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JP2009139474A Optical waveguide circuit chip 有权
标题翻译：光波导电路芯片
公开(公告)号：JP2009139474A
公开(公告)日：2009-06-25
申请号：JP2007313508
申请日：2007-12-04
申请人： Ntt Electornics Corp , Nttエレクトロニクス株式会社
发明人： SHIMIZU KAZUMI , OKUNO MASAYUKI , MIZUKOSHI HIROMI , SHIBAZAKI TOMOYO
IPC分类号： G02B6/122
摘要： PROBLEM TO BE SOLVED: To provide an optical waveguide circuit chip which has high mechanical strength in a chip end face by suppressing a warp around the chip end face while maintaining optical characteristics of an optical circuit, with a warp left in a part of the optical circuit, among warps due to difference in a thermal expansion coefficient between a substrate and a pattern layer, for the purpose of solving the following problems of a conventional optical waveguide circuit chip: cracks and fragments are likely to occur in a waveguide part or its end face when a reinforcement plate for thickness adjustment is stuck on the chip, causing a problem in mechanical strength; and since warp is forcedly suppressed by vacuum suction, a stress is imparted to the optical waveguide, which is apt to affect optical characteristics such as a transmission wavelength band or polarization dependency of an optical waveguide circuit. SOLUTION: The optical waveguide circuit chip is characterized in that a groove is formed from an upper clad film to a substrate along the waveguide of an optical input/output waveguide circuit. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种在芯片端面具有高机械强度的光波导电路芯片，通过抑制芯片端面周围的翘曲，同时保持光电路的光学特性，其中经线留在部分由于基板和图案层之间的热膨胀系数的差异，在经线中，为了解决传统的光波导电路芯片的以下问题：在波导部分中可能发生裂纹和碎片或者当用于厚度调整的加强板粘在芯片上时，其端面产生机械强度问题; 并且由于通过真空抽吸强制地抑制翘曲，所以对光波导施加应力，这容易影响诸如光波导电路的透射波长带或偏振依赖性的光学特性。解决方案：光波导电路芯片的特征在于，沿着光输入/输出波导电路的波导从上包层膜到基板形成沟槽。版权所有（C）2009，JPO＆INPIT

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