, etc., having a convexed portion in its portion touched by a thermal paper, having excellent corrosion reistance and excellent heat conductivity. The resistor heating body 8 is made of a electroless Ni-based alloy plating, e.g., of Ni-P, Ni-B, Ni-W-P alloys. A power supplying body 9 for the resitor heating body 8 is formed by crystallizing out Ni, Cu, or Au by electrolytic method, and covered with a wear-resistant layer 10 formed by an alumina-based coating agent serving to prevent the oxidation of the heating body 8.

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